JP2002111250A - Fixing spacer and air conditioner using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix a connection point of a module mounted loose from a printed substrate not only by soldering of a lead part of a module but also by fixing over a wide range excepting a solder connection part. SOLUTION: A module 121 mounted loose from a printed substrate 111 is mounted with a fixing spacer 141 held between the printed substrate 111 and the module 121. Therefore, even if a heat sink 131 of the module 121 is mounted, the module 121 can be supported not only in a solder contact of a lead of the module 121 but also by the fixing spacer 141, thus reducing a load on a solder contact and reducing a solder crack.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a printed circuit board on which a module is mounted, and an air conditioner using the printed circuit board.

[0002]

2. Description of the Related Art In general, a power supply circuit of an electric product has a complicated circuit configuration and a large printed circuit board. For example, when the size and the like are limited in installation such as an outdoor unit of an air conditioner, the printed circuit is printed. Some contrivance was required for storing the substrate.

Further, such a power supply circuit emits a large amount of heat, and it is necessary to provide a heat radiating plate for radiating heat so as not to be affected by the heat.

Further, in an outdoor unit of an air conditioner, a module is mounted on a printed board in order to improve mounting efficiency.

[0005] Since this module generates a large amount of heat, a heat radiating plate is required, a very large space is required, and the volume is large.

The prior art will be described with reference to FIG. FIG. 4 is an assembly diagram of a connection between a printed circuit board, a module, and a heat sink in a conventional example.

In the prior art, when a module 2 is mounted on a printed circuit board 1 and a large-volume heat radiating plate 3 for improving heat radiation efficiency is mounted for the purpose of radiating the module 2, the module 2 and the module 2 are connected to each other. The radiator plate 3 is fixed from below by screws 5 through through holes 4 provided in the printed circuit board 1. Further, the printed circuit board 1 and the module 2 are fixed by connecting the lead portions 6 of the module 2 to the printed circuit board. 1 and only connected by soldering.

In addition, there are cases where two or more modules need to be mounted floating on a printed circuit board for the purpose of improving the mounting efficiency due to space restrictions. In such a case, since each module has a different shape. In addition, the height of the module from the end surface of the printed circuit board is not always the same.

[0009]

However, in the above-described conventional structure, the fixed point between the printed board and the integrated product of the module and the radiator plate is only the fixed point by the solder around the through hole of the module and the printed board. Therefore, when fixing a module integrated with a large and heavy heat sink to a printed circuit board, the weight applied to the connection part by solder becomes extremely large, and solder cracks are likely to occur. Had.

[0010] In addition, 2 floating from the printed circuit board
When mounting more than one module on a printed circuit board, the height of the module from the end face of the module differs due to the different shape of each module, and multiple heat sinks are needed to dissipate heat from each module. If the number of heat sinks is reduced in consideration of mounting efficiency or the like, the shape of the heat sink becomes complicated inevitably.

In addition, especially in the outdoor unit of the air conditioner, since the outdoor unit itself of the air conditioner vibrates due to continuous or intermittent vibration of the compressor, the fan, etc., the relatively heavy radiator plate is shaken. As a result, a larger stress is applied to the heat sink, and a larger vibration is transmitted to the solder portion which is a connection portion with the printed circuit board, which is a major cause of solder cracks.

Accordingly, the present invention realizes prevention of solder cracks by performing fixing over a wide area other than the solder connection portion between the module and the printed circuit board.

Further, by arbitrarily adjusting the height of the module floating above the printed board from the end face of the board, the shape of the heat radiating plate can be simplified and the number of steps can be reduced.

[0014]

SUMMARY OF THE INVENTION According to the present invention, when a module to be mounted on a printed circuit board by floating from the printed circuit board is installed, both members are fixed between the printed circuit board and the module and further fixed by screws. (Fixed spacers).

Further, according to the present invention, when a plurality of modules are mounted floating on a printed board, the height of each module from the end face of the board can be adjusted to an arbitrary height. (Fixed spacer).

Further, according to the present invention, especially when there is continuous vibration, such as an outdoor unit of an air conditioner, the components mounted floating from the printed circuit board can be further strengthened and supported. A member (fixed spacer) is mounted between a printed board and a module.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention provides a printed circuit board, a module mounted on the printed circuit board by floating, a heat sink mounted on the module, and a plate-shaped fixing sandwiched between the module and the printed circuit board. It is composed of spacers.

Further, screw holes for passing screws are provided in the printed circuit board, the module, the heat radiating plate, and the fixing spacer, respectively, so that the screws can be fixed by passing the screws from the printed circuit board side. Is what you do.

Further, according to the present invention, when there are a plurality of modules to be mounted floating above a printed circuit board, a plate-shaped fixing spacer is inserted between the printed circuit boards and the modules, whereby a printed circuit board of each of the modules is inserted. The structure is such that the height from the end face is equal.

Further, the screws are provided with a spring washer to perform solder dip so that the screws do not become loose even if the fixing spacers and the like slightly shrink. Further, by performing an annealing process in which the fixing spacer is heat-treated in advance, it is possible to reduce the heat shrinkage at the time of solder dipping.

Further, the present invention particularly relates to an outdoor unit of an air conditioner, in which a plate-shaped fixed spacer is inserted between a module mounted on a printed board and the printed board, and the module is fixed to the module by the plate-shaped fixed spacer. The printed circuit board is fixed.

[0022]

(Embodiment 1) A first embodiment of the present invention will be described with reference to FIG.

FIG. 1A is a side view of the structure of a printed circuit board, wherein 111 is a printed circuit board, 121 is a module mounted on the component side of the printed circuit board 111, 131
Is a heat sink, and 141 is a plate-shaped fixed spacer inserted between the module 121 and the printed board 111. The fixed spacer 141 is mounted on the printed circuit board 11.
1 and the module 121.

FIG. 1B is a top view of the fixed spacer 141, and FIG.
FIG.

The fixed spacer 141 has a through hole 181.
At both ends, and the printed circuit board 1
Claws 151 are provided at two positions on both ends for hooking on the hooks 11. The fixed spacer 141 can be temporarily fixed by hooking the claw 151 on the printed circuit board 111, and the positioning of the fixed spacer 141 can be performed. Accordingly, the screw 161 can be positioned so as to easily penetrate the through hole 181 from above.

Further, after fixing the heat sink 131 with the screw 161 so as to be in close contact with the module 121,
Soldering the lead portion 17 of the module 121
1. The heat sink 131 is integrated. Since the screw 161 is provided with a spring washer 191, the screw 161 is not loosened even if the fixing spacer 141 and the like are slightly contracted by performing solder dip. Furthermore, since the fixed spacer 141 has been subjected to an annealing process, thermal shrinkage during solder dipping can be reduced.

Accordingly, when vibration or impact is applied to the heat sink 131 or the like, not only the solder bonding surface of the printed board 111 and the lead portion 171 of the module 121 but also the printed board 111 and the module 121 The integrated product of the module 121 and the heat radiating plate 131 can be supported by the fixed spacer 141 interposed therebetween, and the stress applied to the solder bonding surface can be dispersed.

It is needless to say that the same effect can be obtained by integrally molding the module 121 and the fixed spacer 141.

(Embodiment 2) A second embodiment of the present invention will be described with reference to FIG. The description of the same contents as in the first embodiment is omitted.

FIG. 2 is a diagram showing a state in which a heat sink is mounted on a printed circuit board as viewed from a side. 211 is a printed circuit board; 221 and 231 are modules A having different shapes; modules B and 241 are fixed spacers sandwiched between the printed circuit board 211 and the module B 231; 251 is a heat sink; 261 is the module A 221
And a screw 271 for fixing the heat sink 251, and a screw 271 for fixing the printed board 211, the module B 231 and the heat sink 251. The printed circuit board 211, the fixed spacer 241, the module A221, and the module B231 have through holes, and the heat sink 251 has screw holes, which are fixed by the screws 261 and 271, respectively, as shown in FIG. Indicates a state in which each is fixed.

When mounting these components, the module B 231 and the printed board 211 are fixed with the fixed spacer 241 interposed therebetween, and the height of the module B 231 from the end face of the printed board 211 is made the same as that of the module A 221. And module A22 as described above.
1. The printed circuit board 211 is fixed and soldered.
Thereby, the height of the plurality of modules from the end surface of the printed circuit board can be made uniform.

When a plurality of modules are mounted on the printed circuit board 211, the fixing spacer 241 is inserted between the module B 231 and the printed circuit board 211, and the printed circuit board 211 of the plurality of modules is inserted.
By making the height from the end face uniform, the heat sink 2
By simplifying the shape of 51, heat can be radiated from a plurality of modules.

(Embodiment 3) A third embodiment of the present invention will be described with reference to FIGS. Since the description of FIG. 2 has been described above, the description is omitted here. Further, description of the same contents as those of the first embodiment and the second embodiment will be omitted.

FIG. 3 is a simplified diagram in which a printed circuit board is mounted on an outdoor unit main body of an air conditioner. 111 is a printed circuit board, 311 is an outdoor unit main body, 321 is an outdoor unit top plate, 331
Is an outdoor fan, and 341 is a compressor. The outdoor unit main body 311 vibrates continuously or intermittently as the outdoor fan 331 and the compressor 341 vibrate. Therefore, the printed circuit board 1
11 is continuously and intermittently loaded, and the heavier heat radiation plate integrated with the printed circuit board 111 also vibrates, but the fixed spacer 241 in FIG. 2 can absorb the vibration over a wide range. I can do it.

[0035]

According to the present invention, when mounting a module floating on a printed circuit board for reasons such as an improvement in mounting efficiency, the module is mounted on the printed circuit board with a plate-shaped fixing spacer interposed between the module and the printed circuit board. Accordingly, the integrated product of the module and the radiator plate can be supported not only by the solder bonding portion of the lead portion of the module but also by the entire plate-shaped fixing spacer. Therefore, even if a heavier heat sink or the like is mounted, the weight can be dispersed throughout the fixed spacer, and the weight applied to the solder bonding portion can be reduced, so that solder cracks can be significantly reduced. result,
Quality can be improved.

Further, the present invention is directed to a printed circuit board having a plurality of modules to be mounted floating from the printed circuit board. The height of the plurality of modules from the end face of the printed circuit board is determined by sandwiching a plate-shaped fixing spacer between the module and the printed board. Can be made uniform. Therefore, it is possible to reduce the number of parts mounting man-hours by using a plurality of heat radiating plates for heat radiation of the module, and to reduce the processing man-hours by complicating the shape of the heat radiating plate, thereby simplifying the shape of the heat radiating plate. . As a result, the number of manufacturing steps can be reduced and the cost can be suppressed.

Further, according to the present invention, the screws are provided with a spring washer to perform solder dip so that the screws are not loosened even if the fixing spacers are slightly shrunk. By performing the treatment, the heat shrinkage during solder dip is reduced, the loosening of the screw is reduced, and the heat radiation efficiency is improved. As a result, the quality can be ensured by realizing more reliable heat radiation processing.

Further, according to the present invention, particularly when mounted on an outdoor unit of an air conditioner, a continuous or intermittent vibration of an outdoor fan or a compressor causes a heavier radiator plate to vibrate, and the printed circuit board and the module are connected to each other. When a larger stress is applied to the solder bonding portion, the vibration can be absorbed by sandwiching the fixing spacer. As a result, stress applied to the solder bonding portion can be reduced, which is particularly effective in reducing solder cracks.

Further, according to the present invention, by inserting the fixing spacer between the module and the printed board, the height of the plurality of modules from the end face of the printed board can be made uniform. When heat is dissipated, heat can be dissipated with one heat sink, and the shape of the heat sink can be simplified, so that the number of processing steps for making a heat sink with a complicated shape can be reduced, and air conditioning This is particularly effective when the size is limited such as an outdoor unit of the machine.

[Brief description of the drawings]

1A is a side view of a printed circuit board configuration in a first embodiment. FIG. 1B is a top view of the fixed spacer. FIG. 1C is a side view of the fixed spacer.

FIG. 2 is a side view of a printed circuit board according to a second embodiment.

FIG. 3 is a simplified view of an outdoor unit of an air conditioner according to a third embodiment.

FIG. 4 is an explanatory view for assembling when a conventional electrical component is mounted away from a printed circuit board.

[Explanation of symbols]

 111, 211 Printed circuit board 121 Module 131, 251 Heat sink 141, 241 Fixed spacer 151 Fixed spacer claw 161 Screw with spring washer 171 Module lead part 181 Through hole 191 Spring washer 221 Module A 231 Module B 261 Module A fixing screw 271 Module B fixing screw 311 Outdoor unit main body 321 Outdoor unit top plate 331 Outdoor fan 341 Compressor

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yuji Tani 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 72) Inventor Gen Kobayashi 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term (reference) 4E353 AA06 AA16 AA17 BB05 BB07 CC01 CC04 CC12 CC13 CC32 CC36 DD02 DD05 DD11 DR03 DR08 DR13 DR17 DR27 DR29 DR49 GG09 GG16 5E322 AA01 AB01 AB02 AB04 AB07 5E336 AA01 AA13 CC10 DD22 DD28 DD32 EE02 EE12 GG03 GG10 GG16

Claims (5)

[Claims] 1. A printed circuit board, an electrical component (hereinafter referred to as a module) mounted on the printed circuit board, a metal for dissipating heat generated by the module (hereinafter referred to as a radiator plate), and a screw for fixing the module, A fixing spacer, which is inserted between the printed circuit board and the module in a plate-like shape and is provided with the claw, is fixed to the printed circuit board with the claw, and can further fix the printed circuit board and the module; . 2. A printed circuit board, comprising: a plurality of modules mounted on the printed circuit board; a module inserted between the printed circuit board and the module; and a height of the plurality of modules from an end surface of the printed circuit board. The fixing spacer characterized in that the surface is substantially uniform. 3. A spring for fixing a printed circuit board, an electrical component (hereinafter, referred to as a module) mounted on the printed circuit board, a metal for dissipating heat generated by the module (hereinafter referred to as a radiator plate), and the module. The fixing spacer according to claim 1 or 2, wherein the fixing spacer is provided with a washer. 4. The fixed spacer according to claim 1, wherein an annealing process is performed. 5. An air conditioner comprising the printed circuit board mounted on an outdoor unit of the air conditioner, wherein the fixed spacer according to claim 1 is used.