CN112074147A - Radiator assembly, power calculating assembly and server - Google Patents
Radiator assembly, power calculating assembly and server Download PDFInfo
- Publication number
- CN112074147A CN112074147A CN202010783875.9A CN202010783875A CN112074147A CN 112074147 A CN112074147 A CN 112074147A CN 202010783875 A CN202010783875 A CN 202010783875A CN 112074147 A CN112074147 A CN 112074147A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat sink
- substrate
- heat pipe
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 230000017525 heat dissipation Effects 0.000 claims abstract description 79
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 238000002791 soaking Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a radiator assembly, a force calculation assembly and a server, wherein the radiator assembly comprises: a first heat sink and a second heat sink, the first heat sink comprising: first heat dissipation base plate, a side surface of first heat dissipation base plate is provided with main heat pipe, and first radiator and second radiator interval set up, and the second radiator includes: the heat pipe extension section is arranged on the surface of one side of the second heat dissipation substrate, the main heat pipe and the heat pipe extension section are arranged on the same side, the size of the second heat radiator in the first direction is smaller than that of the first heat radiator in the first direction, and the other side of the first heat radiator and the other side of the second heat radiator are on the same plane to leave an accommodating space. By dividing the radiator assembly into the first radiator and the second radiator, the space inside the power calculation assembly can be fully utilized, so that the heat dissipation area of the radiator assembly can be increased, and the heat dissipation capacity of the radiator assembly can be improved.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a radiator assembly, a computing force assembly and a server.
Background
In the related technology, the heat dissipation scheme of the server mainly uses forced air cooling, and an aluminum extrusion heat radiator is additionally arranged on a chip. An aluminum extruded heat sink utilizes an aluminum extrusion molding process to produce the base plate and fin portions of the heat sink. Typically, fin thickness and spacing are optimized to ensure maximum convective heat transfer coefficient multiplied by heat transfer area for a limited volume, and to provide the possibility of aluminum extrusion process implementation.
In practical application, how to improve the heat dissipation effect of a device to be dissipated by using an aluminum extruded heat sink is a technical solution that those skilled in the art want to solve.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the radiator assembly, and the radiator assembly is divided into the first radiator and the second radiator, so that the radiating area of the radiator assembly can be increased, and the radiating capacity of the radiator assembly can be further improved.
The invention also provides a force calculating component.
The invention also provides a server.
A heat sink assembly according to an embodiment of the first aspect of the invention, comprises: a first heat sink and a second heat sink, the first heat sink comprising: first heat dissipation base plate, a side surface of first heat dissipation base plate is provided with main heat pipe, first radiator with the second radiator interval sets up, the second radiator includes: the second radiating substrate, a side surface of the second radiating substrate is provided with a heat pipe extension section, the main heat pipe and the heat pipe extension section are arranged on the same side, the size of the second radiator in the first direction is smaller than that of the first radiator in the first direction, one side of the first radiating substrate is far away from by the first radiator, and one side of the second radiating substrate is far away from by the second radiator on the same plane so as to leave a containing space, and the first direction is the height direction of the first radiator.
According to the radiator assembly provided by the embodiment of the invention, the radiator assembly is divided into the first radiator and the second radiator, so that the internal space of the force calculation assembly can be fully utilized, the radiating area of the radiator assembly can be increased, and the radiating capacity of the radiator assembly can be improved.
According to some embodiments of the invention, the receiving space is provided with a connecting heat pipe at a side adjacent to the first heat sink, the connecting heat pipe being connected between the primary heat pipe and the heat pipe extension.
According to some embodiments of the invention, the first heat sink further comprises: the main heat pipe is arranged on one side surface of the first radiating substrate, and the first radiating fin is arranged on the other side surface of the first radiating substrate; the second heat sink further includes: and the surface of one side of the second radiating substrate is provided with the heat pipe extension section, and the surface of the other side of the second radiating substrate is provided with the second radiating fin.
According to some embodiments of the present invention, a first groove is disposed on a side surface of the first heat dissipation substrate away from the first heat dissipation plate, and the main heat pipe is embedded in the first groove; and a second groove is formed in the surface of one side, far away from the second radiating fin, of the second radiating substrate, and the heat pipe extension section is embedded in the second groove.
According to some embodiments of the present invention, a surface of the first heat dissipation substrate, which is away from the first heat dissipation plate, is provided with a heat conduction pad, and the heat conduction pad protrudes from a surface of the first heat dissipation substrate.
According to some embodiments of the invention, a projection of the thermal pad on the first heat dissipation substrate surface and a projection of the primary heat pipe on the first heat dissipation substrate surface have an overlapping area.
According to some embodiments of the invention, the first heat sink further comprises: the vapor chamber is arranged on the surface of one side, far away from the first radiating fin, of the first radiating substrate.
According to some embodiments of the invention, the first heat-dissipating substrate is a vapor chamber.
According to some embodiments of the invention, the length direction of the primary heat pipe is a second direction, and the third direction is a width direction of the first heat sink; the heat pipe extension includes: the length direction of the first subsection is a second direction, the first subsection corresponds to the main heat pipe, and the length direction of the second subsection is a third direction.
According to some embodiments of the invention, the main heat pipe is divided into two sub-heat pipes; the first subsection and the second subsection are both two, and one of the sub heat pipes is connected with one of the first subsections through the connecting heat pipe.
A force computing assembly according to an embodiment of the second aspect of the invention, comprising: the force calculation board comprises a force calculation substrate, a first electric component and a second electric component, wherein the first electric component and the second electric component are arranged on one side surface of the force calculation substrate and are arranged on the side surface at intervals; the first heat dissipation substrate is arranged on the first side surface of the power calculation substrate and is opposite to the first electric component, the second heat dissipation substrate is arranged on the side surface of the power calculation substrate and is opposite to the second electric component, and the second electric component is arranged in the accommodating space.
A server according to an embodiment of the third aspect of the invention, comprising: the fan is arranged on two sides of the box body; the force calculation assemblies are arranged in the box body and are arranged at intervals in a stacked mode.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a server architecture;
FIG. 2 is a schematic diagram of the force calculating assembly;
FIG. 3 is one embodiment of a heat sink assembly;
FIG. 4 is another embodiment of a heat sink assembly;
figure 5 is yet another embodiment of a heat sink assembly.
Reference numerals:
a server S;
a force calculation component 100;
a force calculation board 10; a force calculation substrate 11; a first electrical component 12; a second electrical component 13;
a heat sink assembly 20;
a first radiator 21; a first heat dissipation substrate 211; a primary heat pipe 212; a first heat sink 213; a thermally conductive pad 214; a vapor chamber 215;
a second heat sink 22; a second heat dissipation substrate 221; a heat pipe extension 222; the first subsection 2221; a second subsection 2222; the second heat radiation fins 223; a connecting heat pipe 23; the accommodating space 24;
a case 200; a fan 300.
Detailed Description
Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.
The following describes the heat sink assembly 20 according to an embodiment of the present invention with reference to fig. 1 to 5, and the present invention also proposes a power assembly 100 having the heat sink assembly 20 described above, and further, the present invention also proposes a server S having the power assembly 100 described above. The heat sink assembly 20 can dissipate heat of the force calculating assembly 100, thereby improving the heat dissipation efficiency of the force calculating assembly 100 and preventing the excessive temperature of the force calculating assembly 100 from damaging electronic components such as chips.
As shown in fig. 3 to 5, the heat sink assembly 20 includes: a first heat sink 21 and a second heat sink 22, the first heat sink 21 including: a first heat dissipation substrate 211, a side surface of the first heat dissipation substrate 211 is provided with a main heat pipe 212, and the second heat sink 22 includes: the second heat dissipation substrate 221, a heat pipe extension 222 is disposed on one side surface of the second heat dissipation substrate 221, and the first heat sink 21 and the second heat sink 22 are disposed at an interval. The heat pipe is mainly used for transferring heat by the vapor-liquid phase change of the working liquid, so that the heat resistance of the heat pipe is low, and the heat pipe has high heat conduction capability. By providing the heat pipes on both the first heat sink 21 and the second heat sink 22, the heat pipes have good thermal conductivity, so that the heat dissipation capability of the heat sink assembly 20 can be further improved.
Also, as shown in fig. 3 to 5, the main heat pipe 212 and the heat pipe extension 222 are disposed on the same side, and the size of the second radiator 22 in the first direction is smaller than the size of the first radiator 21 in the first direction. That is, the height of the first heat sink 21 is smaller than the height of the second heat sink 22. In addition, the side of the first heat sink 21 away from the first heat dissipation substrate 211 and the side of the second heat sink 22 away from the second heat dissipation substrate 221 are on the same plane. Since the height of the first heat sink 21 is smaller than that of the second heat sink 22, and the end of the first heat sink 21 away from the first heat dissipation substrate 211 and the end of the second heat sink 22 away from the second heat dissipation substrate 221 are on the same plane, that is, the first heat dissipation substrate 211 and the second heat dissipation substrate 221 are not on the same plane, the accommodation space 24 can be left on the heat sink assembly 20.
In this way, by dividing the heat sink assembly 20 into the first heat sink 21 and the second heat sink 22, the effective heat dissipation area of the heat sink assembly 20 can be increased when the heat sink assembly 20 is connected to the force calculating assembly 100, and the heat dissipation efficiency of the heat sink assembly 20 can be increased. Because the electrical components on the force computing assembly 100 usually protrude from the surface of the force computing board 10, the accommodating space 24 is provided between the first heat sink 21 and the second heat sink 22, so that the space above the electrical components can be utilized, the heat sink assembly 20 can fully utilize the space inside the server S to extend the heat dissipation area of the heat sink assembly 20, and the heat dissipation capacity of the heat sink assembly 20 can be further improved.
Wherein the first direction is a height direction of the first heat sink 21.
Thus, by dividing the heat sink assembly 20 into the first heat sink 21 and the second heat sink 22, the space inside the force calculating assembly 100 can be fully utilized, so that the heat dissipation area of the heat sink assembly 20 can be increased, and the heat dissipation capability of the heat sink assembly 20 can be increased.
According to the first embodiment of the present invention, as shown in fig. 3, the accommodating space 24 is provided with the connecting heat pipe 23 at a side adjacent to the first heat sink 21, and the connecting heat pipe 23 is connected between the main heat pipe 212 and the heat pipe extension 222. By arranging the connecting heat pipe 23, the main heat pipe 212 and the heat pipe extension 222 can be connected, so that heat exchange can be generated between the main heat pipe 212 and the heat pipe extension 222, and further, heat is introduced into the second heat sink 22, and the overall heat dissipation capacity is improved.
Specifically, the main heat pipe 212, the heat pipe extension 222, and the connecting heat pipe 23 are typically made by bending the same heat pipe.
As shown in fig. 3, the first heat sink 21 further includes: a first heat sink 213, one side surface of the first heat dissipation substrate 211 is provided with the main heat pipe 212, and the other side surface of the first heat dissipation substrate 211 is provided with the first heat sink 213. The second heat sink 22 further includes: a second heat sink 223, one side surface of the second heat dissipation substrate 221 is provided with a heat pipe extension 222, and the other side surface of the second heat dissipation substrate 221 is provided with the second heat sink 223. By arranging the first heat sink 213 on the first heat sink substrate 211 and the second heat sink 223 on the second heat sink substrate 221, the contact area between the heat sink assembly 20 and the air can be increased, so that heat can be conveniently transferred to the air, and the heat dissipation efficiency of the heat sink assembly 20 can be improved.
For example, the first heat sink 21 is provided with the first heat sink fins 213 connected to the first heat sink substrate 211, so that when the electric components corresponding to the first heat sink 21 generate heat, the heat is transferred to the first heat sink substrate 211, the first heat sink fins 213 are formed in a plurality of parallel plate structures, and the contact area between the first heat sink fins 213 and the air is large, so that the heat can be transferred to the air through the first heat sink fins 213. In addition, by providing the main heat pipe 212 on the first heat dissipation substrate 211, the heat conduction efficiency between the first heat dissipation substrate 211 and the electrical component can be improved.
In addition, a first groove is formed on a side surface of the first heat dissipation substrate 211 away from the first heat dissipation fin 213, the main heat pipe 212 is embedded in the first groove, a second groove is formed on a side surface of the second heat dissipation substrate 221 away from the second heat dissipation fin 223, and the heat pipe extension 222 is embedded in the second groove. Through setting up first recess on first heat dissipation base plate 211 to inlay main heat pipe 212 in locating first recess, thereby can make first heat dissipation base plate 211 and calculate power subassembly 100 when contacting, promote the heat exchange efficiency between first heat dissipation base plate 211 and the electrical components through main heat pipe 212. Similarly, the second heat dissipation substrate 221 is provided with a second groove, and the heat pipe extension 222 is embedded in the second groove, so that the heat exchange efficiency between the first heat dissipation substrate 211 and the electrical component is improved. In addition, the space of the heat sink assembly 20 can be effectively utilized, so that the volume and the heat dissipation area of the heat sink assembly 20 can be further increased.
As shown in fig. 3, a heat conductive pad 214 is disposed on a surface of the first heat dissipation substrate 211 away from the first heat sink 213, and the heat conductive pad 214 protrudes from the surface of the first heat dissipation substrate 211. The heat sink assembly 20 may be better contacted by the electrical components via the thermal pad 214, thereby better transferring heat between the heat sink assembly 20 and the electrical components. Furthermore, the heat sink assembly 20 and some components around the electrical components can be easily avoided.
Specifically, the thermal pad 214 is a thermal copper pad, which has good thermal conductivity, so that heat on the electrical component can be transferred to the heat sink assembly 20.
In addition, the heat conducting pad 214 and the heat pipe are directly welded to the heat sink assembly 20, so that the heat dissipation effect is better and the heat pipe cannot be detached during use.
As shown in fig. 3, the projection of the thermal pad 214 on the surface of the first heat dissipation substrate 211 and the projection of the primary heat pipe 212 on the surface of the first heat dissipation substrate 211 have an overlapping region. That is, one face of the thermal pad 214 is in contact with the electrical component and the other face is in contact with the primary heat pipe 212. So set up, can transmit the heat fine transmission for main heat pipe 212 of thermal pad 214 with the electronic component to can promote the radiating efficiency of radiator module 20.
According to the second embodiment of the present invention, as shown in fig. 4, the first heat sink 21 further includes: the heat spreader 215 is disposed on a surface of the first heat sink substrate 211 away from the first heat sink 213. The vapor chamber 215 has good thermal conductivity. By providing the soaking plate 215 on the first heat dissipating substrate 211, the heat generated from the force calculating assembly 100 can be well transmitted and diffused to the entire surface of the first heat dissipating substrate 211, and then transmitted to the outside through the first heat dissipating fin 213. Thus, the heat dissipation efficiency of the heat sink assembly 20 can be improved. Specifically, the heat conductive pad 214 is disposed on the soaking plate 215.
According to a third embodiment of the invention, as shown in fig. 5, the first heat-dissipating substrate 211 may be a heat-equalizing plate 215. That is, the soaking plate 215 replaces the first heat dissipating substrate 211. The soaking plate 215 can better diffuse heat to the entire plane of the first heat-dissipating substrate 211, and the heat transfer efficiency is higher. When the heat sink assembly 20 abuts against the force computing assembly 100, heat generated from the electrical component is directly transferred to the heat spreader plate 215, and then transferred to the outside through the first heat sink 213 attached to the heat spreader plate 215. With this arrangement, the heat dissipation efficiency of the heat sink assembly 20 can be improved. Specifically, the heat conducting pad 214 is disposed on the soaking plate 215, and the main heat pipe 212 is embedded on the soaking plate 215.
As shown in fig. 3, the length direction of the primary heat pipe 212 is the second direction, the third direction is the width direction of the first heat sink 21, and the heat pipe extension 222 includes: a first subsection 2221 and a second subsection 2222 are connected, the length direction of the first subsection 2221 is a second direction, the first subsection 2221 corresponds to the main heat pipe 212, and the length direction of the second subsection 2222 is a third direction. By dividing the heat pipe extension 222 into the first subsection 2221 and the second subsection 2222, which are connected, the area of the heat pipe extension 222 on the second heat sink 22 can be increased, that is, the heat dissipation area can be effectively increased, and not only is the remaining space inside the second heat sink 22 effectively utilized, but also the heat dissipation efficiency of the second heat sink 22 can be improved.
As shown in fig. 3 to 5, the main heat pipe 212 is divided into two sub heat pipes, the two sub heat pipes are two heat pipes spaced on the first heat dissipation substrate 211, the first subsection 2221 and the second subsection 2222 are both two, and one of the sub heat pipes is connected with one of the first subsections 2221 through the connecting heat pipe 23. By arranging the main heat pipe 212 as two sub heat pipes, the area of the main heat pipe 212 on the first heat sink 21 can be increased, that is, the heat dissipation area can be effectively increased, so that the heat dissipation efficiency of the first heat sink 21 can be improved. Moreover, one of the sub-heat pipes is connected to one of the first sub-sections 2221 through the connecting heat pipe 23, so that not only the laying area of the heat pipe on the heat sink assembly 20 can be increased, but also the first heat sink 21 and the second heat sink 22 can be connected together, and thus the heat dissipation efficiency of the heat sink assembly 20 can be increased.
According to the force computing assembly 100 of the second aspect of the embodiment of the present invention, as shown in fig. 2, the force computing assembly 100 includes: the force calculation board 10 comprises a force calculation substrate 11, a first electric component 12 and a second electric component 13, wherein the first electric component 12 and the second electric component 13 are both arranged on one side surface of the force calculation substrate 11, and the first electric component 12 and the second electric component 13 are arranged on the side surface at intervals; the first heat dissipation substrate 211 is disposed on the first side surface of the computation substrate 11, the first heat dissipation substrate 211 is disposed opposite to the first electrical component 12, the second heat dissipation substrate 221 is disposed on the first side surface of the computation substrate 11, the second heat dissipation substrate 221 is disposed opposite to the second electrical component 13, and the second electrical component 13 is disposed in the accommodating space 24.
That is to say, the first heat sink 21 and the first electrical component 12 are disposed correspondingly, and the second heat sink 22 and the second electrical component 13 are disposed correspondingly, because the height of the second electrical component 13 protruding out of the computation force board 10 is greater than the height of the first electrical component 12 protruding out of the computation force board 10, and thus, the accommodating space 24 is disposed on the heat sink assembly 20, and both the first heat sink 21 and the second heat sink 22 can be disposed close to the computation force board 10, so that the heat dissipation efficiency of the computation force assembly 100 can be improved.
Specifically, the first electrical component 12 is a chip, and the second electrical component 13 is a power supply MOS.
According to the server S of the third embodiment of the present invention, as shown in fig. 1, the server S includes: the fan-type power calculating device comprises a box body 200, fans 300 and power calculating assemblies 100, wherein the fans 300 are arranged on two sides of the box body 200, a plurality of sets of power calculating assemblies 100 are arranged in the box body 200, and the power calculating assemblies 100 are arranged at intervals in a stacked mode. The multiple sets of force computing assemblies 100 are stacked in the box 200 to facilitate heat dissipation of the force computing assemblies 100. The fan 300 may blow heat generated from the force calculating assembly 100 out of the case 200.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (12)
1. A heat sink assembly, comprising:
a first heat sink, the first heat sink comprising: the heat pipe structure comprises a first heat dissipation substrate, a second heat dissipation substrate and a heat pipe, wherein a main heat pipe is arranged on the surface of one side of the first heat dissipation substrate;
a second heat sink, the first heat sink and the second heat sink being spaced apart, the second heat sink comprising: the heat pipe extension section is arranged on one side surface of the second heat dissipation substrate, the main heat pipe and the heat pipe extension section are arranged on the same side, the size of the second radiator in the first direction is smaller than that of the first radiator in the first direction, the other side of the first radiator and the other side of the second radiator are on the same plane to form a containing space, and the first direction is the height direction of the first radiator.
2. A heat sink assembly according to claim 1, wherein the receiving space is provided with a connecting heat pipe at a side adjacent to the first heat sink, the connecting heat pipe being connected between the primary heat pipe and the heat pipe extension.
3. The heat sink assembly of claim 2, wherein the first heat sink further comprises: the main heat pipe is arranged on one side surface of the first radiating substrate, and the first radiating fin is arranged on the other side surface of the first radiating substrate;
the second heat sink further includes: and the surface of one side of the second radiating substrate is provided with the heat pipe extension section, and the surface of the other side of the second radiating substrate is provided with the second radiating fin.
4. The heat sink assembly as claimed in claim 3, wherein a side surface of the first heat-dissipating substrate away from the first heat-dissipating fin is provided with a first groove, and the primary heat pipe is embedded in the first groove; and/or
And a second groove is formed in the surface of one side, far away from the second radiating fin, of the second radiating substrate, and the heat pipe extension section is embedded in the second groove.
5. The heat sink assembly as recited in claim 4 wherein a surface of the first heat dissipating substrate on a side away from the first heat dissipating fin is provided with a heat conducting pad, and the heat conducting pad protrudes from a surface of the first heat dissipating substrate.
6. The heat sink assembly of claim 5, wherein a projection of the thermal pad on the first heat-dissipating substrate surface and a projection of the primary heat pipe on the first heat-dissipating substrate surface have an overlapping area.
7. The heat sink assembly of claim 3, wherein the first heat sink further comprises: the vapor chamber is arranged on the surface of one side, far away from the first radiating fin, of the first radiating substrate.
8. The heat sink assembly of claim 3 wherein said first heat-dissipating substrate is a heat spreader.
9. The heat sink assembly of claim 1, wherein the length direction of the primary heat pipe is a second direction and the third direction is a width direction of the first heat sink;
the heat pipe extension includes: the length direction of the first subsection is a second direction, the first subsection corresponds to the main heat pipe, and the length direction of the second subsection is a third direction.
10. The heat sink assembly of claim 9, wherein the primary heat pipe is divided into two sub-heat pipes;
the first subsection and the second subsection are both two, and one of the sub heat pipes is connected with one of the first subsections through the connecting heat pipe.
11. A force computing assembly, comprising:
the force calculation board comprises a force calculation substrate, a first electric component and a second electric component, wherein the first electric component and the second electric component are arranged on one side surface of the force calculation substrate and are arranged on the side surface at intervals;
the heat sink assembly as recited in any one of claims 1 to 10 wherein the first heat-dissipating substrate is disposed on a first side surface of the force-calculating substrate and is disposed opposite to the first electrical component, the second heat-dissipating substrate is disposed on a side surface of the force-calculating substrate and is disposed opposite to the second electrical component, and the second electrical component is disposed in the accommodating space.
12. A server, comprising:
a box body;
the fans are arranged on two sides of the box body;
a plurality of sets of force calculating assemblies as claimed in claim 11, the sets of force calculating assemblies being disposed in the box body and in a stacked spaced arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783875.9A CN112074147A (en) | 2020-08-06 | 2020-08-06 | Radiator assembly, power calculating assembly and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783875.9A CN112074147A (en) | 2020-08-06 | 2020-08-06 | Radiator assembly, power calculating assembly and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112074147A true CN112074147A (en) | 2020-12-11 |
Family
ID=73660785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010783875.9A Pending CN112074147A (en) | 2020-08-06 | 2020-08-06 | Radiator assembly, power calculating assembly and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112074147A (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050207115A1 (en) * | 2004-03-18 | 2005-09-22 | Hewlett-Packard Development Company, L.P. | Heat dissipating arrangement |
| CN101018464A (en) * | 2006-02-10 | 2007-08-15 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101616565A (en) * | 2008-06-27 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Heat abstractor |
| JP2011087117A (en) * | 2009-10-15 | 2011-04-28 | Mitsubishi Electric Corp | Device and method for generation of soft decision information |
| CN102436295A (en) * | 2010-09-29 | 2012-05-02 | 研祥智能科技股份有限公司 | Heat tube heat radiator |
| JPWO2011087117A1 (en) * | 2010-01-18 | 2013-05-20 | 古河電気工業株式会社 | heatsink |
| CN204669788U (en) * | 2014-12-29 | 2015-09-23 | 丰生微电机(上海)有限公司 | Layered heat dissipating device |
| CN105074910A (en) * | 2013-03-21 | 2015-11-18 | 日本电气株式会社 | Heat-sink structure, semiconductor device, and heat-sink mounting method |
| CN108027218A (en) * | 2016-01-20 | 2018-05-11 | 雷神公司 | Multistage swing heat pipe embodiment in electronic circuit card module |
| CN207967586U (en) * | 2018-01-26 | 2018-10-12 | 深圳市杰普特光电股份有限公司 | Laser and radiator |
| CN109413956A (en) * | 2018-11-29 | 2019-03-01 | 武汉精能电子技术有限公司 | Electronic load radiator |
| JP2019047116A (en) * | 2018-08-21 | 2019-03-22 | 古河電気工業株式会社 | Heat sink |
| CN110708932A (en) * | 2019-09-25 | 2020-01-17 | 北京比特大陆科技有限公司 | Radiator and PCB radiating assembly and server with same |
| CN110749123A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
-
2020
- 2020-08-06 CN CN202010783875.9A patent/CN112074147A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050207115A1 (en) * | 2004-03-18 | 2005-09-22 | Hewlett-Packard Development Company, L.P. | Heat dissipating arrangement |
| CN101018464A (en) * | 2006-02-10 | 2007-08-15 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101616565A (en) * | 2008-06-27 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Heat abstractor |
| JP2011087117A (en) * | 2009-10-15 | 2011-04-28 | Mitsubishi Electric Corp | Device and method for generation of soft decision information |
| JPWO2011087117A1 (en) * | 2010-01-18 | 2013-05-20 | 古河電気工業株式会社 | heatsink |
| CN102436295A (en) * | 2010-09-29 | 2012-05-02 | 研祥智能科技股份有限公司 | Heat tube heat radiator |
| CN105074910A (en) * | 2013-03-21 | 2015-11-18 | 日本电气株式会社 | Heat-sink structure, semiconductor device, and heat-sink mounting method |
| CN204669788U (en) * | 2014-12-29 | 2015-09-23 | 丰生微电机(上海)有限公司 | Layered heat dissipating device |
| CN108027218A (en) * | 2016-01-20 | 2018-05-11 | 雷神公司 | Multistage swing heat pipe embodiment in electronic circuit card module |
| CN207967586U (en) * | 2018-01-26 | 2018-10-12 | 深圳市杰普特光电股份有限公司 | Laser and radiator |
| JP2019047116A (en) * | 2018-08-21 | 2019-03-22 | 古河電気工業株式会社 | Heat sink |
| CN109413956A (en) * | 2018-11-29 | 2019-03-01 | 武汉精能电子技术有限公司 | Electronic load radiator |
| CN110708932A (en) * | 2019-09-25 | 2020-01-17 | 北京比特大陆科技有限公司 | Radiator and PCB radiating assembly and server with same |
| CN110749123A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001119181A (en) | Cooling unit for electronic component and electronic apparatus | |
| KR101609253B1 (en) | Socket apparatus for semiconductor module | |
| TWI731622B (en) | Automotive electronic device | |
| EP4030264B1 (en) | Systems for cooling electronic components in a sealed computer chassis | |
| CN212906119U (en) | Server | |
| CN100499977C (en) | Heat sink | |
| CN115551302A (en) | Heat dissipation system and electronic equipment | |
| CN211090362U (en) | Heat dissipation device and electronic equipment | |
| CN210625430U (en) | Loop type thermosyphon heat dissipation device | |
| CN216650328U (en) | Optical module and electronic equipment | |
| CN215867698U (en) | Computing system and sealed server chassis | |
| CN112074147A (en) | Radiator assembly, power calculating assembly and server | |
| CN213545202U (en) | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration | |
| CN115379729A (en) | Heat dissipation module, device, blade server and electronic equipment | |
| CN108419416A (en) | A kind of high heat dissipation capacity heat-pipe radiator of IGBT | |
| KR200319226Y1 (en) | Heat-radiate device for heat-pipe having fan-shape heat-pin | |
| JP4229738B2 (en) | Heat pipe type heat dissipation unit | |
| CN220383421U (en) | Power supply | |
| CN217721817U (en) | Heat radiator | |
| TWI738462B (en) | Computer host | |
| CN220493447U (en) | Fin type radiator | |
| CN212484242U (en) | Server case and server | |
| CN217721808U (en) | Heat dissipation assembly and electronic assembly | |
| TWI831707B (en) | Liquid cooling assembly and server | |
| CN215301268U (en) | GPU board card structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201211 |
|
| RJ01 | Rejection of invention patent application after publication |