JP2626326B2 - Motor control unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor main circuit for controlling a motor, and to a motor control unit such as an inverter and a servo amplifier comprising a control circuit for controlling the operation of the semiconductor main circuit.

[0002]

2. Description of the Related Art Recent motor control units have been miniaturized by miniaturization of power switching elements such as power transistors, high integration (integration), and adoption of power printed boards. Treatment of heat generated from parts and the like is a bottleneck. Further, as the control becomes more sophisticated and complicated, the number of motors used increases, and the number of motors controlled by a centralized control device increases.

FIG . 4A is a block diagram showing a circuit configuration of a conventional servo amplifier, and FIG. 4B is a circuit diagram of a main circuit portion. In the figure, 1 is a power supply, 21 is a converter unit .
Constituting diode module (first semiconductor module
In step ( 1 ), the AC of the commercial frequency power supply 1 is converted to DC.
23 is a diode module 2 constituting a converter section
A capacitor for smoothing the DC converted from AC in 1
2 is a transistor module that constitutes the inverter section
In the (second semiconductor module), the direct current smoothed by the capacitor 23 is converted into an alternating current of an arbitrary voltage and frequency by the PWM generation circuit 11 and supplied to the servomotor 6. 7 is an encoder which detects the position and speed of the servo motor 6,
The signal is sent to the position / speed detection circuit 12, and the arithmetic circuit 13 compares the external position command from the controller 15 with the signal from the position / speed circuit 12 , and sends a voltage command to the PWM generation circuit 11 based on the calculation result. I do. Inverter section
The output current from the transistor module 22 constituting the detected by the current detector CT such as, sends the signal to the arithmetic circuit 13 via the current detection circuit 16. In FIG. 4A, a portion 8 surrounded by a dashed line is a so-called motor control unit (servo amplifier in the case of servo control). The operation of the servo amplifier of the servomotor is well-known and will not be described.

[0004] An example of the configuration of the motor control unit 8 with the cover removed of a plan sectional view and a unit case in a side cross-sectional view of FIG. 6 in FIG. In the drawing, reference numeral 2A denotes a unit case formed by aluminum die casting or the like, and a diode module 21, a capacitor 23,
Transistor module 22, a main circuit printed board 4 connecting these main circuit, the arithmetic circuit 13, fixing the printed board 5 of the control circuit, such as PWM generation circuit 11, and the unit case portion 2A-1 for housing the module 21, 22 and a contact portion 2A-2 with the heat-radiating mounting surfaces 21-2 and 22-2, and a heat-radiating fin portion 2A-3 on the back side. The module 21, 22, terminals 2 for electrical connection
1-1, 22-1 and mounting surface 2 for radiating heat
1-2 and 22-2. Terminals 21-1, 22-
1 is connected to the main circuit printed board 4. Generally, in such a motor control unit 8 , the unit case portion 2A-1 is housed in a control panel, and the radiation fin portion 2A-3
Is out of the control panel to enhance the heat dissipation effect.

[0005] Figure 7 is a another configuration example of the motor control unit 8, a fin portion 3B-1 of the heat radiation fins 3B and parallel to the front of the motor control unit 8, the coupling portion 3B
-2, a main circuit component which generates a lot of heat is attached.

Further, as Japanese Patent Publication No. Sho 64-59895 8, the electronic circuit packages incorporating a high density of electronic circuits in a package case 41 of good heat conductor 42
Is mounted on a printed board 43, and a bent piece 45 of an electronic circuit package guide hole of a metal plate 44 provided to be opposed to and substantially parallel to the printed board 43 is attached to the electronic circuit package 42.
The heat generated by the electronic circuit package 42 is transferred to the electronic circuit module 46
An electronic component mounting device that transmits the heat to an external thermal interface 47 has been proposed. Although not shown, the metal plate 44 has a built-in heat pipe, but may be an aluminum plate.

[0007]

Generally, main circuit components such as a diode and a transistor module which generate a large amount of heat are provided with terminals for electrical connection on a rectangular surface having a large area.
A mounting surface for heat dissipation is provided on the opposite side. In the conventional example shown in FIGS. 5 and 6, the large surface area of the main circuit component is arranged in parallel with the front of the motor control unit. For this reason, the width of the unit case (vertical direction in FIG. 5) is limited by the large area of the main circuit components, and therefore there is a limitation in making the unit case thin, and a plurality of motor control units are mounted in a row in a row. If used, a large mounting area is required.

In the example shown in FIG. 7, the radiating fin of the conventional example is rotated by 90 °, and a main circuit component that generates a large amount of heat is attached to the fin. And the heat generated by the main circuit components is restricted.

In the example shown in FIG. 8, the bent portion of the metal plate is brought into contact with the case of the electronic circuit package as the heating element.
Since the heat is transmitted to the heat pipe and transferred to the outside, the heat transfer efficiency is not good.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and it is possible to obtain thin motor control units on the left and right sides with good heat radiation efficiency and to use a plurality of motor control units side by side. An object is to realize a motor control unit having a small mounting area.

[0011]

A motor control unit according to the present invention has a unit case having a flat and substantially rectangular shape, and a printed board on which the semiconductor module is mounted substantially parallel to a wide-area wall of the unit case. with placing and biased substantially parallel to and one wall to the wall of the large area side of the unit case is disposed a plate-shaped heat plate, a portion of the heat plate inside the unit case, others extending outside the unit case, with contacting the heat radiation mounting surface of the semiconductor module to the heat plate inside the unit case, it is brought into contact with the heat radiation fins on both sides of the heat plate outside the unit case, and the heat-radiating The heat sink such that the sum of the height of the fins and the thickness of the heat plate is substantially the same as the width of the unit case. Those obtained by each different height of the radiation fins located on the other side of the height and the heat plate of the heat radiating fins located on one side of the plate.

[0012]

[Action] heat plate of the motor control unit in the present invention, the transfer heat generated in the unit case to radiator fins outside the unit case, is radiated.

[0013]

[Embodiment 1] FIG. 1 is a front sectional view of a motor control unit 8 showing one embodiment of the present invention, and FIG. 2 is a side view of a unit case with a cover removed. In the drawings, the same components as those in the related art are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 2 denotes a unit case having a flat rectangular parallelepiped, and a base unit 2-1 for fixing and mounting a printed board and the like, and a removable cover unit 2-2.
When the motor control unit 8 is mounted on the mounting surface 30 such as a control panel, the motor control unit 8 has a surface that is vertically long in the vertical direction (vertical) and small in the horizontal direction (horizontal). The main circuit printed board 4 and the printed circuit board 5 of the control circuit are arranged in parallel to the left and right walls of the unit case 2, and the printed circuit board includes modules 21 and 22 as main circuit components, an arithmetic circuit 13, and a PWM generation circuit 11. Are mounted and electrically connected. 9 is a hollow plate-shaped heat plate, arranged parallel to the lateral walls of the unit case 2, a portion thereof is within the unit case 2, the other end is protruded to the outer unit case 2. The heat plate 9 in the unit case 2 is in contact with the heat dissipating mounting surfaces 21-2 and 22-2 of the modules 21 and 22 that generate much heat.

[0014] In this embodiment, the semiconductor module
Modules 21, 22 and printed boards 4, 5 etc.
In order to save space in the case 2
Heat plate 9 from the center of the width of unit case 2
It is located at a biased position. In addition, heat
The plate 9 is disposed on the semiconductor module 2
The thickness of 1, 22 is considerably larger than the thickness of printed boards 4, 5.
Therefore, the heat plate 9 is placed in the width of the unit case 2
When it is located in the center, the width of the unit case 2 becomes large.
This is because that.

Further, heat plate 9 of the outer unit case 2, the connecting portion 3-1A of the heat radiation fins 3-1 and 3-2
And 3-2A. Radiation fins 3-1 and 3-
2 fins 3-1B and 3-2B are arranged to make the air flows in the circumferential direction of the motor control unit 8.

[0016] Also, the height of the radiation fins 3-1 and 3-2 and
The sum of the thickness of the heat plate 9 and the thickness of the unit case 2
On one side of the heat plate 9 so that it is almost the same as the width
The radiation fin 3-1 and the other of the heat plate 9
The heights of the radiation fins 3-2 located on the surface
Specifically, the height of the radiation fin 3-1 is
Lower than the height of the pin 3-2.

[0017] In this manner, the radiation fins 3-1 and 3-2
The different heights are used for the following reasons. That is,
The data control unit 8 is mounted on the mounting surface 30 such as a control panel.
The heat plate 9 and the radiation fins 3-1 and 3-
2 is inserted into a hole formed in the mounting surface 30 and mounted.
Therefore, the height of the radiation fins 3-1 and 3-2 and the heat play
The sum of the thickness and the thickness of the hole 9 is the size of the hole formed in the mounting surface 30.
It must be smaller than the modulus, but the sum is too small
Then, the heat radiation efficiency decreases. In addition, the heat radiation efficiency is improved
Therefore, the heat press located outside the unit case 2
Port 9 may be longer, but in this case the motor control
The outer diameter of the entire unit 8 is increased.

[0018] Therefore, in this embodiment,
To save space, heat plate 9 is
Placed at a position offset from the center of the width of the knit case 2
The unit case 2
Heat dissipation efficiency without increasing the length of the heat plate 9
In order to improve the height of the heat radiation fins 3-1 and 3-2,
The sum of the thickness of the heat plate 9 and the thickness of the unit case 2
It is almost the same as the width, that is, the width of the unit case 2.
On one side of the heat plate 9 for effective use
The radiation fin 3-1 and the other of the heat plate 9
The heights of the radiation fins 3-2 located on the surface
It is.

As shown in FIG. 3 (a) , the heat plate 9 is formed by stacking two copper plates or aluminum plates or the like, expanding the center of the plate to make it hollow, and filling the hollow with a working fluid such as ammonia. is there. Now, when the motor control unit 8 operates and the modules 21 and 22 generate heat, the heat is filled from the heat-dissipating mounting surfaces 21-2 and 22-2 of the modules 21 and 22 through the plate of the heat plate 9. When the temperature of the working fluid is increased and becomes equal to or higher than the vaporization temperature of the working fluid, the working fluid is vaporized, and latent heat is lost when the working fluid is vaporized. The vaporized working fluid vapor moves to the outside of the unit case 2 on the low temperature and low pressure side due to the pressure difference, where the vapor of the working fluid is transmitted to the radiation fins 3-1 and 3-2 via the plate of the heat plate 9. It transfers heat and the steam cools, condenses, and liquefies. The liquefied working fluid returns to the modules 21 and 22 in the unit case 2.

As is well known, the heat resistance of the heat plate 9 in the longitudinal direction is extremely small.
The same heat radiation characteristics can be realized as when the two parts directly contact the heat radiation fins 3-1 and 3-2. As shown in FIG. 3A, the heat plate 9 is sized to contact almost the entire surface of the connecting portions 3-1A and 3-2A of the heat radiation fins 3-1 and 3-2. For this reason, the heat generated by the modules 21 and 22 diffuses over almost the entire surface of the radiation fins 3-1 and 3-2, and the temperatures of the radiation fins 3-1 and 3-2 can be substantially equalized. Also,
Since the heat radiation fins are provided on both sides of the heat plate 9, the height of the heat radiation fins can be reduced, so that a temperature difference between the heat radiation fins is hardly generated and efficient heat radiation can be performed.

In this embodiment, the diode module and the transistor module are used as main circuit components which generate a large amount of heat. However, when there are other components which generate a large amount of heat, for example, when a regenerative component or the like is used, this component is used. It is natural to make contact with the heat plate.

[0022]

As described above, in the motor control unit according to the present invention, the unit case is formed in a flat and substantially rectangular parallelepiped shape, and the semiconductor module is mounted substantially parallel to the wide-area wall of the unit case. Along with disposing a printed board, a plate-shaped heat plate is disposed substantially parallel to the wide area side wall of the unit case and offset to one wall, and a part of the heat plate is placed in the unit case . others extend outside the unit case, with contacting the heat radiation mounting surface of the semiconductor module to the heat plate in the uni <br/> Ttokesu, on both sides of the unit <br/> Tokesu outside of the heat plate The radiating fins are brought into contact with each other, and the sum of the height of the radiating fins and the thickness of the heat plate is substantially equal to the width of the unit case. Since the height of the radiation fins located on one surface of the heat plate and the height of the radiation fins located on the other surface of the heat plate are different from each other, the outer dimensions of the motor control unit are increased. The heat dissipation of the module can be efficiently transmitted and radiated to the external radiating fins, and the size of the motor control unit in the left and right direction can be designed to be thin, reducing the mounting area even when multiple motor control units are mounted close to each other in the left and right direction. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan sectional view of a motor control unit showing one embodiment of the present invention.

FIG. 2 is a side view of the unit case of FIG. 1 with a cover removed.

FIG. 3 is a diagram showing the relationship between a heat plate used in the present invention, main circuit components, and heat radiation fins.

FIG. 4 is a block diagram showing a circuit configuration of a general servo amplifier and a diagram showing a main circuit.

FIG. 5 is a plan sectional view of a conventional servo amplifier.

FIG. 6 is a side view of FIG. 5 with a cover of the unit case removed.

FIG. 7 is a plan sectional view of another conventional servo amplifier.

FIG. 8 is a plan sectional view of a conventional electronic component mounting apparatus.

[Explanation of symbols]

2 Unit case 3 Heat radiation fin 4 Main circuit printed board 5 Control circuit printed board 9 Heat plate 21 Diode module (first semiconductor module) 22 Transistor module (second semiconductor module)

Claims (1)

(57) [Claims] 1. A control panel or the like comprising a semiconductor module, a printed board on which the semiconductor module is mounted, a unit case for accommodating the semiconductor module, and radiating fins arranged outside the unit case and on the back thereof along the unit case. A motor control unit mounted such that the unit case and the radiating fins are positioned on the mounting surface of the unit case via the mounting surface, wherein the unit case has a flat, substantially rectangular parallelepiped shape; A printed board on which the semiconductor module is mounted is disposed substantially parallel to the wall of the unit case, and a plate-shaped heat plate is disposed substantially parallel to the wide-area side wall of the unit case and offset to one wall. some of the heat plate inside the unit case and the other extending to the outside of the unit case, prior to the said unit case With contacting the heat radiation mounting surface of the semiconductor module to the heat plate, the unit case outside the contacting the heat dissipating fins on both sides of the human <br/> Topureto, and the height and thickness of the heat plate of the heat radiating fins And the height of the radiating fins located on one surface of the heat plate and the height of the radiating fins located on the other surface of the heat plate so that the sum of the fins is substantially the same as the width of the unit case. A motor control unit characterized by different sizes.