CN105827178B - Motor control device - Google Patents
Motor control device Download PDFInfo
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- CN105827178B CN105827178B CN201610017811.1A CN201610017811A CN105827178B CN 105827178 B CN105827178 B CN 105827178B CN 201610017811 A CN201610017811 A CN 201610017811A CN 105827178 B CN105827178 B CN 105827178B
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- main circuit
- panel
- control device
- motor control
- side plate
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Abstract
The invention provides a motor control device, which can reduce the cost by reducing metal plates. Further, the motor control device has high vibration resistance, can be easily assembled, and has a small installation area when mounted on a control panel. The motor control device includes: a main circuit board on which a semiconductor is mounted; a housing in which a main circuit board is built; and a heat sink which is in contact with the semiconductor and dissipates heat generated from the semiconductor, wherein the heat sink penetrates through a through hole formed in a side panel of the control panel and is positioned outside the control panel.
Description
Technical Field
The present invention relates to a motor control device.
Background
A motor control device for driving a main shaft synchronous motor includes a main circuit board, a control board, a dynamic braking resistor, an impact resistance resistor, and a case. On the main circuit board, large-sized elements such as a fuse and an electrolytic capacitor for smoothing the output of the converter are mounted.
Circuit elements for controlling the inverter, such as a CPU and an IC, are mounted on the control board. The box has: the metal plate supports the main circuit substrate, the control substrate, the dynamic braking resistor and the anti-impact resistor; and a heat sink for cooling semiconductor elements of the converter and the inverter.
This motor control device is mounted on a control panel included in the apparatus. The control panel has a box shape. A motor control device is mounted on the back surface inside the control panel. When the amount of heat generated by the motor control device is large, a heat sink of the motor control device is provided outside the control panel. This causes so-called off-disk cooling.
An example of the motor control device that can be made thin is disclosed in japanese patent laid-open publication No. h 5-38144. In the motor control unit described in japanese patent laid-open publication No. h 5-38144, the unit case has a flat substantially rectangular parallelepiped shape. A printed wiring board on which a semiconductor module is mounted is disposed substantially parallel to the wall on the large-area side of the unit case. A plate-like heating plate is disposed substantially parallel to the wall surface on the large-area side of the unit case and close to one wall. A part of the heating plate is disposed inside the unit case, and the other part of the heating plate protrudes outside the unit case. The heat-dissipating mounting surface of the semiconductor module is in contact with the heating plate in the unit case. In addition, the heat radiating fins are in contact with both sides of the heating plate outside the unit case. In the motor control unit, the height of the heat radiating fins on one surface of the heating plate and the height of the heat radiating fins on the other surface of the heating plate are made different from each other so that the sum of the height of the heat radiating fins and the thickness of the heating plate is substantially the same as the width of the unit case. Thus, in the motor control unit disclosed in Japanese patent laid-open No. 5-38144, a heater plate is used to reduce the thickness.
But there is a problem in that the heating panel is expensive. Further, there is a problem that although the width of the motor control device is narrow, the depth of the motor control device is long. In particular, if the depth of the heat radiating portion is increased, the depth of the control panel is increased, which leads to a problem of an increase in size of the apparatus.
The inverter device described in japanese patent laying-open No. 5-260763 includes a main circuit portion and a control circuit that controls switching of switching elements included in the main circuit portion. In the inverter device, the main circuit portion includes a semiconductor element as the switching element and a cooling device for heat dissipation. The control circuit is constituted by a printed wiring board on which electronic components are mounted. All electronic components including the semiconductor element of the main circuit portion and the cooling member for heat dissipation are mounted on one metal plate rack.
The upper surface of the metal plate frame is covered by attaching a housing, which houses a printed wiring board constituting the control circuit, to the metal plate frame. The left and right side portions of the sheet metal frame are covered by mounting side plates on the frame. The bottom surface of the sheet metal frame is covered by mounting a base plate on the frame.
Further, a fixing device for mounting the inverter device itself inside another case is mounted on the sheet metal frame. The inverter device has a unit structure as a whole.
However, in the inverter device disclosed in japanese patent laying-open No. 5-260763, a metal plate is often used to constitute the inverter device (motor control device). Further, since the motor control device is a large-sized device, a metal plate having high strength is required. As a result, there is a problem that the cost of the metal plate is increased. Further, there is a problem that an installation area becomes large when the inverter device is installed on the control panel.
Japanese patent laid-open publication No. 6-284522 discloses a control panel capable of performing natural cooling satisfactorily. However, the structure of the control panel is complicated. Further, a motor control device is mounted on the rear surface of the control panel. Further, the motor control device occupies a large area on the back of the control panel. Therefore, there is a problem that the user does not have room for adding a separate control device to the control panel.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide the following motor control device. In the motor control device, the cost can be reduced by reducing the metal plate. Further, the motor control device has high vibration resistance, can be easily assembled, and has a small installation area when being mounted on a control panel.
The present invention provides a motor control device (the present motor control device) comprising: a main circuit board on which a semiconductor is mounted; a housing in which the main circuit board is built; a heat sink that is in contact with the semiconductor and dissipates heat generated from the semiconductor; and a control board having a control circuit, wherein the heat sink is disposed outside the control board with the side panel as a center, and the main circuit board is disposed inside the control board with the side panel as a center, and the housing has a base metal plate having at least a side plate on the side of the side panel, and a cover having at least an inner side plate opposite to the side plate, the main circuit board being mounted on the side plate on the side panel, the control board being fixed to the main circuit board, and the side plate on the side panel being fixed to the side panel.
Preferably, the semiconductor is contained within a converter or inverter.
Preferably, the housing has a base metal plate having at least a side plate on the side of the side plate, and a cover having at least an inner side plate on the opposite side to the side plate, and the main circuit board is mounted on the base metal plate.
Preferably, the motor control device includes a control board on which a control circuit is formed, and the main circuit board and the control board are disposed in parallel with the side plate.
Preferably, the elements of the control board are disposed on the main circuit board side of the control board, and the elements of the main circuit board are disposed on the control board side of the main circuit board.
In the motor control device, the cost can be reduced by reducing the number of metal plates. In addition, the motor control device has high vibration resistance, can be assembled simply, and has a small installation area when being installed on a control panel.
Drawings
Fig. 1 is an explanatory diagram of a motor control device according to an embodiment of the present invention.
Fig. 2 is an explanatory diagram showing a motor control device according to an embodiment of the present invention mounted on a control panel.
Fig. 3 is an explanatory diagram showing the configuration of the motor control device.
Fig. 4 is an explanatory diagram showing a structural relationship between the heat sink, the right side panel of the control panel, and the side panel.
Description of the reference numerals
1 Motor control device
10 outer shell
10a fan
11 outer cover
20 base metal plate
21 lower side plate
22 side plate
22a base metal plate through hole
23 upper side plate
24 dorsal side plate
30 cover
31 inner side plate
32 surface side plate
32a front side through hole
40 control substrate
50 main circuit board
50a semiconductor
60 heat sink
70 stud
100 control panel
101 control panel right side panel (side panel)
101a through hole
Detailed Description
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
Embodiments of the present invention will be described below.
Fig. 1 is an explanatory diagram of a motor control device according to an embodiment of the present invention.
As shown in fig. 1, the motor control device 1 has a housing 11. The housing 11 has a base metal plate 20 and a cover 30. The heat sink 60 is attached to the base metal plate 20.
Fig. 2 is an explanatory diagram showing the motor control device 1 attached to the control panel.
As shown in fig. 2, the motor control device 1 is mounted on a control panel 100. The control panel 100 includes at least: a control panel right side panel 101, a control panel back panel 102, a control panel left side panel 103, a control panel top panel 104, and a control panel bottom panel 105.
The control panel 100 may include a door or the like provided on the front side in addition to the control panel right side panel 101, the control panel back panel 102, the control panel left side panel 103, the control panel upper panel 104, and the control panel bottom panel 105. The control panel 100 has a box shape with an open front side by a control panel right side plate 101, a control panel back plate 102, a control panel left side plate 103, a control panel upper plate 104, and a control panel bottom plate 105. Thereby, a control panel internal space 100a is formed inside the control panel 100. The control panel internal space 100a can be provided with various machine control devices driven by the motor control device 1, wiring for the control devices, an operation unit (switch) operated by a user, and the like. Therefore, the motor control device 1 disposed in the control panel internal space 100a is preferably as compact as possible. The motor control device 1 is desirably disposed at a position where it prevents the disposition of other devices disposed in the control panel internal space 100a from being hindered as much as possible.
The motor control device 1 of the present embodiment is mounted on a control panel right side panel 101 in a control panel 100. Therefore, the motor control device 1 can avoid hindering the arrangement of other devices arranged in the control panel internal space 100a as much as possible. That is, if the motor control device 1 is attached to the control panel back surface plate 102, it is attached near the center of the control panel internal space 100 a. In this case, the motor control device 1 squeezes a space for installing other equipment. The motor control device 1 of the present embodiment is mounted on the right panel 101 of the control panel. Therefore, a space near the center of the control panel internal space 100a can be made free. As a result, a space for installing other devices can be secured.
The housing 11 can be formed to have a thin thickness in the right-left direction. Thereby, as shown in fig. 2, a space near the center of the control panel internal space 100a can be further made free. Therefore, it is easier to secure a space for installing other devices. Thus, the motor control device 1 of the present embodiment can more effectively utilize the space in the control panel 100.
In the present embodiment, the motor control device 1 is attached to the control panel right-side plate 101. Instead, the motor control device 1 may be attached to the left control panel left side plate 103.
Fig. 3 is a more detailed explanatory diagram of the motor control device 1.
At least the main circuit board 50 and the control board 40 are housed in the housing 11 of the motor control device 1.
The base metal plate 20 is formed on the control panel right side panel 101 side in the housing 11, for example. The base metal plate 20 has: side panel 22, upper side panel 23, lower side panel 21 and back side panel 24. However, the base metal plate 20 may have a side plate 22 at a minimum. The side plate 22 is in contact with the control panel right side plate 101. The side plate 22 is connected to the control panel right side plate 101 by various methods (e.g., bolts, nuts, screws, etc.). Thereby, the position of the side plate 22 is fixed. The side plate 22 has a base metal plate through hole 22 a. The shape of the base metal plate through hole 22a is smaller than that of the heat sink 60. This allows the heat sink 60 to be fixed to the base metal plate 20.
In order to dissipate heat in the housing 11, even if it is small, slit-shaped cooling holes may be formed in the upper side plate 23 and the lower side plate 21.
The dynamic braking resistor and the impact resistance resistor may be disposed at positions on the inner side of the back plate 24. When the dynamic braking resistor and the impact resistance resistor are arranged at the above positions, wiring can be facilitated.
The side plate 22, the upper side plate 23, the lower side plate 21, and the back side plate 24 are preferably formed by bending one plate. This enables the base metal plate 20 to be easily manufactured.
In addition, main components of the motor control device 1, such as the main circuit board 50 and the control board 40, are disposed on the side plate 22 and the back side plate 24. The main circuit substrate 50 is mounted on the side plate 22. Therefore, the motor control device 1 is almost entirely disposed on the side plate 22 side.
The cover 30 has a surface side panel 32 and an interior side panel 31. The inner side plate 31 is formed on the opposite side of the casing 11 from the control panel right side plate 101, for example. The housing 11 has the following structure: all six surfaces of the housing 11 are covered with the side plate 22, the upper side plate 23, the lower side plate 21, and the back side plate 24 of the base metal plate 20 in addition to the front side plate 32 and the inner side plate 31 of the cover 30.
A plurality of front side through holes 32a may be formed in the front side plate 32. For example, a lead wire, a connector, or the like for connecting various devices such as the main circuit board 50 and the control board 40 inside the motor control device 1 to other devices inside the control panel or the like is passed through the front side through hole 32 a.
The front side through hole 32a corresponds to the interface mounted on the control board 40 and the main circuit board 50. The cover 30 may have at least one of the surface side plate 32 and the inner side plate 31. Preferably, the cover 30 is formed by bending a single plate. Thereby, the cover 30 can be easily manufactured.
The cover 30 has a structure that prevents direct connection with the weight. Therefore, the cover 30 is light in weight compared to the base metal plate 20, and has a structure that does not require high strength. Therefore, the cover 30 can also be formed of a lightweight material. That is, the cover 30 may be formed of a thin metal plate or may be formed of resin or the like.
As described above, the housing 11 is constituted by the two members of the cover 30 and the base metal plate 20. This can reduce the number of metal plates used to manufacture the housing 11. As a result, the manufacturing cost of the housing 11 can be reduced.
The main circuit board 50 is mounted with a semiconductor 50a included in a converter, an inverter, and the like. The semiconductor 50a generates a large amount of heat when the motor is driven. Thus, the semiconductor 50a is in contact with the heat sink 60. Thereby, the heat of the semiconductor 50a is discharged to the outside through the heat sink 60. That is, the heat sink 60 is in contact with the semiconductor 50a, and dissipates heat generated from the semiconductor 50 a.
The semiconductor 50a is disposed at a position on the side plate 22 side of the main circuit board 50. The heat sink 60 is mounted on the side plate 22 side. Among various electronic components and the like mounted on the main circuit substrate 50, electronic components (particularly, fuses and electrolytic capacitors) having a large height in the vertical direction of the main circuit substrate 50 are mounted on the side plate 22 side of the main circuit substrate 50. Thereby, various elements can be disposed between the main circuit board 50 and the side plate 22. Further, by disposing the plurality of semiconductors 50a on the main circuit board 50 so that the semiconductors 50a are appropriately distributed with respect to the heat sink 60, the heat sink 60 can be thinned.
The control board 40 has a control circuit on which control electronic components and the like are arranged. Of the electronic components and the like mounted on the control substrate 40, an electronic component having a large height in the vertical direction of the control substrate 40 is mounted on the main circuit substrate 50 side. This allows the control board 40 and the inner panel 31 to be disposed at a minimum distance from each other.
Interfaces (connectors, etc.) with a host device, etc. mounted on the control board 40 are disposed on the main circuit board 50 side of the control board 40. Further, interfaces (connectors and the like) with a power supply, a motor and the like, which are mounted on the main circuit board 50, are arranged on the control board 40 side in the main circuit board 50. In addition, the interface has a large height in the vertical direction of the control board 40 or the main circuit board 50.
The main circuit board 50 and the control board 40 are disposed parallel or substantially parallel to the control panel right side plate 101. The electronic components (including capacitors and interfaces) mounted on the main circuit substrate 50 and the control substrate 40 are mainly disposed between the main circuit substrate 50 and the control substrate 40. That is, the elements (electronic elements; at least some of the electronic elements) of the control board 40 are disposed on the main circuit board 50 side of the control board 40, the elements (electronic elements; at least some of the electronic elements) of the main circuit board 50 are disposed on the control board 40 side of the main circuit board 50, and these electronic elements can be brought as close as possible to the main circuit board 50 and the control board 40 by disposing the electronic elements of the main circuit board 50 and the control board 40 in a space (space where they do not interfere with each other) that is left empty. This can reduce the thickness of the entire motor control device 1 (the distance between the side plate 22 and the inner side plate 31). Further, the heat sink 60 protrudes to the outside of the housing 11. Therefore, the thickness of the housing 11 (the distance between the side plate 22 and the inner side plate 31) can be made small.
The control board 40 is fixed to the main circuit board 50 while keeping a predetermined distance between the control board 40 and the main circuit board 50 by spacers such as studs 70. Further, the main circuit board 50 itself is also fixed to the side plate 22. Therefore, both the main circuit board 50 and the control board 40 are fixed to the side plate 22. As a result, the components constituting the motor control device 1, which have a heavy weight, are fixed to the side plates 22. The side plate 22 is also fixed to the control panel right side plate 101. Therefore, almost the entire internal structure of the motor control device 1 can be fixed more firmly. As a result, the vibration resistance of the motor control device 1 can be improved.
The control panel right panel 101 has a through hole 101a, and the through hole 101a is used to dispose the heat sink 60 at a position outside the control panel 100. Here, the through-hole 101a preferably has a shape similar to the heat sink 60 and slightly larger than the heat sink 60 so that the heat sink 60 can penetrate therethrough. However, the shape of the through-hole 101a may be any shape as long as the heat sink 60 can pass through it. The shape of the through-hole 101a may not be similar to the shape of the heat sink 60.
An outer case 10 is disposed on the control panel right side plate 101, and the outer case 10 covers the heat sink 60 located outside the control panel 100. A fan 10a is disposed in the outer case 10, and the fan 10a blows air to the heat sink 60. The heat sink 60 is forcibly cooled by the fan 10 a. As the heat sink 60, a thin heat sink may be used. Therefore, the outer case 10 can be made thin.
In this way, the heat sink 60 penetrates through the through hole 101a formed in the control panel right side plate 101 of the control panel 100 and is disposed outside the control panel 100. This can suppress the temperature rise in the control disk inner space 100a and use the outside air for cooling. As a result, the semiconductor 50a can be reliably cooled.
In the control panel 100 having such a configuration, the heat sink 60, which is the heaviest component, is disposed outside the control panel right side panel 101, that is, outside the control panel 100. On the other hand, as described above, other components (the main circuit board 50 and the like) of the motor control device 1 are disposed inside the control panel right side panel 101, that is, inside the control panel 100. Thus, the components of the motor control device 1 are arranged inside and outside the control panel right side panel 101. Therefore, in the control panel 100, the weight of the motor control device 1 can be substantially balanced about the right panel 101 of the control panel. As a result, the vibration resistance of the motor control device 1 (control panel 100) can be improved.
A method of assembling the motor control device 1 will be described. The heat sink 60 is fixed to the base metal plate 20. A plurality of semiconductors 50a are mounted on the heat sink 60. Further, the main circuit board 50 is mounted on the semiconductor 50 a. Thereafter, the control board 40 is mounted on the semiconductor 50a through the stud 70. Then, the cover 30 is fixed to the base metal plate 20. Thereby, the assembly of the motor control device 1 is completed.
Fig. 4 is an explanatory diagram for explaining the structural relationship of the heat sink 60, the control panel right side panel 101, and the side panel 22.
As shown in fig. 4, the heat sink 60 penetrates through a through hole 101a formed in the control panel right side plate 101 and is exposed to the outside of the control panel 100. The outer case 10 is positioned to cover the exposed heat sink 60 (see fig. 2). Further, as shown in fig. 4, the heat sink 60 is fixed to the side plate 22.
Examples of the side panels of the present invention are a control panel right side panel 101 and a control panel left side panel 103. However, the present invention is not limited to the above embodiments. The present invention may have a different configuration according to the usage situation.
The motor control device 1 may be disposed at the following positions: the arrangement of other devices arranged in the control panel inner space 100a is not hindered as much as possible.
Various electronic components and the like mounted on the main circuit substrate 50, which have a large height in the vertical direction of the substrate (in particular, a fuse and an electrolytic capacitor), may be mounted on the side plate 22 side of the main circuit substrate 50. Even an electronic component having a large height in the vertical direction of the substrate on the control substrate 40 can be mounted on the main circuit substrate 50 side.
The heat sink 60 having the heaviest weight can be disposed outside the control panel 100 with the control panel right side panel 101 as the center. On the other hand, as described above, the main circuit board 50 and the like can be arranged inside the control panel 100 with the control panel right side panel 101 as the center. This makes the control panel right side plate 101 balanced in weight. As a result, the vibration resistance can be improved.
The motor control device 1 may be assembled as follows. The heat sink 60 is fixed to the base metal plate 20. And a plurality of semiconductors 50a are mounted on the heat sink 60. Further, the main circuit board 50 is mounted on the semiconductor 50 a. Thereafter, the control board 40 is mounted through the stud 70. Then, the motor control device 1 is assembled after the cover 30 is fixed.
The embodiment of the present invention may be the following first to fourth motor control devices.
The first motor control device includes: a main circuit board on which a semiconductor is mounted; a housing in which the main circuit board is built; and a heat sink which is in contact with the semiconductor and dissipates heat generated by the semiconductor, wherein the heat sink penetrates through a through hole formed in a side panel of a side surface of the control panel and is positioned on an outer side of the control panel.
The second motor control device is the first motor control device, and the semiconductor constitutes a converter or an inverter.
The third motor control device is the first or second motor control device, wherein the housing has a base metal plate having at least a side plate on the side of the side plate, and a cover having at least an inner side plate on the opposite side of the side plate, and the main circuit board is mounted on the base metal plate.
The fourth motor control device is any one of the first to third motor control devices, and has a control board on which a control circuit is formed, and the main circuit board and the control board are arranged in parallel with the side panel.
A fifth motor control device is the fourth motor control device, wherein the control board has elements arranged on the side of the main circuit board, and the main circuit board has elements arranged on the side of the control board.
According to the first to fourth motor control devices, the cost can be reduced by reducing the number of metal plates, the vibration resistance can be improved, the assembly is simple, and the installation area when the motor control device is mounted on the control panel is small.
The detailed description has been presented for purposes of illustration and description. Many modifications and variations are possible in light of the above teaching. The detailed description is not intended to be exhaustive or to limit the subject matter described herein. Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts described are disclosed as example forms of implementing the claims.
Claims (5)
1. A motor control device is characterized by comprising:
a main circuit board on which a semiconductor is mounted;
a housing in which the main circuit board is built;
a heat sink that is in contact with the semiconductor and dissipates heat generated from the semiconductor;
a control substrate on which a control circuit is formed,
the radiating fin penetrates through a through hole formed on a side panel of the control panel and is positioned on the outer side of the control panel,
the heat sink is arranged outside the control panel with the side panel as the center,
the main circuit board is arranged inside the control panel with the side panel as the center,
the housing has a base metal plate and a cover,
the base metal plate has at least a side plate on the side of the side plate,
the cover has at least an inner side plate on the opposite side to the side of the side plate,
the main circuit substrate is mounted on the side plate on the side of the side plate,
the control substrate is fixed on the main circuit substrate,
the side plate on the side of the side plate is fixed on the side plate.
2. The motor control device according to claim 1, wherein the semiconductor is included in a converter.
3. The motor control apparatus according to claim 2, wherein the converter is an inverter.
4. The motor control device according to claim 1 or 2,
the main circuit board and the control board are disposed in parallel with the side panel.
5. The motor control device according to claim 4,
the elements of the control board are disposed on the main circuit board side of the control board,
the elements of the main circuit board are arranged on the control board side of the main circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015010433A JP6489842B2 (en) | 2015-01-22 | 2015-01-22 | Motor control device |
| JP2015-010433 | 2015-01-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105827178A CN105827178A (en) | 2016-08-03 |
| CN105827178B true CN105827178B (en) | 2021-02-19 |
Family
ID=56434846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610017811.1A Active CN105827178B (en) | 2015-01-22 | 2016-01-12 | Motor control device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6489842B2 (en) |
| CN (1) | CN105827178B (en) |
| PH (1) | PH12016000026A1 (en) |
| TW (1) | TWI688325B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111954975B (en) * | 2018-04-10 | 2021-06-22 | 三菱电机株式会社 | Motor driving device |
| CN114623534B (en) * | 2022-03-29 | 2024-03-29 | 江苏新安电器股份有限公司 | Control panel for intelligent automatic air humidifier for family life |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012196054A (en) * | 2011-03-16 | 2012-10-11 | Denso Corp | Motor controller |
| JP2012235619A (en) * | 2011-05-02 | 2012-11-29 | Toyota Motor Corp | Controller of rotary electric machine |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59107193U (en) * | 1983-01-06 | 1984-07-19 | 松下電工株式会社 | Electrical equipment mounting frame device |
| JP2626326B2 (en) * | 1991-07-31 | 1997-07-02 | 三菱電機株式会社 | Motor control unit |
| JPH05260763A (en) * | 1992-03-12 | 1993-10-08 | Fuji Electric Co Ltd | Sheet metal construction for inverter apparatus |
| TW588897U (en) * | 2002-12-27 | 2004-05-21 | Hitron Technologies Inc | Modularized mechanism housing structure |
| CN2914608Y (en) * | 2006-06-08 | 2007-06-20 | 杭州华为三康技术有限公司 | Heat dissipation blade fixing device, compression screw and screw bolt |
| JP5160186B2 (en) * | 2007-10-23 | 2013-03-13 | アイシン・エィ・ダブリュ株式会社 | Inverter device |
| JP3173511U (en) * | 2011-11-25 | 2012-02-09 | 株式会社豊田自動織機 | Semiconductor device |
| CN202491143U (en) * | 2012-03-28 | 2012-10-17 | 茂名市怡华机械有限公司 | Electrical appliance box of knife sharpening machine |
| JP5721682B2 (en) * | 2012-10-05 | 2015-05-20 | 三菱電機株式会社 | Outdoor unit of electrical module unit and air conditioner |
| TWM480762U (en) * | 2014-03-12 | 2014-06-21 | Chroma Ate Inc | Stacked package structure testing device with heat dissipation module |
-
2015
- 2015-01-22 JP JP2015010433A patent/JP6489842B2/en active Active
-
2016
- 2016-01-12 CN CN201610017811.1A patent/CN105827178B/en active Active
- 2016-01-15 PH PH12016000026A patent/PH12016000026A1/en unknown
- 2016-01-18 TW TW105101395A patent/TWI688325B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012196054A (en) * | 2011-03-16 | 2012-10-11 | Denso Corp | Motor controller |
| JP2012235619A (en) * | 2011-05-02 | 2012-11-29 | Toyota Motor Corp | Controller of rotary electric machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6489842B2 (en) | 2019-03-27 |
| CN105827178A (en) | 2016-08-03 |
| PH12016000026A1 (en) | 2017-12-18 |
| TWI688325B (en) | 2020-03-11 |
| JP2016135079A (en) | 2016-07-25 |
| TW201633891A (en) | 2016-09-16 |
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