JPS6011675Y2 - Mounting plate for circuit board - Google Patents
Mounting plate for circuit boardInfo
- Publication number
- JPS6011675Y2 JPS6011675Y2 JP17519680U JP17519680U JPS6011675Y2 JP S6011675 Y2 JPS6011675 Y2 JP S6011675Y2 JP 17519680 U JP17519680 U JP 17519680U JP 17519680 U JP17519680 U JP 17519680U JP S6011675 Y2 JPS6011675 Y2 JP S6011675Y2
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- circuit board
- mounting
- ceramic circuit
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
本考案はセラミック等の回路基板を他の機器へ取付ける
ために用いる取付板に関する。[Detailed Description of the Invention] The present invention relates to a mounting plate used for mounting a circuit board made of ceramic or the like to other equipment.
従来よりセラミック回路基板を使用した混成集積回路装
置を機器へ実装する場合、セラミック回路基板を取付板
に接着固定し取付板を更に機器の支持部へネジ等の固定
手段を用いて取付けることが行われている。Conventionally, when a hybrid integrated circuit device using a ceramic circuit board is mounted on a device, the ceramic circuit board is adhesively fixed to a mounting plate, and the mounting plate is further attached to the supporting part of the device using fixing means such as screws. It is being said.
第１図に従来の取付板を示す。Figure 1 shows a conventional mounting plate.
第１図ａは取付板１の平面図で、取付板１はセラミック
回路基板より実質的に広い面積を有する大きさであって
、セラミック回路基板を固定する基板固定部２と、ネジ
穴１１が形成され基板固定部と同等の幅を有する部分３
とからなっている。FIG. 1a is a plan view of the mounting plate 1, which has a size substantially larger than the ceramic circuit board, and has a board fixing part 2 for fixing the ceramic circuit board and a screw hole 11. A portion 3 is formed and has a width equivalent to that of the board fixing portion.
It consists of
第１図す、 Ｃ，はこの取付板１にセラミック回路基板
５を接着剤６を用いて基板固定部２上に固定し、更にこ
の取付板１を支持体７にネジ９を用いて固定する様子を
示しである。In Figure 1, C, a ceramic circuit board 5 is fixed to the mounting plate 1 on the board fixing part 2 using an adhesive 6, and the mounting plate 1 is further fixed to the support body 7 using screws 9. Here's how it looks.
４は混成集積回路封止用キャップである。4 is a cap for sealing the hybrid integrated circuit.
第１図すの如く、支持体７の形成する支持面と取付板１
の取付面とが一致している場合は良いが、第１図Ｃの如
く、取付面に対して支持面が段差又は傾きを持っている
場合は、取付板全体が変形する可能性があり、取付板を
支持部へ取付する際に支持部の形成せる面に対し、取付
板の形成せる面が傾いていると取付の際に取付板に不必
要な応力が加わるため、セラミック回路基板にひびかけ
等が生ずる。As shown in Figure 1, the support surface formed by the support body 7 and the mounting plate 1
It is fine if the support surface is aligned with the mounting surface, but as shown in Figure 1C, if the support surface has a step or slope with respect to the mounting surface, the entire mounting plate may be deformed. When attaching the mounting plate to the support part, if the surface of the mounting plate is tilted relative to the surface of the support part, unnecessary stress will be applied to the mounting plate during installation, which may cause cracks in the ceramic circuit board. Cracks, etc. occur.
又、取付時に異状が見られない場合であっても取付板に
生じたゆがみのために経時あるいは温度変化等の要因に
より機器への実装後にひび、かけ等が生じ混成集積回路
が故障する場合が見受けられる。Furthermore, even if no abnormalities are observed during installation, distortions in the mounting plate may cause cracks or chips after mounting on equipment due to factors such as aging or temperature changes, resulting in failure of the hybrid integrated circuit. It can be seen.
本考案の目的は回路基板を支持体に取付板を介して固定
する場合に、回路基板自体に機械的損傷を与えることを
防止し、信頼性を向上させる取付板を提供することであ
る。An object of the present invention is to provide a mounting plate that prevents mechanical damage to the circuit board itself and improves reliability when the circuit board is fixed to a support via the mounting plate.
本考案は特にセラミック回路基板を使用した混成集積回
路装置、カメラ機器等へ実装する場合に効果を有するも
のである。The present invention is particularly effective when mounted on hybrid integrated circuit devices, camera equipment, etc. using ceramic circuit boards.
第２図に本考案の実施例である取付板の平面図を示す。FIG. 2 shows a plan view of a mounting plate that is an embodiment of the present invention.
本実施例の取付板１０においては、セラミック回路基板
を固定する基板固定１２とほぼ同等の幅を有し、取り付
は用のネジ穴が形成された部分１３中に切れ込み１４が
設けられている。The mounting plate 10 of this embodiment has a width almost equal to that of the board fixing 12 for fixing the ceramic circuit board, and a notch 14 is provided in a portion 13 in which a screw hole for mounting is formed. .
この切れ込み１４は基板固定部とほぼ同等の幅を有する
部分１３が、取付板の支持体への固定の際にネジ穴１１
の近傍の部分の変位に伴なって同様に変位し、その結果
生ずる基板固定部の変形を防ぐもので、取り付けに有効
な取付部を含む部分１５が基板固定部１２に影響を与え
ない曲折変形が可悩なように、部分１５の幅を小さくす
るとともに他の部分１６より変位に関して独立させるも
のである。This notch 14 has a portion 13 having a width approximately equal to that of the board fixing portion, which is inserted into the screw hole 14 when fixing the mounting plate to the support body.
This prevents the board fixing part from deforming as a result of the displacement of the parts near the board fixing part 12, and the bending deformation of the part 15 including the mounting part effective for mounting does not affect the board fixing part 12. However, the width of the portion 15 is made smaller and the portion 15 is made to be more independent in terms of displacement than the other portions 16.
この取付板１０を用いてセラミック回路基板５を支持体
８に実装する様子を第３図に示す。FIG. 3 shows how the ceramic circuit board 5 is mounted on the support body 8 using this mounting plate 10.
本実施例の取付板は、切れ込み１４により取り付けに有
効な取付部を含む部分１５が他の部分１６と切れ込み１
４によって分離されているため、第３図の如く支持面が
取付板の面と一致していなくても、有効取付部を含む部
分１５のみが支持体８の面にならって変形し、一方取付
板の基板固定部はセラミック回路基板５に不必要な応力
を伝達することがない。In the mounting plate of this embodiment, a portion 15 including a mounting portion effective for mounting due to the notch 14 is connected to another portion 16 with the notch 1.
4, even if the support surface does not match the surface of the mounting plate as shown in FIG. The board fixing portion of the plate does not transmit unnecessary stress to the ceramic circuit board 5.
このように本考案の取付板は、有効な取付部の近傍に切
れ込みを設けることによって支持体に取付板を固定する
際、取付板に不必要な応力が加わらずセラミック回路基
板にひび、かけ等が生ずる事故が無くなり信頼性を向上
させることが可能となった。In this way, the mounting plate of the present invention has a cut in the vicinity of the effective mounting part, so that when the mounting plate is fixed to the support, unnecessary stress is not applied to the mounting plate, and the ceramic circuit board is prevented from cracking or chipping. It has become possible to improve reliability by eliminating accidents that occur.
第１図ａ ”−’ ｃは従来の取付板を示す図、第２図
は本考案の実施例である取付板の平面図、第３図はこの
実施例の取付板を用いてセラミック回路基板を支持体に
固定する場合の様子を示す図である。
図中、１，１０・・・・・・取付板、２，１２・・・・
・・基板固定部、１５・・・・・・取付部を含む部分、
５・・・・・・セラミック回路基板、６・・・・・・接
着材、７・・・・・・支持体、訃・・・・・ひび、９・
・・・・・ネジ、１１・・・・・・ネジ穴。Figure 1 a ''-' c shows a conventional mounting plate, Figure 2 is a plan view of a mounting plate that is an embodiment of the present invention, and Figure 3 is a ceramic circuit board using the mounting plate of this embodiment. It is a diagram showing the situation when fixing to a support body. In the figure, 1, 10... mounting plate, 2, 12...
... Board fixing part, 15... Part including the mounting part,
5... Ceramic circuit board, 6... Adhesive, 7... Support, Death... Crack, 9...
...Screw, 11...Screw hole.
Claims (1)
部に前記回路基板を固定するとともに、その他の面積部
中に含まれる取付部を介してそれ自身を他の支持体に固
定する回路基板用取付板において、 前記取付部の近傍に、前記回路基板を固定した面積部に
対して前記取付部の曲折変形を可能にする切り込みを設
けたことを特徴とする回路基板用取付板。[Scope of Claim for Utility Model Registration] Having an area substantially larger than the circuit board, 1 part of the area
In a mounting plate for a circuit board, which fixes the circuit board to a part and fixes itself to another support via a mounting part included in the other area part, the circuit board is fixed to the mounting part in the vicinity of the mounting part. 1. A mounting plate for a circuit board, characterized in that a notch is provided in the fixed area portion to enable bending and deformation of the mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17519680U JPS6011675Y2 (en) | 1980-12-05 | 1980-12-05 | Mounting plate for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17519680U JPS6011675Y2 (en) | 1980-12-05 | 1980-12-05 | Mounting plate for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5797992U JPS5797992U (en) | 1982-06-16 |
| JPS6011675Y2 true JPS6011675Y2 (en) | 1985-04-17 |
Family
ID=29967471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17519680U Expired JPS6011675Y2 (en) | 1980-12-05 | 1980-12-05 | Mounting plate for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6011675Y2 (en) |
-
1980
- 1980-12-05 JP JP17519680U patent/JPS6011675Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5797992U (en) | 1982-06-16 |
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