JPH0810203Y2 - Heat dissipation clamp device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a heat dissipation clamp device for attaching an electronic component that particularly generates heat, such as a power transistor, to a cooling heat dissipation member.

(Conventional technology and its disadvantages)

Conventionally, electronic components such as power transistors are mounted on a circuit board as required, and heat dissipation processing is performed by a heat dissipation member formed of a material having a low specific heat such as aluminum.

FIG. 4 is a cross-sectional view showing a first conventional example of this heat dissipation device, 2 is a power transistor, 3 is a heat dissipation plate, 4 is a circuit board, 6 is an insulating member, 7 is a nut, and 8 is a screw. .

In FIG. 4, the power transistor 2, the insulating member 6 which may be, for example, a resin sheet, and the heat dissipation member 3 are overlapped with each other, and the mounting hole 2b of the power transistor 2 and the insertion hole 6a of the insulating member 6 are stacked.
The screw 8 and the insertion hole 3a of the heat dissipation member 3 are inserted through the screw 8, and the screw 8 and the nut 7 are screwed together. As a result, the power transistor 2 is brought into close contact with the heat dissipation member 3 via the insulating member 6,
The heat generated in the power transistor 2 is radiated from the heat radiation member 3.

According to this configuration, the screw 8 and the nut 7 are required to attach the power transistor 2 to the heat dissipation member 3, and the insulating member 6 and the heat dissipation member 3 require predetermined screw insertion holes, which complicates the configuration. Besides, it is troublesome to install.

 FIG. 5 shows a cross-sectional view of a second conventional heat dissipation device.

In FIG. 5, reference numeral 9 is a clamp member, and the other members have the same structure as shown in FIG. 4, and are designated by the same reference numerals. The clamp member 9 is an elastic plate that is bent and formed in a substantially U shape, and holds the power transistor 2, the insulating member 6, and the heat radiating member 3 integrally by elastically urging the clamp member 9.

According to this structure, compared with the first conventional example, members such as screws and nuts and holes for inserting the screws are not required, and the structure is simple and the mounting is easy.

However, as is clear from FIG. 5, the clamp member 9 only clamps the power transistor 2, the insulating member 6, and the heat dissipation member 3 in one direction, that is, in the lower direction of the drawing. Therefore, when some external force acting in the upward direction of the drawing, such as vibration or shock, is applied, there is a problem that the insulating member 6 falls off to cause insulation failure, or the clamp member 9 comes off to deteriorate the heat radiation function. is there.

〔Purpose〕

The present invention has been made in view of the above facts, and an object of the present invention is to easily mount particularly heat-generating electronic components such as a power transistor without requiring an extra component in a cooling radiating member. It is an object of the present invention to provide a heat dissipation clamp device that can be reliably and reliably attached.

[Summary of Invention]

According to the present invention, an elastic holding member having a substantially S-shape and having holding portions at both ends is provided, one of the holding portions elastically sandwiches the heat-generating electronic component, and the other holding portion radiates heat. There is provided a heat dissipation clamp device characterized by elastically sandwiching a member.

In such a heat dissipation clamp device, the elastic holding member is substantially S.
In the shape of a letter, one holding portion holds a heat-generating electronic component such as a power transistor, and the other holding portion holds a heat dissipation member,
Therefore, the heat generating electronic component and the heat radiating member are connected by the elastic holding member, and the heat generated from the heat generating electronic component is transferred to the heat radiating member via the elastic holding member and radiated.

Even if a force acting in a direction away from the heat-generating electronic component (or heat-dissipating member) acts due to vibration or impact, the heat-dissipating member (or heat-dissipating electronic component) located on the opposite side abuts a part of the elastic holding member to prevent its movement This prevents the elastic holding member from being separated from the heat generating electronic component (or the heat radiating member).

Further, it is preferable that at least a part of one surface of the elastic holding member is covered with an electrically insulating material. With this structure, the electrically insulating material is interposed between the elastic holding member and the heat-generating electronic component, and it is not necessary to interpose a separate insulating member, so that the mounting work is further facilitated.

〔Example〕

Hereinafter, an embodiment of a heat dissipation clamp device according to the present invention will be described with reference to the accompanying drawings.

1 to 3 show an embodiment of the present invention, FIG. 1 is a perspective view showing an elastic holding member of a heat dissipation clamp device, FIG. 2 is a sectional view of the heat dissipation clamp device, and FIG. It is the perspective view which decomposed | disassembled and showed FIG. 2 to the up-down direction.

In FIGS. 1 to 3, 1 is an elastic holding member, 2 is a power transistor as a heat-generating electronic component, 3 is a heat dissipation member made of aluminum, 4 is a circuit board, and 5 is a fixing screw.

In FIG. 1, the clamp member 1 can be formed, for example, by bending an elastic steel plate into a substantially S-shape, and in the embodiment, one surface (the lower surface in FIGS. 1 to 3) is made of resin. Is coated with. This resin coating insulates between the power transistor 2 and the elastic holding member 1, and may be applied only to a specific portion (a portion in contact with the power transistor 2) on one surface thereof.

2 and 3, one end of the elastic holding member 1 is provided with one holding portion 1b for the heat dissipation member 3, and the other end is provided with the other holding portion 1b for the power transistor 2. A holding portion 1a is provided. The elastic holding member 1 includes a main body portion 1c extending linearly and a substantially L-shaped portion from one end of the main body portion 1c.
It has one end side bent portion 1d extending in a letter shape and the other end side bent portion 1e extending in a substantially L shape from the other end of the body portion 1c.
1c and the bent portion 1d constitute one holding portion 1b that opens upward in FIGS. 1 to 3, and the main body portion 1c and the other bent portion 1e.
Constitutes the other holding portion 1a which opens downward in FIGS. 1 to 3. As can be seen from FIGS. 2 and 3, the power transistor 2 includes a body portion 1c and a bent portion from below.
The holding portion 1a is inserted between the power transistor 2 and 1e, and elastically holds the power transistor 2 by the holding portion 1a. Further, the heat dissipation member 3 is inserted from above between the main body portion 1c and the bent portion 1d, and the holding portion 1b elastically clamps the heat dissipation member 3.

The lead 2a of the power transistor 2 is inserted into the circuit board 4 and fixed to it by soldering. Further, the heat dissipation member 3 is provided with screws 5 on the circuit board 4.
Installed by.

In the clamp device having the above-described configuration, since the elastic holding member 1 holds the heat radiating member 3 and the power transistor 2, the heat generated in the power transistor 2 is transferred to the heat radiating member 3 via the elastic holding member 1. It conducts heat and radiates heat.

Therefore, the substantially S-shaped elastic holding member 1 can easily connect the power transistor 2 and the heat radiating member 3 to conduct heat.

In FIG. 2, when a force that pushes down (or pushes down) acts on the elastic member 1 in the downward direction (or the upward direction), for example, on the inner surface of the holding portion 1a (or 1b) of the elastic holding member 1,
The power transistor 2 (or the heat dissipating member 3) comes into contact with the power transistor 2 so that the elastic holding member 1 is prevented from moving and the elastic holding member 1 is reliably prevented from coming off.

Further, since the elastic holding member 1 is resin-coated on one side thereof, it also functions as an insulating inclusion between the power transistor 2 and the heat radiating member 3, and there is no need to insert a dedicated insulating member or the like as in the conventional case.

The embodiment of the heat dissipation clamp device according to the present invention has been described above, but the present invention is not limited to this.
Various changes and modifications can be made without departing from the spirit of the invention.
For example, the width dimension, the wall thickness dimension, the material of the elastic holding member, the number of power transistors as heat generating electronic components, the fixing dimension, the size of the heat radiating member, the fixing method, and the like are arbitrary.

Further, although the description has been made by applying it to the power transistor as the heat generating electronic component, the present invention can be similarly applied to other heat generating electronic components such as FET, thyristor and triac.

Further, in the specific example, the elastic holding member is coated on one side with a resin, but instead of this, an insulating sheet member may be interposed as in the conventional case.

[Effect of device]

Since the present invention has the above-mentioned configuration, it has the following effects.

First, the heat-generating electronic component and the heat-dissipating member can be easily held integrally, and the components required for mounting are not required. As a result, it is possible to obtain a heat dissipation clamp device that can reduce the cost of parts and the number of steps.

Secondly, once the heat generating electronic component and the heat radiating member are fixed, a highly reliable heat radiating clamp device which does not easily come off even when a force such as vibration or shock acts.

[Brief description of drawings]

FIG. 1 is a perspective view showing an elastic holding member of an embodiment according to the present invention. FIG. 2 is a sectional view showing a heat radiating clamp device according to an embodiment of the present invention. FIG. 3 is an exploded perspective view showing the heat dissipation clamp device of FIG. 2 in an exploded manner. FIG. 4 is a sectional view showing a conventional heat dissipation device. FIG. 5 is a cross-sectional view showing another conventional heat dissipation device. 1 ... Elastic holding members 1a and 1b ... Holding part 2 ... Power transistor 3 ... Heat dissipation member 4 ... Circuit board 5 ... Mounting screw

Claims (2)

[Scope of utility model registration request] 1. An elastic holding member having a substantially S-shape and having holding portions at both ends, one holding portion elastically sandwiches a heat-generating electronic component, and the other holding portion radiates a heat. A heat-dissipating clamp device characterized in that it elastically clamps. 2. The heat radiating clamp device according to claim 1, wherein at least a part of one surface of the elastic holding member is covered with an electrically insulating material.