WO2019159666A1

WO2019159666A1 - Electronic component with cooler, and inverter

Info

Publication number: WO2019159666A1
Application number: PCT/JP2019/002672
Authority: WO
Inventors: 英明内勢; 田島　豊
Original assignee: 日本電産株式会社
Priority date: 2018-02-13
Filing date: 2019-01-28
Publication date: 2019-08-22
Also published as: CN111699623A; CN111699623B

Abstract

A cooler for cooling an electronic component, the cooler being provided with a structure made of a resin, and being provided with a first, a second, and a third double wall. An end part of the third double wall is connected to an end part of the first and second double walls. The second double wall faces the first double wall. The first and second double walls are respectively provided with a first and second inner wall. The first and second inner walls are respectively provided with a first and second plate made of metal. The first and second plates are fixed to the structure. First and second parts to be cooled, of the electronic component, are respectively in contact with the first and second plates with first and second electrical insulation materials interposed therebetween. The second part to be cooled is set away from the first part to be cooled.

Description

Electronic parts and inverter with cooler

The present invention relates to an electronic component with a cooler and an inverter.

The inverter device described in JP 2014-96881 A includes a capacitor device (paragraph 0016). In the capacitor device, the capacitor is accommodated in a container (paragraph 0017). A first heat exchanger is provided on the first mounting surface of the container (paragraph 0020). A second heat exchanger is provided on the second mounting surface of the container (paragraph 0028). A supply pipe is connected to the first supply part of the first heat exchanger and the second supply part of the second heat exchanger (paragraph 0030). The first exhaust part of the first heat exchanger 44 and the second exhaust part of the second heat exchanger are connected by an exhaust pipe (paragraph 0031).
JP 2014-96881 A

In order to install the capacitor device described in Japanese Patent Application Laid-Open No. 2014-96881 inside the inverter device, a space for arranging the supply pipe and the discharge pipe is required. Further, in order to install the capacitor device inside the inverter device, a space is required for arranging parts for holding and fixing the supply pipe and the discharge pipe. *

Therefore, when the capacitor device described in Japanese Patent Application Laid-Open No. 2014-96881 is installed inside the inverter device, there arises a problem that it is difficult to reduce the size, weight and cost of the inverter device. This problem also occurs when the capacitor is replaced with another electronic component, and also when the capacitor device is installed inside a device other than the inverter device. *

The present invention is made to solve this problem. The problem to be solved by the present invention is to provide an electronic component with a cooler capable of reducing the size, weight and cost of an apparatus including an electronic component with a cooler, and an inverter including the electronic component with a cooler. It is to be.

One exemplary embodiment of the present invention is directed to an electronic component with a cooler. *

The electronic component with a cooler includes a cooler, a first electronic component, a first electrical insulating material, and a second electrical insulating material. *

The cooler includes a structure made of resin. The first electronic component is cooled by a cooler. *

The cooler includes a first double wall, a second double wall, and a third double wall. *

The first double wall has a first end and a second end that are separated from each other in a first direction. The first double wall includes a first inner wall and a first outer wall. The first double wall has a first flow path sandwiched between the first inner wall and the first outer wall. *

The second double wall has a third end and a fourth end that are separated from each other in the second direction. The second double wall includes a second inner wall and a second outer wall. The second double wall has a second flow path sandwiched between the second inner wall and the second outer wall. The second double wall faces the first double wall. *

The third double wall has a fifth end and a sixth end that are separated from each other in a third direction. The fifth end and the sixth end are connected to the second end and the third end, respectively. The third double wall includes a third inner wall and a third outer wall. The third double wall has a third flow path sandwiched between the third inner wall and the third outer wall. The third direction is different from the first direction and the second direction. *

The first inner wall and the second inner wall each include a first plate and a second plate made of metal. The first plate and the second plate are fixed to the structure. *

The first electronic component includes a first cooled portion and a second cooled portion, and is disposed between the first double wall and the second double wall. The second cooled part is separated from the first cooled part. *

The first cooled part is in contact with the first plate via the first electrical insulating material. The second cooled part comes into contact with the second plate via the second electrical insulating material. *

One exemplary aspect of the present invention is also directed to an inverter that includes an electronic component with a cooler.

According to an exemplary embodiment of the present invention, the first electronic component is accommodated in a space inside the cooler. By accommodating the first electronic component in the space inside the cooler, the component that holds and fixes the first electronic component can be omitted. For this reason, an apparatus provided with the electronic component with a cooler can be reduced in size, weight, and cost. *

Moreover, according to one exemplary aspect of the present invention, the second flow path is connected to the first flow path via the third flow path inside the third double wall. A cooling pipe connecting the second flow path to the first flow path by connecting the second flow path to the first flow path via the third flow path inside the third double wall; and Parts for holding and fixing the cooling pipe can be omitted. For this reason, an apparatus provided with the electronic component with a cooler can be reduced in size, weight, and cost. *

Moreover, according to one exemplary aspect of the present invention, the portion of the cooler through which the heat flow from the first cooled portion and the second cooled portion hardly passes is made of resin. For this reason, an apparatus provided with the electronic component with a cooler can be reduced in weight and cost.

1 is a block diagram schematically illustrating an inverter according to a first embodiment. It is sectional drawing which illustrates typically the electronic component with a 1st cooler with which the inverter of 1st Embodiment is equipped. It is an expanded sectional view showing typically some electronic components with a 1st cooler with which the inverter of a 1st embodiment is equipped. It is an expanded sectional view showing typically some electronic components with a 1st cooler with which the inverter of a 1st embodiment is equipped. It is sectional drawing which illustrates typically the 2nd electronic component with a cooler with which the inverter of 1st Embodiment is equipped. It is a block diagram showing typically the inverter of a 2nd embodiment. It is a perspective view which illustrates typically the electronic component with a cooler with which the inverter of a 2nd embodiment is equipped. It is sectional drawing which illustrates typically the electronic component with a cooler with which the inverter of 2nd Embodiment is equipped. It is a perspective view which illustrates typically the cooler with which the inverter of a 2nd embodiment is equipped. It is a perspective view which illustrates typically the structure provided in the inverter of a 2nd embodiment. It is a perspective view which illustrates typically the structure with which the inverter of a 2nd embodiment is equipped, the 1st board, and the 2nd board. It is a top view which illustrates typically the rectification fin with which the inverter of a 2nd embodiment is equipped.

1 First Embodiment

1.1 Outline of the inverter

The first exemplary embodiment of the present invention relates to an electronic component with a cooler and an inverter.

FIG. 1 is a block diagram schematically illustrating the inverter according to the first embodiment. *

An inverter 1000 illustrated in FIG. 1 is an inverter device that operates as a power conversion device that converts direct current into three-phase alternating current. DC and control signals are input to the inverter 1000. Inverter 1000 smoothes the input direct current, and switches the smoothed direct current according to the input control signal to generate a three-phase alternating current. The generated three-phase alternating current is output from the inverter 1000. The output three-phase alternating current is supplied to the electric motor. The generated three-phase alternating current may be supplied to a load other than the electric motor. The inverter 1000 may generate alternating current other than three-phase alternating current. For example, the inverter 1000 may generate a single-phase alternating current. *

The inverter 1000 includes a first electronic component with cooler 1020 and a second electronic component with cooler 1021. *

The first electronic component with a cooler 1020 is an electronic component with a cooler that includes a cooler and a smoothing capacitor that is cooled by the cooler. *

The second electronic component 1021 with a cooler is an electronic component with a cooler including a cooler and a semiconductor power module cooled by the cooler. *

The inverter 1000 may include an electronic component with a cooler other than the first electronic component with cooler 1020 and the second electronic component with cooler 1021. The inverter 1000 may include an electronic component that is not cooled by the cooler in addition to the electronic component that is cooled by the cooler. A device other than the inverter 1000 may include the first electronic component with cooler 1020 and the second electronic component with cooler 1021. *

1.2 First electronic component with cooler

1.2.1 Outline of first electronic component with cooler

FIG. 2 is a cross-sectional view schematically illustrating a first electronic component with a cooler provided in the inverter of the first embodiment. 3 and 4 are enlarged cross-sectional views schematically illustrating a part of the first electronic component with a cooler provided in the inverter according to the first embodiment. 3 and 4 are enlarged views of part A and part B of FIG. 2, respectively.

As shown in FIGS. 2, 3, and 4, the first electronic component 1020 with a cooler includes a cooler 1040, a smoothing capacitor 1041, a first electrical insulator 1042, and a second electrical insulator 1043. Prepare. *

The smoothing capacitor 1041 is a capacitor that becomes a first electronic component in the first electronic component with cooler 1020, is cooled by the cooler 1040, and is cooled by the first electric insulating material 1042 and the second electric insulating material 1043. Electrically isolated from the vessel 1040. The cooler 1040 also serves as a capacitor case. For this reason, the smoothing capacitor 1041 is accommodated in the space 1060 inside the cooler 1040. Smoothing capacitor 1041 smoothes the direct current input to inverter 1000. *

The first electronic component with cooler 1020 may include components other than the cooler 1040, the smoothing capacitor 1041, the first electrical insulating material 1042, and the second electrical insulating material 1043. *

1.2.2 Accommodation of smoothing capacitor

The cooler 1040 has a box shape as illustrated in FIG. 2.

The cooler 1040 includes a first double wall 1081, a second double wall 1082, and a third double wall 1083. *

The first double wall 1081 has a first end 1101 and a second end 1102 that are separated from each other in the first direction D1. The second double wall 1082 has a third end 1103 and a fourth end 1104 that are separated from each other in the second direction D2. The third double wall 1083 has a fifth end 1105 and a sixth end 1106 that are separated from each other in the third direction D3. The second direction D2 is a direction parallel to the first direction D1. The second direction D2 may be inclined from a direction parallel to the first direction D1. The third direction D3 is a direction perpendicular to the first direction D1 and the second direction D2. The third direction D3 may be inclined from a direction perpendicular to the first direction D1 and the second direction D2. Therefore, the third direction D3 is defined as a direction different from the first direction D1 and the second direction D2. *

The second double wall 1082 faces the first double wall 1081. More specifically, the second double wall 1082 faces the first double wall 1081 through the capacitor 1360. The fifth end 1105 of the third double wall 1083 is connected to the second end 1102 of the first double wall 1081. The sixth end 1106 of the third double wall 1083 is connected to the third end 1103 of the second double wall 1082. *

The cooler 1040 further includes a wall 1120. *

The wall 1120 includes a seventh end 1107 and an eighth end 1108 that are separated from each other in the fourth direction D4. The fourth direction D4 is a direction parallel to the third direction D3. The fourth direction D4 may be inclined from a direction parallel to the third direction D3. The fourth direction D4 is a direction perpendicular to the first direction D1 and the second direction D2. The fourth direction D4 may be inclined from a direction perpendicular to the first direction D1 and the second direction D2. Accordingly, the fourth direction D4 is defined as a direction different from the first direction D1 and the second direction D2. *

The wall 1120 faces the third double wall 1083. More specifically, the wall 1120 faces the third double wall 1083 through the capacitor 1360. The seventh end 1107 of the wall 1120 is connected to the first end 1101 of the first double wall 1081. The eighth end 1108 of the wall 1120 is connected to the fourth end 1104 of the second double wall 1082.

The cooler 1040 further includes a bottom 1140. *

The cooler 1040 has an internal space 1060 that is surrounded on all sides by a first double wall 1081, a second double wall 1082, a third double wall 1083, and a wall 1120. The bottom 1140 closes one opening of the space 1060 inside the cooler 1040. The cooler 1040 may include a lid that closes the other opening of the space 1060 inside the cooler 1040. The first double wall 1081, the second double wall 1082, the third double wall 1083, the wall 1120, and the bottom 1140 constitute a cooler 1040 having a rectangular parallelepiped shape. Both or one of the wall 1120 and the bottom 1140 may be omitted. When both the wall 1120 and the bottom 1140 are omitted, the first double wall 1081, the second double wall 1082, and the third double wall 1083 provide a cooler having a U-shape. It is done. When the wall 1120 is omitted, a cooler having an interior space in which one side is surrounded by the first double wall 1081, the second double wall 1082, and the third double wall 1083 is opened. It is done. *

The smoothing capacitor 1041 is disposed between the first double wall 1081 and the second double wall 1082. The smoothing capacitor 1041 is accommodated in the space 1060 inside the cooler 1040 by arranging the smoothing capacitor 1041 between the first double wall 1081 and the second double wall 1082. Generally speaking, the smoothing capacitor 1041 is larger than other electronic components. Since the smoothing capacitor 1041 is accommodated in the space 1060 inside the cooler 1040, a terminal for holding and fixing the smoothing capacitor 1041, which is necessary when the smoothing capacitor 1041 is not accommodated in the space 1060 inside the cooler 1040, etc. This part can be omitted. The part is large and bulky and forms a dead space around it. For this reason, since the said part can be abbreviate | omitted, the inverter 1000 provided with the electronic component 1020 with a 1st cooler can be reduced in size, weight, and cost. *

1.2.3 Cooling of smoothing capacitor

The smoothing capacitor 1041 generates heat by current. Further, the heat generation of the smoothing capacitor 1041 increases as the capacity of the smoothing capacitor 1041 decreases. The reason why the heat generation of the smoothing capacitor 1041 increases as the capacity of the smoothing capacitor 1041 decreases is because the load per capacity increases.

On the other hand, when cooling measures such as adopting a structure for actively cooling the smoothing capacitor 1041 are insufficient, for example, when the smoothing capacitor 1041 is covered with resin, the smoothing capacitor 1041 is not effectively cooled. When the smoothing capacitor 1041 is not effectively cooled, the capacity of the smoothing capacitor 1041 is increased in order to reduce the load per capacity and reduce the heat generation of the smoothing capacitor 1041. However, when the capacity of the smoothing capacitor 1041 is increased, the smoothing capacitor 1041 is increased. When the smoothing capacitor 1041 is increased, the inverter 1000 is also increased. *

For this reason, in order to reduce the size of the inverter 1000, the smoothing capacitor 1041 needs to be effectively cooled in order to reduce the capacity of the smoothing capacitor 1041. *

The smoothing capacitor 1041 includes a capacitor such as a film capacitor, and includes a first electrode 1161 and a second electrode 1162 as illustrated in FIGS. 2, 3, and 4. The first electrode 1161 is disposed at one end of the smoothing capacitor 1041. The second electrode 1162 is disposed at the other end of the smoothing capacitor 1041. In order for the smoothing capacitor 1041 to be effectively cooled, the first electrode 1161 and the second electrode 1162 need to be effectively cooled. However, when two coolers for cooling the first electrode 1161 and the second electrode 1162 are provided, a space corresponding to the size of the two coolers is required. In addition, a space for arranging piping connecting two coolers is also required. In addition, a space for arranging parts for holding and fixing the two coolers is also required. For this reason, a large space is required. Inverter 1000 is also provided with a cooler that cools the semiconductor power module. Therefore, the influence of the size of the piping that connects the two coolers and the size of the parts that hold and fix the two coolers on the size of inverter 1000 Is big. *

Further, in the cooler 1040, in order to flow the heat flow from the smoothing capacitor 1041, the portion through which the heat flow from the smoothing capacitor 1041 passes needs to be made of a metal having high thermal conductivity. However, when the entire cooler 1040 is made of metal, it is difficult to reduce the weight and cost of the cooler 1040 and the inverter 1000. *

Hereinafter, the structure of the cooler 1040 that can effectively cool the smoothing capacitor 1041 and can reduce the size, weight, and cost of the inverter 1000 will be described. *

As shown in FIGS. 2, 3, and 4, the cooler 1040 includes a structure 1160 made of resin. The cooler 1040 includes a first plate 1181 and a second plate 1182 made of metal. The metal may be a pure metal or an alloy. The first plate 1181 and the second plate 1182 are fixed to the structure body 1160. Therefore, the structure body 1160 serves as a support body that supports the first plate 1181 and the second plate 1182. The cooler 1040 is manufactured by, for example, joining the first plate 1181 and the second plate 1182 to the structure 1160. The first plate 1181 is a metal plate on one side. The second plate 1182 is a metal plate on the other side. For this reason, the second plate 1182 faces the first plate 1181. *

The cooler 1040 has a double structure in which boxes are stacked. *

As illustrated in FIGS. 2 and 3, the first double wall 1081 includes a first inner wall 1201 and a first outer wall 1221 constituting a double structure. The first inner wall 1201 includes a first plate 1181 made of metal. The first double wall 1081 has a first flow path 1241 sandwiched between the first inner wall 1201 and the first outer wall 1221. The first flow path 1241 has a coolant inlet 1260 at the first end 1101. *

As shown in FIGS. 2 and 4, the second double wall 1082 includes a second inner wall 1202 and a second outer wall 1222 that form a double structure. The second inner wall 1202 is opposed to the first inner wall 1201 and includes a second plate 1182 made of metal. The second double wall 1082 has a second flow path 1242 sandwiched between the second inner wall 1202 and the second outer wall 1222. The second flow path 1242 has a coolant outlet 1261 at the fourth end 1104. *

As illustrated in FIG. 2, the third double wall 1083 includes a third inner wall 1203 and a third outer wall 1223 constituting a double structure. The third double wall 1083 has a third flow path 1243 sandwiched between the third inner wall 1203 and the third outer wall 1223. The third flow path 1243 is connected to the first flow path 1241 at the fifth end 1105 of the third double wall 1083, and the third flow path 1243 is connected to the first end 1106 of the third double wall 1083. 2 channel 1242. *

Since the third flow path 1243 is connected to the first flow path 1241 and the second flow path 1242, the first flow path 1241, the third flow path 1243, and the second flow path from the coolant inlet 1260. A path that reaches the coolant outlet 1261 sequentially through the flow path 1242 is formed. The cooling liquid 1320 enters the first flow path 1241 through the cooling liquid inlet 1260, and sequentially flows through the first flow path 1241, the third flow path 1243, and the second flow path 1242. The second channel 1242 exits through the outlet 1261. *

The coolant inlet 1260 is connected to a pipe for guiding the coolant. The first flow path 1241 is a path portion that is inside the first double wall 1081 and occupies a part of the path. The third flow path 1243 is a side path portion that occupies a part of the path inside the third double wall 1083 between the first double wall 1081 and the second double wall 1082. ing. The second flow path 1242 is a path portion that is inside the second double wall 1082 and occupies a part of the path. The coolant outlet 1261 is connected to a pipe for guiding the coolant. *

One surface 1281 of the first plate 1181 is exposed to the first flow path 1241 as shown in FIG. For this reason, the coolant 1320 flowing through the first flow path 1241 directly contacts one surface 1281 of the first plate 1181. One surface 1282 of the second plate 1182 is exposed to the second flow path 1242, as shown in FIG. For this reason, the coolant 1320 flowing through the second flow path 1242 directly contacts one surface 1282 of the second plate 1182. *

The first double wall 1081, the second double wall 1082, and the third double wall 1083 constitute a double wall having a U-shape, as shown in FIG. Therefore, the first flow path 1241, the second flow path 1242, and the third flow path 1243 included in the first double wall 1081, the second double wall 1082, and the third double wall 1083, respectively, A flow path having a U-shape is formed. Therefore, the double wall having a U-shape has a flow path having a U-shape. The U-shaped flow path guides the coolant 1320 on the plane disposed at the position of the first flow path 1241 and on the plane disposed at the position of the second flow path 1242. *

The cooling liquid 1320 is cooling water made of water or an aqueous solution. For this reason, the 1st flow path 1241, the 2nd flow path 1242, and the 3rd flow path 1243 become a water channel. The water channel through which the cooling water flows is also called a cooling water channel. The cooling liquid 1320 may be a cooling liquid other than the cooling water. *

The degree of freedom of the shape of the structure 1160 made of resin is large. For this reason, the freedom degree of the shape of the cooler 1040 comprised by the structure 1160 which consists of resin except the 1st board 1181 and the 2nd board 1182 is large. Since the degree of freedom of the shape of the cooler 1040 is large, it is easy to produce a double wall having a U-shaped shape having a flow path having a U-shaped shape. It is also easy to form a bent portion having a wide width necessary for forming a flow path having a U-shape. *

In the cooler 1040, the second flow path 1242 is connected to the first flow path 1241 through the third flow path 1243 inside the third double wall 1083. The second flow path 1242 is connected to the first flow path 1241 through the third flow path 1243 inside the third double wall 1083, whereby the second flow path 1242 is connected to the first flow path 1241. It is possible to omit the cooling pipe to be connected to and parts for holding and fixing the cooling pipe. For this reason, the inverter 1000 can be reduced in size, weight, and cost. *

In addition, the third double wall 1083 having the third flow path 1243 that connects the second flow path 1242 to the first flow path 1241 is made of a resin, and is one of the coolers 1040 having a box shape. Part. For this reason, it is easy to form the third double wall 1083 that contributes to space saving. *

The smoothing capacitor 1041 includes a first cooled portion 1341 and a second cooled portion 1342 as illustrated in FIGS. 2, 3, and 4. The first cooled part 1341 is the first electrode 1161. The second cooled part 1342 is the second electrode 1162. The position of the other end of the smoothing capacitor 1041 where the second electrode 1162 is disposed is different from the position of one end of the smoothing capacitor 1041 where the first electrode 1161 is disposed. For this reason, the second cooled part 1342 is separated from the first cooled part 1341. *

As described above, the flow path having the U-shape guides the coolant 1320 on two planes respectively disposed at two different positions. Therefore, according to the flow path having a U-shape, the smoothing capacitor 1041 that releases heat from the first cooled portion 1341 and the second cooled portion 1342 that are respectively arranged at two different positions is effective. Cooled.

The first cooled portion 1341 is disposed in the space 1060 inside the cooler 1040 and is in contact with the first plate 1181 through the first electrical insulating material 1042. As described above, the coolant 1320 flowing through the first flow path 1241 directly contacts one surface 1281 of the first plate 1181. Further, the first cooled portion 1341 is in contact with the other surface 1301 of the first plate 1181 through the first electrical insulating material 1042. In addition, since the first plate 1181 is made of a metal having high thermal conductivity, the first plate 1181 is a heat radiating plate that allows a heat flow to flow through the coolant 1320. For this reason, the heat released from the first cooled part 1341 is transmitted to the coolant 1320 flowing through the first flow path 1241 via the first plate 1181. By transferring heat through the first plate 1181 having high thermal conductivity, the first cooled portion 1341 is effectively cooled. The second cooled portion 1342 is disposed in the space 1060 inside the cooler 1040 and is in contact with the second plate 1182 through the second electrical insulating material 1043. As described above, the coolant 1320 flowing through the second flow path 1242 directly contacts one surface 1282 of the second plate 1182. Further, the second cooled portion 1342 is in contact with the other surface 1302 of the second plate 1182 through the second electrical insulating material 1043. In addition, since the second plate 1182 is made of a metal having high thermal conductivity, the second plate 1182 is a heat radiating plate that allows a heat flow to flow through the coolant 1320. For this reason, the heat released from the second cooled portion 1342 passes through the second plate 1182 made of a metal having high thermal conductivity to the coolant 1320 flowing through the second flow path 1242. Reportedly. By transferring heat through the second plate 1182 having high thermal conductivity, the second cooled part 1342 is effectively cooled. *

In the cooler 1040, the coolant 1320 to which heat is not transferred passes through the coolant inlet 1260 and enters the first flow path 1241, and the coolant 1320 to which heat is transferred passes through the coolant outlet 1261. By exiting the second flow path 1242, the coolant 1320 to which heat has been transferred is replaced with the coolant 1320 to which heat has not been transferred. *

The smoothing capacitor 1041 is effectively cooled by the first to third technical features described above. The first technical feature is that the heat emitted from the first cooled portion 1341 passes through the first plate 1181 having high thermal conductivity to the coolant 1320 flowing through the first flow path 1241. It is to be communicated. The second technical feature is that the heat released from the second cooled portion 1342 passes through the second plate 1182 having a high thermal conductivity to the coolant 1320 flowing through the second flow path 1242. It is to be communicated. A third technical feature is that the coolant 1320 to which heat is transmitted is replaced with a coolant 1320 to which heat is not transmitted. When the smoothing capacitor 1041 is effectively cooled, the capacity of the smoothing capacitor 1041 can be reduced. When the capacity of the smoothing capacitor 1041 can be reduced, the smoothing capacitor 1041, the first electronic component with cooler 1020, and the inverter 1000 can be downsized. *

The first electrical insulating material 1042 is an electrically necessary insulating material and has a plate shape. The first electrical insulating material 1042 prevents the first cooled portion 1341 from coming into direct contact with the first plate 1181. In addition, the first cooled portion 1341 is electrically insulated from the first plate 1181. The second electrical insulating material 1043 is an electrically necessary insulating material and has a plate shape. The second electrically insulating material 1043 prevents the second cooled portion 1342 from coming into direct contact with the second plate 1182. Further, the second cooled portion 1342 is electrically insulated from the second plate 1182. *

The first cooled portion 1341 is brought into close contact with the first electrical insulating material 1042 or joined to the first electrical insulating material 1042. The first electrical insulating material 1042 is brought into close contact with the first plate 1181 or bonded to the first plate 1181. Due to the close contact or bonding, the thermal resistance between the first cooled part 1341 and the first plate 1181 is lowered, and the first cooled part 1341 is effectively cooled. The second cooled portion 1342 is brought into close contact with the second electrical insulating material 1043 or joined to the second electrical insulating material 1043. The second electrical insulating material 1043 is brought into close contact with the second plate 1182 or joined to the second plate 1182. Due to the close contact or bonding, the thermal resistance between the second cooled portion 1342 and the second plate 1182 is lowered, and the second cooled portion 1342 is effectively cooled. *

In the cooler 1040, the portion through which the heat flow from the first cooled portion 1341 and the second cooled portion 1342 passes is made of metal. However, the portion through which the heat flow from the first cooled portion 1341 and the second cooled portion 1342 hardly passes is made of resin. For this reason, the cooler 1040, the electronic component 1020 with a cooler, and the inverter 1000 can be reduced in weight and cost. *

One surface 1281 of the first plate 1181 and one surface 1282 of the second plate 1182 may have heat radiation fins. The heat radiation fins facilitate heat transfer from the first plate 1181 and the second plate 1182 to the coolant 1320. Since heat is easily transferred from the first plate 1181 and the second plate 1182 to the coolant 1320, the first cooled portion 1341 and the second cooled portion 1342 are effectively cooled, respectively. *

1.2.4 Structure of smoothing capacitor

As shown in FIG. 2, the smoothing capacitor 1041 includes a plurality of capacitors 1360, a first bus bar electrode 1361, and a second bus bar electrode 1362. The smoothing capacitor 1041 may include a member other than the plurality of capacitors 1360, the first bus bar electrode 1361, and the second bus bar electrode 1362.

First bus bar electrode 1361 is electrically connected to one electrode 1380 provided for each of a plurality of capacitors 1360. Second bus bar electrode 1362 is electrically connected to the other electrode 1381 provided in each of the plurality of capacitors 1360. A plurality of capacitors 1360 are electrically connected in parallel by the first bus bar electrode 1361 and the second bus bar electrode 1362. The plurality of capacitors 1360 may be replaced with one capacitor. When the plurality of capacitors 1360 are replaced with one capacitor, the first bus bar electrode 1361 and the second bus bar electrode 1362 may be omitted. *

The first bus bar electrode 1361 includes a first cooled part 1341. The second bus bar electrode 1362 includes a second cooled part 1342. *

At least a part of the first bus bar electrode 1361 and the second bus bar electrode 1362 is covered with a double wall having a U-shape. Since the first bus bar electrode 1361 and the second bus bar electrode 1362 are covered with a U-shaped double wall, the heat generated by the plurality of capacitors 1360 is generated by the first bus bar electrode 1361 and the second bus bar. It is transmitted to the coolant 1320 flowing through the first flow path 1241 and the second flow path 1242 via the electrodes 1362, respectively. The heat generated by the plurality of capacitors 1360 is transmitted to the coolant 1320, so that heat is radiated from the plurality of capacitors 1360. *

1.3 Electronic component with second cooler

FIG. 5 is a cross-sectional view schematically illustrating a second electronic component with a cooler provided in the inverter of the first embodiment.

In the second electronic component 1021 with a cooler illustrated in FIG. 5, the smoothing capacitor 1041 is replaced with the semiconductor power module 1541, and the shape of the cooler 1040 is adapted to the semiconductor power module 1541 from the shape suitable for the smoothing capacitor 1041. It is different from the first electronic component with cooler 1020 shown in FIG. 2 in that the shape is changed. *

In FIG. 5, when the configuration of the second electronic component with cooler 1021 corresponds to the configuration of the first electronic component with cooler 1020, the reference given to the configuration of the first electronic component with cooler 1020 is attached. The same reference numerals as the reference numerals are attached to the configuration of the second electronic component 1021 with a cooler. In the description of the electronic component 1021 with the second cooler, when the configuration of the electronic component 1021 with the second cooler corresponds to the configuration of the electronic component 1020 with the first cooler, the second cooler A duplicate description of the configuration of the attached electronic component 1021 is omitted. *

The semiconductor power module 1541 is a semiconductor power module that becomes the first electronic component in the second electronic component with cooler 1021. The semiconductor power module 1541 switches the smoothed direct current according to the control signal input to the inverter 1000 to generate a three-phase alternating current. *

In the second electronic component with cooler 1021, the first cooled part 1341 is the back surface of the semiconductor power module 1541. The second cooled part 1342 is the surface of the semiconductor power module 1541. The back surface of the semiconductor power module 1541 is one surface of the semiconductor power module 1541. The surface of the semiconductor power module 1541 is the other surface of the semiconductor power module 1541. The height of the back surface of the semiconductor power module 1541 is different from the height of the surface of the semiconductor power module 1541. For this reason, the second cooled part 1342 is separated from the first cooled part 1341. *

The second electronic component 1021 with the cooler has the same advantages as the electronic component 1020 with the first cooler. *

The smoothing capacitor 1041 is replaced with a coil, and the shape of the cooler 1040 is changed from a shape that fits the smoothing capacitor 1041 to a shape that fits the coil, and the first electronic component with cooler 1020 shown in FIG. Different electronic components with a cooler have advantages similar to those of the first electronic component with cooler 1020. *

2 Second Embodiment

2.1 Outline of the inverter

The second exemplary embodiment of the present invention relates to an electronic component with a cooler and an inverter.

FIG. 6 is a block diagram schematically illustrating the inverter according to the second embodiment. *

An inverter 2000 illustrated in FIG. 6 is an inverter device that operates as a power conversion device that converts direct current into three-phase alternating current, similarly to the inverter 1000 illustrated in FIG. 1. *

The inverter 2000 includes an electronic component 2022 with a cooler. *

The electronic component 2022 with a cooler is an electronic component with a cooler including a cooler, a smoothing capacitor cooled by the cooler, and a semiconductor power module. *

The inverter 2000 may include an electronic component with a cooler other than the electronic component 2022 with a cooler. The inverter 2000 may include an electronic component that is not cooled by the cooler in addition to the electronic component that is cooled by the cooler. A device other than the inverter 2000 may include the electronic component 2022 with a cooler. *

2.2 Electronic parts with cooler

FIG. 7 is a perspective view schematically illustrating an electronic component with a cooler provided in the inverter of the second embodiment. FIG. 8 is a cross-sectional view schematically illustrating an electronic component with a cooler provided in the inverter of the second embodiment. FIG. 8 illustrates a cross section at the position of section line CC in FIG.

The electronic component 2022 with a cooler illustrated in FIGS. 7 and 8 includes a semiconductor power module 1541 and a third electrical insulating material 2044, and the electronic component cooled by the cooler 1040 is changed from the smoothing capacitor 1041 alone to the smoothing capacitor. It differs from the 1st electronic component 1020 with a cooler shown in FIG. 2 by the point changed to 1041 and the semiconductor power module 1541. FIG. *

7 and 8, when the configuration of the electronic component with cooler 2022 corresponds to the configuration of the first electronic component with cooler 1020, the reference attached to the configuration of the first electronic component with cooler 1020 is referred to. The same reference numerals as the reference numerals are given to the configuration of the electronic component 2022 with a cooler. In the description of the electronic component 2022 with the cooler, when the configuration of the electronic component 2022 with the cooler corresponds to the configuration of the first electronic component with cooler 1020, the configuration of the electronic component 2022 with the cooler is duplicated. Explanation is omitted.

As shown in FIGS. 7 and 8, the electronic component 2022 with a cooler includes a cooler 1040, a smoothing capacitor 1041, a semiconductor power module 1541, a first electrical insulation material 1042, a second electrical insulation material 1043, and a second electrical insulation material 1043. 3 electrical insulation 2044. *

The smoothing capacitor 1041 is a capacitor that becomes a first electronic component in the electronic component 2022 with a cooler, is cooled by the cooler 1040, and is cooled from the cooler 1040 by the first electrical insulating material 1042 and the second electrical insulating material 1043. Electrically insulated. Smoothing capacitor 1041 smoothes the direct current input to inverter 2000. *

The semiconductor power module 1541 is a semiconductor power module that becomes the second electronic component in the electronic component 2022 with the cooler, and is cooled by the cooler 1040 and electrically insulated from the cooler 1040 by the third electrical insulating material 2044. The The semiconductor power module 1541 switches the smoothed direct current to generate a three-phase alternating current. *

The semiconductor power module 1541 includes a plurality of semiconductor elements that perform a switching operation. Each of the plurality of semiconductor elements is an insulated gate bipolar transistor (IGBT). For this reason, the semiconductor power module 1541 is an IGBT module. The semiconductor power module 1541 may be a semiconductor power module other than the IGBT module. *

The cooler 1040 provided in the electronic component 2022 with the cooler includes a third plate 2183 made of metal. The metal may be a pure metal or an alloy. The third plate 2183 is fixed to the structure 1160. *

The second outer wall 1222 provided in the electronic component 2022 with a cooler includes a third plate 2183 made of metal. *

One surface 2283 of the third plate 2183 is exposed to the second flow path 1242. For this reason, the coolant 1320 flowing through the second flow path 1242 directly contacts one surface 2283 of the third plate 2183. *

The semiconductor power module 1541 is mounted on the other surface 2303 of the third plate 2183. The semiconductor power module 1541 is disposed in a space outside the cooler 1040 and is in contact with the third plate 2183 via the third electrical insulating material 2044. *

As described above, the coolant 1320 flowing through the second flow path 1242 directly contacts one surface 2283 of the third plate 2183. The semiconductor power module 1541 is in contact with the other surface 2303 of the third plate 2183 through the third electrical insulating material 2044. Further, the third plate 2183 is made of a metal having high thermal conductivity, and thus serves as a heat radiating plate that allows a heat flow to flow through the coolant 1320. For this reason, the heat released from the semiconductor power module 1541 is transmitted to the coolant 1320 flowing through the second flow path 1242 via the third plate 2183 made of metal having high thermal conductivity. By transferring heat via the third plate 2183 having high thermal conductivity, the semiconductor power module 1541 is effectively cooled. *

The third electrical insulating material 2044 has a plate shape. The third electrical insulating material 2044 prevents the semiconductor power module 1541 from coming into direct contact with the third plate 2183. Further, the semiconductor power module 1541 is electrically insulated from the third plate 2183. *

The semiconductor power module 1541 is brought into close contact with the third electrical insulating material 2044 or joined to the third electrical insulating material 2044. The third electrical insulating material 2044 is brought into close contact with the third plate 2183 or joined to the third plate 2183. Due to the close contact or bonding, the thermal resistance between the semiconductor power module 1541 and the third plate 2183 is lowered, and the semiconductor power module 1541 is effectively cooled. *

One surface 2283 of the third plate 2183 is processed to form a heat radiating fin. For this reason, one surface 2283 of the 3rd board 2183 has a radiation fin. The heat dissipating fin is preferably a minute dense heat dissipating fin having a large number of closely spaced fine protrusions. The heat radiation fins facilitate heat transfer from the third plate 2183 to the coolant 1320. Since heat is easily transferred from the third plate 2183 to the coolant 1320, the semiconductor power module 1541 that generates a large amount of heat is effectively cooled. *

The structure of the third plate 2183 may be different from the structures of the first plate 1181 and the second plate 1182. For example, it is allowed that the first plate 1181 and the second plate 1182 have no heat radiation fins even though the third plate 2183 has heat radiation fins. *

In the case where a structure in which two or more plates made of metal are bonded to the structure 1160 made of resin is adopted, a process of giving different structures to the two or more plates is performed on the two or more plates. Even when it is broken, it is easy to arrange the two or more plates. For this reason, the structure of the third plate 2183 being different from the structures of the first plate 1181 and the second plate 1182 does not make the manufacture of the cooler 1040 difficult. *

The electronic component 2022 with the cooler has advantages similar to those of the electronic component 1020 with the first cooler and the electronic component 1021 with the second cooler. *

In addition, according to the electronic component 2022 with the cooler, both the second inner wall 1202 and the second outer wall 1222 as well as the space 1060 inside the cooler 1040 and the space outside the cooler 1040 are smoothing capacitors. It is used for cooling two electronic components comprising 1041 and the semiconductor power module 1541. For this reason, it is possible to reduce the space required for cooling the two electronic components. *

Further, according to the electronic component 2022 with the cooler, the semiconductor power module 1541 is disposed in the vicinity of the smoothing capacitor 1041 with the second double wall 1082 interposed therebetween. For this reason, the 1st bus-bar electrode 1361 and the 2nd bus-bar electrode 1362 which electrically connect the smoothing capacitor 1041 and the semiconductor power module 1541 mutually become short. In addition, since the first bus bar electrode 1361 and the second bus bar electrode 1362 are shortened, the parasitic inductance of the first bus bar electrode 1361 and the second bus bar electrode 1362 is reduced. When the parasitic inductances of the first bus bar electrode 1361 and the second bus bar electrode 1362 are reduced, the surge voltage generated due to the switching operation of the semiconductor element inside the semiconductor power module 1541 is reduced. For this reason, the electrical performance of the electronic component 2022 with a cooler improves. *

As described above, the semiconductor power module 1541 includes a plurality of semiconductor elements. Each semiconductor element becomes a local heat source. Further, each semiconductor element generates a large amount of heat. For this reason, the semiconductor power module 1541 includes a plurality of heat sources. Each heat source becomes a local heat source. The heat generated by each heat source is large. Therefore, the heat generated by the semiconductor power module 1541 is large. *

When the back surface of the semiconductor power module 1541 is cooled, the back surface of the semiconductor power module 1541 needs to be uniformly cooled over a wide range. Therefore, the heat removal performance of the cooler 1040 needs to be uniform over a wide range. The cooler 1040 needs to have high heat removal performance. *

Generally, when the back surface of the semiconductor power module 1541 is cooled by a cooler having a linear cooling water channel extending along a one-stroke path, the back surface of the semiconductor power module 1541 is uniformly spread over a wide range. In order to cool, a cooling water channel becomes long. When the cooling channel becomes longer, the pressure loss increases. When the pressure loss increases, the pump that circulates the cooling water becomes larger. *

On the other hand, when the back surface of the semiconductor power module 1541 is cooled by a cooler having a strip-shaped cooling water channel extending from one end portion to the other end portion of the back surface of the semiconductor power module 1541, the back surface of the semiconductor power module 1541 is wide. In order to cool uniformly over a range, a rectifier that uniformly adjusts the flow of cooling water from one end to the other end in the width direction perpendicular to the direction from one end to the other end is required. The rectifier may occupy some area of the cooler or may be a separate component from the cooler. However, in order to arrange the rectifier, a space for the arrangement is necessary. *

The cooler 1040 has a third flow path 1243 upstream of the second flow path 1242 in which the coolant 1320 for cooling the semiconductor power module 1541 flows. Therefore, by providing a rectifier on the third double wall 1083 having the third flow path 1243, the flow of the coolant 1320 in the second flow path 1242 without increasing the size of the electronic component 2022 with a cooler. The semiconductor power module 1541 can be effectively cooled. *

FIG. 12 is a plan view schematically illustrating rectifying fins provided in the inverter according to the second embodiment. *

In order to provide a rectifier on the third double wall 1083, the third inner wall 1203 or the third outer wall 1223 includes a rectifying fin 2600 illustrated in FIG. *

The rectifying fin 2600 protrudes toward the third flow path 1243 at the third inner wall 1203 or the third outer wall 1223 and has a surface 2620. *

The surface 2620 approaches the peripheral portion 2641 of the third flow path 1243 from the central portion 2640 of the third flow path 1243 as it proceeds in the direction D21 from the fifth end 1105 toward the sixth end 1106. The central portion 2640 and the peripheral portion 2641 of the third flow path 1243 are respectively a central portion and a peripheral portion in a direction that is parallel to the spreading direction of the third inner wall 1203 or the third outer wall 1223 and perpendicular to the direction D21. is there. *

Part of the coolant 1320 flowing through the third flow path 1243 hits the surface 2620 and is guided from the central portion 2640 of the third flow path 1243 to the peripheral portion 2641 of the third flow path 1243. A part of the cooling liquid 1320 is guided to the peripheral portion 2641 of the third flow path 1243, whereby the flow of the cooling liquid 1320 in the third flow path 1243 is adjusted. That is, the flow of the coolant 1320 is suppressed from becoming weak in the peripheral portion 2641 of the third flow path 1243. By suppressing the flow of the coolant 1320 from weakening in the peripheral portion 2641 of the third flow path 1243, the flow of the coolant 1320 in the third flow path 1243 is made uniform. *

The heat flow from the smoothing capacitor 1041 or the semiconductor power module 1541 hardly passes through the third double wall 1083. For this reason, unlike the first double wall 1081 and the second double wall 1082, the third double wall 1083 does not need to be provided with a plate made of metal, and may be made of only resin. For this reason, it is easy and low-cost to provide the rectifying fins 2600 on the third double wall 1083. *

The present invention can be variously modified without departing from the spirit of the invention, and is not limited to the above-described embodiment.

Claims

A cooler having a structure made of resin;

A first electronic component cooled by the cooler;

A first electrical insulation;

A second electrical insulation;

The cooler comprises:

A first end and a second end that are spaced apart from each other in a first direction, and include a first inner wall and a first outer wall, and are sandwiched between the first inner wall and the first outer wall. A first duplex having a first flow path having a coolant inlet at the first end, the first inner wall being made of metal and fixed to the structure. With walls,

A third end and a fourth end facing the first double wall and spaced apart from each other in a second direction, comprising a second inner wall and a second outer wall; The second end wall is sandwiched between the inner wall and the second outer wall and has a coolant outlet at the fourth end, and the second inner wall is made of metal and fixed to the structure. A second double wall comprising a second plate;

A fifth end and a sixth end that are separated from each other in a third direction different from the first direction and the second direction and are connected to the second end and the third end, respectively. An end portion, a third inner wall and a third outer wall, sandwiched between the third inner wall and the third outer wall, and connected to the first flow path at the fifth end portion; A third double wall having a third flow path connected to the second flow path at the sixth end;

The first electronic component includes a first cooled part that contacts the first plate via the first electrical insulating material, and the second electronic component via the second electrical insulating material. A cooler disposed between the first double wall and the second double wall, the second coolable portion being in contact with the first plate and being separated from the first cooled portion Electronic components.
The electronic component with a cooler according to claim 1, wherein the first electronic component is a capacitor, a semiconductor power module, or a coil.
A second electronic component cooled by the cooler;

A third electrical insulation;

Further comprising

The second outer wall includes a third plate made of metal and fixed to the structure,

The electronic component with a cooler according to claim 1 or 2, wherein the second electronic component is in contact with the third plate via the third electrical insulating material.
The first electronic component is a smoothing capacitor for smoothing direct current;

The electronic component with a cooler according to claim 3, wherein the second electronic component is a semiconductor power module that switches a smoothed direct current to generate an alternating current.
The third inner wall or the third outer wall is

2. A rectifying fin having a surface that approaches a peripheral portion of the third flow path from a central portion of the third flow path as it proceeds in a direction from the fifth end to the sixth end. To 4 electronic components with a cooler.
An inverter provided with the electronic component with a cooler in any one of Claim 1-5.