JPH0617305Y2 - Hybrid IC board fixed structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a hybrid IC substrate fixing structure for mounting and fixing a hybrid IC substrate.

[Prior Art] Conventionally, as a hybrid IC substrate fixing structure of this type, as shown in FIG. 3, the hybrid IC substrate 1 is directly fixed to a fixing base 2 by a screw 6, or as shown in FIG. The lead 7 attached to the board 1 is inserted into the through hole 9 of the printed board 8 and fixed by soldering, and then the printed board 1 is fixed. In addition, 5 in FIG. 3 is a washer.

[Problems to be Solved] Among the above-described conventional structures, in the structure in which the hybrid IC substrate is directly screwed, the tightening force of the screw is too strong with a normal tightening torque, and an excessive pressing force is partially applied. In addition, there is a problem that the hybrid IC substrate may be broken. On the contrary,
When the screw is tightened with a constant torque to reduce the pressing force, there is a risk that the screw may be loosened due to vibration or the like.

On the other hand, the fixing method using leads has a drawback that it is difficult to directly contact metal even if heat dissipation or grounding is required because it is fixed to the printed circuit board, or the leads themselves are thin plates and weak in strength as a support. was there.

[Means for Solving Problems] The present invention solves the above-mentioned drawbacks by fixing the hybrid IC substrate via a spring instead of directly fixing it with a screw.

Specifically, the hybrid IC board fixing structure according to the present invention is a hybrid IC board in which a hybrid IC board is fixedly held by screws on a fixing base.
In the C-board fixing structure, the screw forms a predetermined gap between the upper surface of the fixing base and the screw head with the tip of the screw abutting against the bottom of the screw hole of the fixing base, and a spring is provided in the gap. It is arranged.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a partial sectional view of this embodiment. In this embodiment, a hybrid IC substrate 1 having holes at its four corners is held on a fixed base 2.
Screw holes 10 are provided at the four corners of the fixed base 2 to allow the hybrid IC
The position of the substrate 1 is fixed to the fixed base 2 at the four corners by the screws 4 via the spring 3 and the washer 5. In this embodiment, the spring 3 is a coil spring, but a disc spring or the like can be used.

Now, when the screw 4 is tightened, it hits the bottom portion 10a of the screw hole 10 of the tip end portion 40 of the screw 4 and cannot be screwed any further, and the washer 5 that comes into close contact with the screw head 4a of the screw 4 and the upper surface 2a of the fixing base 2 is attached. There are gaps A of the same size at the four corners with the upper surface of the. Therefore, the spring 3 always contracts with a constant pressure, that is, with a constant pressing force, via the washer 5
Is clamped on the fixed base 2. The pressing force at this time is the hybrid IC
The value may be set to a value that prevents the substrate 1 from floating or rattling due to vibration or impact, and that does not cause the substrate to crack.

[Effect of the Invention] As described above, according to the present invention, in the hybrid IC board fixing structure in which the structure is fixedly held on the fixing base via the screw, the screw has a tip of the fixing base. Since the predetermined gap is formed between the upper surface of the fixing table and the screw head in the state of abutting against the bottom of the screw hole, and the spring is arranged in the gap, the hybrid IC substrate is pressed with the optimum pressing force. Since the tip of the screw abuts against the bottom of the screw hole of the fixing base, the assembly work to obtain the prescribed pressing force compared to the case where the pressing force of the spring is controlled with a subtle torque. It is simple and the screw is not loosened due to vibration or the like.

Further, since the back surface of the hybrid IC substrate is in direct contact with the case, it is possible to obtain an effect that it is easy to dissipate heat and ground.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a partial sectional view of FIG. 1, and FIGS. 3 and 4 are perspective views showing an example of a conventional fixing structure. 1: Hybrid IC board 2: Fixed base 2a: Upper surface of fixed base 3: Spring 4: Screw 5: Washer 10: Screw hole 10a: Bottom of screw hole 40: Screw tip A: Gap

Claims (1)

[Scope of utility model registration request] 1. A hybrid IC board fixing structure in which a hybrid IC board is fixedly held by a fixing base via a screw, wherein the screw has an upper end abutting against a bottom of a screw hole of the fixing base. And a screw head, a predetermined gap is formed between the screw head and the screw head, and a spring is arranged in the gap.