JP2024052035A - Circuit module structure - Google Patents

Abstract

To provide a circuit module structure capable of cooling an electronic component efficiently and reducing the size.SOLUTION: A circuit module structure includes a plurality of electronic components 30, a substrate 20 on which the electronic components 30 are mounted, and a cooling flow channel 40L where cooling water C for cooling the electronic components 30 flows. The substrate 20 includes a first substrate 21, and a second substrate 22 facing the first substrate 21 through the cooling flow channel 40L. The electronic component 30 mounted on the first substrate 21 and the electronic component 30 mounted on the second substrate 22 face the cooling flow channel 40L.SELECTED DRAWING: Figure 2

Description

The present invention relates to a circuit module structure.

Patent Document 1 discloses a power conversion device that aims to miniaturize the device. In the power conversion device disclosed in Patent Document 1, the inside of the case body is divided into two spaces (an upper storage space and a lower storage space in Patent Document 1) by a cooling partition wall in which a cooling water passage through which a cooling medium flows is formed, and electronic components that make up the filter circuit, control boards, etc. are housed separately in the two spaces.

International Publication No. WO 2015/133201

In the power conversion device disclosed in Patent Document 1, electronic components such as capacitors that make up the filter circuit are provided on the side of the control board opposite the cooling partition, so there is room for improvement in terms of efficiently cooling the electronic components.

The present invention was made in consideration of the above problems, and its purpose is to provide a circuit module structure that can efficiently cool electronic components while achieving miniaturization.

The circuit module structure according to the present invention is characterized in that it comprises a plurality of electronic components, a substrate on which the plurality of electronic components are mounted, and a cooling flow path through which cooling water flows to cool the plurality of electronic components, the substrate having a first substrate and a second substrate facing the first substrate via the cooling flow path, and the electronic components mounted on the first substrate and the electronic components mounted on the second substrate face the cooling flow path.

According to this configuration, since the electronic components mounted on the first board and the electronic components mounted on the second board face the cooling flow path, heat generated by the electronic components is collected by the cooling water, and the electronic components can be efficiently cooled. Furthermore, according to this configuration, since multiple electronic components are arranged on either side of the cooling flow path, the length in the extension direction of the cooling flow path can be made more compact than in a configuration in which electronic components are arranged in a row only on one side along the extension direction of the cooling flow path. In this way, a circuit module structure is obtained that can efficiently cool electronic components while achieving miniaturization.

As another feature, the cooling flow path may include a first flow path section, a second flow path section that communicates with the first flow path section, and a step section that is configured by a step between the first flow path section and the second flow path section.

With this configuration, the area (heat transfer area) of the cooling flow path facing the electronic component can be secured not only in the direction in which the cooling flow path extends, but also in the direction intersecting the direction in which the cooling flow path extends (step portion). As a result, the circuit module structure can be made smaller.

As another feature, among the plurality of electronic components, a high heat generating electronic component that generates a relatively large amount of heat may be disposed adjacent to the step portion.

According to this configuration, the high heat generating electronic components are arranged adjacent to the step portion, and the area (heat transfer area) of the cooling flow path facing the high heat generating electronic components is secured, so that the high heat generating electronic components are cooled preferentially. As a result, the high heat generating electronic components can be cooled efficiently.

As another feature, the electronic components include a first component mounted on the first flow path section side of the first substrate, a second component mounted on the second flow path section side of the first substrate, a third component mounted on the first flow path section side of the second substrate, and a fourth component mounted on the second flow path section side of the second substrate, and a plurality of the electronic components may be mounted on the substrate such that the sum of the length of the first component and the length of the third component is equal to the sum of the length of the second component and the length of the fourth component in an orthogonal direction perpendicular to the mounting surface of the electronic components on the substrate.

This configuration makes it possible to align the length of the circuit module structure in the direction perpendicular to the mounting surface of the board, and also makes the cross-sectional area of the cooling flow path uniform, making it possible to miniaturize the circuit module structure.

As another feature, the device may further include a heat dissipation section disposed between the cooling flow path and the electronic component, which dissipates heat generated by the electronic component.

According to this configuration, by interposing a heat dissipation section between the electronic components and the cooling flow path, it is possible to prevent an air layer from being formed between the electronic components and the cooling flow path. Furthermore, even if the heights of multiple electronic components are different, it is possible to prevent an air layer from being formed between the electronic components and the cooling flow path by changing the thickness of the heat dissipation section. As a result, the electronic components can be cooled efficiently.

1 is a perspective view showing a circuit module according to an embodiment; 2 is a cross-sectional view taken along line II-II shown in FIG. FIG. 2 is a diagram illustrating an example of an electronic circuit configured with a plurality of electronic components according to an embodiment. 3 is an enlarged view showing a step portion and its vicinity shown in FIG. 2; 13A and 13B are diagrams illustrating a heat dissipation portion according to another embodiment. FIG. 13 is a diagram showing a cooling section according to another embodiment. FIG. 13 is a diagram illustrating an example of an electronic circuit according to another embodiment.

Below, a circuit module having a circuit module structure according to an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiment, and various modifications are possible without departing from the spirit of the invention.

[Circuit module]
Fig. 1 is a perspective view showing an example of a circuit module 100. Fig. 2 is a cross-sectional view taken along line II-II shown in Fig. 1.

The circuit module 100 is a power conversion device equipped with circuits such as an inverter circuit and a converter circuit. For example, the circuit module 100 converts power supplied from a commercial power source and charges a battery with the converted power, or converts power supplied from a battery installed in a vehicle such as an automobile and supplies the converted power to another battery, a motor, or other electronic device.

As shown in FIG. 1, the circuit module 100 includes a housing 10 having a substantially rectangular parallelepiped shape. The housing 10 is made of a metal such as aluminum or an aluminum alloy. The shape of the housing 10 is not limited to a substantially rectangular parallelepiped shape, and can be changed as appropriate depending on the surrounding environment in which the circuit module 100 is disposed. The material of the housing 10 is also not limited to metals such as aluminum or an aluminum alloy, as long as it is a material with high heat dissipation properties.

The housing 10 is formed with an inlet 10a through which cooling water C for cooling the circuit module 100 flows into the housing 10, and an outlet 10b through which the cooling water C flows out of the housing 10. The cooling water C is composed of a mixture of ethylene glycol and water, etc.

2, the circuit module 100 includes a substrate 20 disposed within the housing 10, a plurality of electronic components 30 mounted on the substrate 20, a cooling section 40 for cooling the electronic components 30, and a heat dissipation section 50 for dissipating heat generated by the electronic components 30. In this specification, mounting refers not only to the electronic components 30 being directly mounted on the substrate 20 by soldering or the like, but also to the electronic components 30 being connected to the substrate 20 by lead wires, bus bars, or the like even if they are not directly mounted (even if they are separated from the substrate 20).

The housing 10 has an internal space S that houses the substrate 20, the electronic components 30, the cooling section 40, and the heat dissipation section 50, and the internal space S includes two spaces partitioned by the cooling section 40. Hereinafter, one of the internal spaces S will be referred to as the "first space S1" and the other as the "second space S2." Note that the orientation of the circuit module 100 during use is not particularly limited, but in the following, the side where the first space S1 is formed will be described as the upper side, the side where the second space S2 is formed will be described as the lower side, the side where the inlet 10a is formed will be described as the right side, and the side where the outlet 10b is formed will be described as the left side.

〔substrate〕
The substrate 20 is, for example, a printed circuit board on which conductor wiring is applied. The substrate 20 has a first substrate 21 arranged in the first space S1 and a second substrate 22 arranged in the second space S2. In this embodiment, the first substrate 21 and the second substrate 22 are arranged in parallel, and the first substrate 21 faces the second substrate 22 via the cooling unit 40. In the following, the surface of the first substrate 21 on which the electronic components 30 are mounted is referred to as the "first mounting surface 211," and the surface of the second substrate 22 on which the electronic components 30 are mounted is referred to as the "second mounting surface 221."

[Electronic Components]
The plurality of electronic components 30 constitute an electronic circuit 310 as shown in Fig. 3. Fig. 3 is a diagram showing an example of an electronic circuit 310 constituted by the plurality of electronic components 30.

As shown in FIG. 3, the electronic circuit 310 is composed of a DC-AC conversion circuit 311 that converts the DC voltage supplied from the first battery B1 into an AC voltage, a transformer circuit 312 that transforms the AC voltage from the DC-AC conversion circuit 311, an AC-DC conversion circuit 313 that converts the AC voltage from the transformer circuit 312 into a DC voltage, and a smoothing circuit 314 that smoothes the voltage from the AC-DC conversion circuit 313. The DC-AC conversion circuit 311 includes semiconductor elements such as multiple MOSFETs (metal-oxide-semiconductor field-effect transistors) and multiple diodes as the electronic components 30 described with reference to FIG. 2. In addition, the transformer circuit 312 includes two coils, the AC-DC conversion circuit 313 includes multiple diodes, and the smoothing circuit 314 includes a capacitor as the electronic components 30.

[Cooling section]
As shown in Fig. 4, the cooling unit 40 includes a cooling flow path 40L through which cooling water C flows to cool the electronic component 30. In this embodiment, the flow path cross-sectional area of the cooling flow path 40L is constant. Hereinafter, the direction in which the cooling water C flows is referred to as the "cooling water flow direction C1." In addition, below, the upstream side in the cooling water flow direction C1 may simply be referred to as the "upstream side," and the downstream side may simply be referred to as the "downstream side."

The cooling flow path 40L is composed of a first wall portion 41 and a second wall portion 42 that is provided parallel to the first wall portion 41. In detail, the first wall portion 41 and the second wall portion 42 are connected to a pair of side walls 10g of the housing 10 described with reference to FIG. 1, and the cooling flow path 40L is composed of a closed space between the first wall portion 41, the second wall portion 42, and the side wall 10g.

The first wall portion 41 and the second wall portion 42 are flat plate-shaped members with a constant thickness and a step, and are made of a metal such as aluminum or an aluminum alloy. Hereinafter, the step portion of the first wall portion 41 will be referred to as the "first step portion 41d," and the step portion of the second wall portion 42 will be referred to as the "second step portion 42d."

The first wall portion 41 includes a first substrate side surface 411 on the substrate 20 side and a first cooling side surface 412 on the opposite side to the first substrate side surface 411. The second wall portion 42 includes a second substrate side surface 421 on the substrate 20 side and a second cooling side surface 422 on the opposite side to the second substrate side surface 421.

2, the cooling flow path 40L extends from the inlet 10a to the outlet 10b inside the housing 10. The cooling flow path 40L includes a first flow path section 401 connected to the inlet 10a, a second flow path section 402 connected to the outlet 10b, and a step section 403 provided between the first flow path section 401 and the second flow path section 402. In other words, the first flow path section 401 is provided upstream of the cooling water flow direction C1, the second flow path section 402 is provided downstream of the cooling water flow direction C1, and the second flow path section 402 is connected to the first flow path section 401 via the step section 403. By providing the step portion 403 in the cooling flow path 40L, the area of the first wall portion 41 and the second wall portion 42 facing the electronic component 30, that is, the area to which heat from the electronic component 30 is transferred (hereinafter referred to as the "heat transfer area"), can be secured not only in the direction in which the cooling flow path 40L extends (left-right direction) but also in the direction perpendicular to the direction in which the cooling flow path 40L extends. As a result, the circuit module 100 can be made smaller.

As shown in FIG. 4, the step portion 403 is composed of a first step portion 41d of the first wall portion 41 and a second step portion 42d of the second wall portion 42. In this embodiment, the step portion 403 is parallel to an imaginary plane VS that intersects with the first substrate 21 and is provided so as to be perpendicular to the substrate 20. In other words, the angle θ between the imaginary plane VS and the first substrate 21 is 90 degrees.

The cooling flow path 40L has a different distance D (hereinafter referred to as "substrate flow path distance D") between the substrate 20 (first substrate 21 or second substrate 22) on the upstream side and downstream side, and the first flow path section 401 is provided on the first substrate 21 side (upper side) in the vertical direction than the second flow path section 402. In other words, the second flow path section 402 is provided on the second substrate 22 side (lower side) than the first flow path section 401.

In detail, the first upstream distance D11 between the first flow path section 401 and the first substrate 21 is set to be smaller than the first downstream distance D12 between the second flow path section 402 and the first substrate 21, and the second downstream distance D22 between the second flow path section 402 and the second substrate 22 is set to be smaller than the second upstream distance D21 between the first flow path section 401 and the second substrate 22.

In this embodiment, the sum of the first upstream distance D11 and the second upstream distance D21 is set to be equal to the sum of the first downstream distance D12 and the second downstream distance D22. The first upstream distance D11 is the distance between the first substrate side surface 411 of the first wall portion 41 on the first flow path portion 401 (including the step portion 403) side and the first mounting surface 211 of the first substrate 21, and the first downstream distance D12 is the distance between the first substrate side surface 411 of the first wall portion 41 on the second flow path portion 402 side and the first mounting surface 211 of the first substrate 21. The second downstream distance D22 is the distance between the second substrate side surface 421 of the second wall portion 42 on the second flow path portion 402 (including the step portion 403) side and the second mounting surface 221 of the second substrate 22, and the second upstream distance D21 is the distance between the second substrate side surface 421 of the second wall portion 42 on the first flow path portion 401 side and the second mounting surface 221 of the second substrate 22. In this embodiment, the first upstream distance D11 and the second downstream distance D22 are different from each other, and are set to be different from the first downstream distance D12 and the second downstream distance D22. The first upstream distance D11, the second downstream distance D22, the first downstream distance D12, and the second downstream distance D22 are set according to the height H of the electronic component 30 mounted on the substrate 20 (the mounting surface (first mounting surface 211 or second mounting surface 221) of the substrate 20 on which the electronic component 30 is mounted).

[Heat dissipation section]
The heat dissipation section 50 is made of a material having thermal conductivity. The heat dissipation section 50 is disposed between the electronic component 30 and the cooling section 40 so as to be in contact with the electronic component 30 and the cooling section 40, and transfers heat generated from the electronic component 30 to the cooling section 40. In this embodiment, the heat dissipation section 50 has a sheet-shaped first heat dissipation member 51.

The first heat dissipation member 51 is flexible and easily adheres to the electronic component 30 and the cooling unit 40 (the first wall 41 or the second wall 42). The first heat dissipation member 51 is made of, for example, graphite or silicon, and the thickness of the first heat dissipation member 51 (the length in the direction perpendicular to the first mounting surface 211 or the second mounting surface 221) is, for example, 0.5 mm, 1.0 mm, etc., which is within the margin of error relative to the height H of the electronic component 30. In Figures 2 and 4 to 6, the thickness of the first heat dissipation member 51 is exaggerated. The first heat dissipation member 51 may be a semi-solid grease that can adhere to the electronic component 30 and the cooling unit 40.

[Electronic component placement]
In this embodiment, the electronic components 30 are arranged in the internal space S so as to increase the cooling efficiency. In detail, the electronic components 30 mounted on the first board 21 are arranged to contact the first board side surface 411 of the first wall portion 41 through the heat dissipation portion 50, and the electronic components 30 mounted on the second board 22 are arranged to contact the second board side surface 421 of the second wall portion 42 through the heat dissipation portion 50. In other words, the electronic components 30 mounted on the first board 21 are arranged to face the cooling flow path 40L, and the electronic components 30 mounted on the second board 22 are arranged to face the cooling flow path 40L. This makes it possible to increase the cooling part facing area of the electronic components 30, and to efficiently cool the electronic components 30. In this embodiment, the cooling part facing area is the area of the part of the electronic components 30 that contacts the cooling part 40 through the heat dissipation portion 50.

In addition, by arranging a plurality of electronic components 30 so as to sandwich the cooling flow path 40L and providing the step portion 403, the length of the housing 10 in the direction in which the cooling flow path 40L extends (left and right direction) can be made compact compared to a configuration in which the electronic components are arranged in a row only on one side along the extension direction of the cooling flow path 40L. Furthermore, since there is no need to provide separate cooling paths for cooling the electronic components 30 mounted on the first board 21 and the electronic components 30 mounted on the second board, the circuit module 100 can be made smaller. In other words, the electronic components 30 can be efficiently cooled while the circuit module 100 can be made smaller. In addition, by arranging the electronic components 30 so as to be in contact with the cooling unit 40 via the heat dissipation unit 50, the formation of an air layer between the electronic components 30 and the cooling unit 40 is suppressed, and the heat generated from the electronic components 30 is efficiently transferred to the cooling unit 40.

In this embodiment, the multiple electronic components 30 are configured with electronic components 30 having different heights H, and the multiple electronic components 30 are arranged in the internal space S so that they can be efficiently cooled by utilizing the difference in height H. In more detail, as shown in FIG. 4, electronic components 30 having different heights H on the upstream side and downstream side are mounted on the board 20. Hereinafter, of the electronic components 30 mounted on the first substrate 21, the electronic component 30 arranged upstream of the downstream end of the step portion 403 (first step portion 41d) is referred to as the "first component 31", the electronic component 30 arranged downstream of the downstream end of the step portion 403 (first step portion 41d) is referred to as the "second component 32", the electronic component 30 arranged upstream of the upstream end of the step portion 403 (second step portion 42d) of the electronic component 30 mounted on the second substrate 22 is referred to as the "third component 33", and the electronic component 30 arranged downstream of the upstream end of the step portion 403 (second step portion 42d) is referred to as the "fourth component 34".

In this embodiment, the first height H1 of the first component 31 is smaller than the second height H2 of the second component 32, and electronic components 30 with a smaller height H than the downstream side are arranged on the upstream side of the first board 21. On the other hand, the third height H3 of the third component 33 is larger than the fourth height H4 of the fourth component 34, and electronic components 30 with a larger height H than the downstream side are arranged on the upstream side of the second board 22. In this embodiment, each of the first height H1, second height H2, third height H3, and fourth height H4, including the height of the first heat dissipation member 51, is configured to be equal to each of the first upstream distance D11, first downstream distance D12, second upstream distance D21, and second downstream distance D22.

In this embodiment, the electronic components 30 are arranged in the internal space S such that the sum of the first height H1 and the third height H3 is equal to the sum of the second height H2 and the fourth height H4. This improves the space utilization efficiency of the internal space S. As a result, the length of the housing 10 in the direction perpendicular to the first mounting surface 211 of the first substrate 21 or the second mounting surface 221 of the second substrate 22 (the vertical direction) can be made uniform, and the circuit module 100 can be made smaller.

[Layout of high heat generating electronic components]
4, among the multiple electronic components 30, an electronic component 30 that generates a relatively large amount of heat (hereinafter, referred to as a "high heat-generating electronic component 30A") is disposed adjacent to the step portion 403. The high heat-generating electronic component 30A is, for example, a coil that constitutes the transformer circuit 312 described with reference to FIG.

The high heat generating electronic component 30A is arranged so as to contact the step portion 403 via the heat dissipation portion 50. More specifically, the high heat generating electronic component 30A is arranged so as to contact the first board side surface 411 of the first step portion 41d of the first wall portion 41 or the second board side surface 421 of the second step portion 42d of the second wall portion 42. The size of the step of the step portion 403 is set based on the height H of the electronic component 30 (high heat generating electronic component 30A) arranged adjacent to the step portion 403.

For electronic components 30 other than the high heat generating electronic component 30A, only the surface (upper or lower surface) opposite to the substrate 20 on which the electronic component 30 is mounted contacts the cooling unit 40 via the heat dissipation unit 50, whereas the high heat generating electronic component 30A is arranged so that in addition to the upper or lower surface, the surface (right or left side surface) perpendicular to the substrate 20 on which the electronic component 30 is mounted contacts the cooling unit 40. That is, the high heat generating electronic component 30A is arranged close to the step portion 403, so that the cooling unit facing area is larger than the cooling unit facing area of electronic components 30 other than the high heat generating electronic component 30A. As a result, the high heat generating electronic component 30A can be efficiently cooled. The high heat generating electronic component 30A may be arranged so that the right side surface or left side surface (the surface perpendicular to the substrate 20 on which the electronic component 30 is mounted) contacts the cooling unit 40 via the heat dissipation unit 50, or may be arranged so that it contacts the cooling unit 40 without the heat dissipation unit 50.

[Another embodiment]
The present invention may be configured as follows other than the above-described embodiment (common numbers and symbols as in the embodiment are used for components having the same functions as in the embodiment).

(1) In this embodiment, the electronic components 30 are mounted on the board 20 so that the sum of the first height H1 and the third height H3 is equal to the sum of the second height H2 and the fourth height H4. Alternatively, the electronic components 30 may be arranged so that the sum of the first height H1 and the third height H3 is different from the sum of the second height H2 and the fourth height H4. In this case, for example, as shown in FIG. 5, the heat dissipation section 50 may include a second heat dissipation member 52 having a thermally conductive rectangular parallelepiped shape in addition to the first heat dissipation member 51. The second heat dissipation member 52 is made of a metal having a higher thermal conductivity than air, such as aluminum or an aluminum alloy. The second heat dissipation member 52 is arranged between the electronic components 30 and the cooling section 40 so as to contact the cooling section 40 (the first board side surface 411 of the first wall portion 41 or the second board side surface 421 of the second wall portion 42) and the electronic components 30 via the first heat dissipation member 51. This makes it possible to prevent an air layer from being formed between the electronic component 30 and the cooling section 40. As a result, the electronic component 30 can be cooled efficiently. The shape of the second heat dissipation member 52 is not limited to a rectangular parallelepiped, and can be changed as desired depending on the shapes of the cooling flow path 40L and the electronic component 30.

(2) In the present embodiment, the heights H of the electronic components 30 are different, but the heights H of the electronic components 30 may be the same. In addition, the multiple electronic components 30 are arranged so as to be in contact with the cooling section 40 (the first board side surface 411 of the first wall section 41 or the second board side surface 421 of the second wall section 42) via the first heat dissipation member 51, but at least one of the multiple electronic components 30 may have an air layer between it and the cooling section 40.

(3) In this embodiment, the electronic component 30 is in contact with the cooling unit 40 via the heat dissipation unit 50, but the electronic component 30 may be in direct contact with the cooling unit 40 without going through the heat dissipation unit 50.

(4) In addition, in the present embodiment, the first wall portion 41 and the second wall portion 42 are described as being flat plates with a constant thickness. However, at least one of the first wall portion 41 and the second wall portion 42 may have at least one of a concave portion and a convex portion on its outer surface (the first board side surface 411 and the second board side surface 421). The concave portion and the convex portion are formed according to the height H of the electronic component 30. For example, as shown in FIG. 6, the first wall portion 41 may include a convex portion 41t that protrudes toward the board 20 (the first board 21 in the example shown in FIG. 6). The convex portion 41t is configured so that the sum of its length L, the height H of the electronic component 30, and the height of the first heat dissipation member 51 is equal to the board-to-board flow path distance D described with reference to FIG. 4. This makes it possible to suppress the formation of an air layer between the electronic component 30 and the cooling section 40.

(5) In this embodiment, the electronic circuit 310 described with reference to FIG. 3 is used as an example of a circuit configured with multiple electronic components 30. However, the circuit configured with multiple electronic components 30 is not limited to the electronic circuit 310 described with reference to FIG. 3 and may be an inverter circuit, a current-voltage conversion circuit, etc.

(6) The electronic circuit 310 composed of the electronic components 30 housed in the housing 10 is not limited to one, and may be two or more. For example, in addition to the electronic circuit 310 (hereinafter referred to as the first electronic circuit 310) described with reference to FIG. 3, an electronic circuit 320 (hereinafter referred to as the second electronic circuit 320) shown in FIG. 8 may be housed in the housing 10. As shown in FIG. 8, the second electronic circuit 320 is composed of a rectifier circuit 321 that rectifies the AC voltage supplied from a commercial power source through a choke coil as the electronic component 30, a frequency conversion circuit 322 that converts the frequency of the AC voltage from the rectifier circuit 321, a transformer circuit 323 that transforms the AC voltage from the frequency conversion circuit 322, an AC-DC conversion circuit 324 that converts the AC voltage from the transformer circuit 323 into a DC voltage, and a smoothing circuit 325 that smoothes the voltage from the AC-DC conversion circuit 324. The rectifier circuit 321 includes a capacitor, a plurality of switching elements, and a plurality of diodes as electronic components 30. In addition, the frequency conversion circuit 322 includes multiple switching elements and multiple diodes, the transformer circuit 323 includes two coils, the AC/DC conversion circuit 324 includes multiple diodes, and the smoothing circuit 325 includes a capacitor as electronic components 30.

(7) The electronic components 30 constituting the electronic circuits 310 and 320 are not limited to the electronic components 30 described with reference to FIG. 3 and FIG. 8. The electronic components 30 constituting the electronic circuits 310 and 320 can be changed as appropriate and may include power elements, HBTs (Heterojunction Bipolar Transistors), etc.

(8) In the present embodiment, the cross-sectional area of the cooling flow path 40L is constant (the cross-sectional areas of the first flow path section 401, the second flow path section 402, and the step section 403 are the same), but the cross-sectional area of the cooling flow path 40L does not have to be constant, and the cross-sectional areas of the first flow path section 401, the second flow path section 402, and the step section 403 may be different. The cross-sectional areas of the first flow path section 401, the second flow path section 402, and the step section 403 may be set according to, for example, the amount of heat generated by the electronic component 30 mounted on the substrate 20.

(9) In this embodiment, the angle θ between the virtual plane VS and the first substrate 21 is 90 degrees, but the angle θ between the virtual plane VS and the first substrate 21 can be changed as appropriate and may be set, for example, based on the cooling efficiency and space usage efficiency. For example, the angle θ between the virtual plane VS and the first substrate 21 may be set to 30 degrees, in which case the pressure loss of the cooling water C can be suppressed.

(10) At least one of the corners of the step portion 403 of the cooling flow path 40L facing the first flow path portion 401 and the second flow path portion 402 may be formed in an arc shape (rounded corner) in a vertical cross-sectional view of the cooling flow path 40L. This makes it possible to suppress pressure loss of the cooling water C flowing through the cooling flow path 40L.

(11) In this embodiment, a configuration has been described in which the first upstream distance D11 and the second downstream distance D22 are different, and the first downstream distance D12 and the second downstream distance D22 are different. However, the first upstream distance D11 and the second downstream distance D22 may be set to be equal, and the first downstream distance D12 and the second upstream distance D21 may be set to be equal.

(12) In this embodiment, the cooling water C flows downward in the step portion 403, but the cooling water C may flow upward in the step portion 403.

(13) In this embodiment, the number of steps (step portion 403) in the cooling flow path 40L is one, but the number of steps is not limited to one and may be two or more.

(14) In this embodiment, the cooling flow path 40L has the step portion 403, but the cooling flow path 40L can omit the step portion 403. In this case, the first flow path portion 401 and the second flow path portion 402 are directly connected (communicated), and the first flow path portion 401 and the second flow path portion 402 are formed on the same plane.

(15) In this embodiment, the high heat generating electronic component 30A is disposed adjacent to the step portion 403, but the high heat generating electronic component 30A does not have to be disposed adjacent to the step portion 403. The high heat generating electronic component 30A may be disposed near the upstream side of the cooling flow path 40L, near a portion of the cooling flow path 40L where the flow path cross-sectional area is larger than the rest, etc. This can increase the cooling efficiency of the high heat generating electronic component 30A.

The present invention can be used in circuit module structures.

20: Substrate 21: First substrate 22: Second substrate 30: Electronic component 30A: High heat generating electronic component 31: First component 32: Second component 33: Third component 34: Fourth component 40L: Cooling flow path 50: Heat dissipation section 100: Circuit module 401: First flow path section 402: Second flow path section 403: Step section C: Cooling water

Claims (5)

A plurality of electronic components;
A substrate on which a plurality of the electronic components are mounted;
a cooling flow path through which cooling water flows to cool the plurality of electronic components;
The substrate includes a first substrate and a second substrate facing the first substrate via the cooling channel;
A circuit module structure, wherein the electronic component mounted on the first substrate and the electronic component mounted on the second substrate face the cooling flow path. The cooling flow path includes:
A first flow path portion;
a second flow path portion communicating with the first flow path portion;
The circuit module structure according to claim 1 , further comprising a step portion defined by a step between the first flow path portion and the second flow path portion. The circuit module structure according to claim 2, wherein among the plurality of electronic components, a high heat generating electronic component that generates a relatively large amount of heat is disposed adjacent to the step portion. The electronic component includes:
A first component mounted on a side of the first flow path portion of the first substrate;
A second component mounted on a side of the second flow path portion of the first substrate;
A third component mounted on the second substrate on a side of the first flow path portion;
a fourth component mounted on the second substrate on a side of the second flow path portion,
4. The circuit module structure according to claim 2, wherein a plurality of the electronic components are mounted on the substrate such that, in a direction perpendicular to a mounting surface of the electronic components on the substrate, a sum of a length of the first component and a length of the third component is equal to a sum of a length of the second component and a length of the fourth component. The circuit module structure according to claim 1 or 2, further comprising a heat dissipation section disposed between the cooling flow path and the electronic component, for dissipating heat generated by the electronic component.

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