CN207967586U - Laser and radiator - Google Patents

Laser and radiator Download PDF

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Publication number
CN207967586U
CN207967586U CN201820154696.7U CN201820154696U CN207967586U CN 207967586 U CN207967586 U CN 207967586U CN 201820154696 U CN201820154696 U CN 201820154696U CN 207967586 U CN207967586 U CN 207967586U
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China
Prior art keywords
radiator
copper base
cooling fin
heat pipe
aluminum substrate
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CN201820154696.7U
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Chinese (zh)
Inventor
强瑞荣
朱江杰
刘健
刘猛
成学平
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Shenzhen JPT Optoelectronics Co Ltd
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Shenzhen JPT Optoelectronics Co Ltd
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Priority to CN201820154696.7U priority Critical patent/CN207967586U/en
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Abstract

A kind of laser, including radiator and the heat source on radiator;Radiator includes the first radiator and the second radiator;If the first radiator includes copper base, the aluminum substrate and dry heat pipe that are connect with copper base;Heat source is fixed on copper base;Heat pipe includes evaporator section and condensation segment, and the evaporator section of heat pipe is connected to the upper surface of copper base, and the condensation segment of heat pipe is connected to the upper surface of aluminum substrate, and the condensation segment of each heat pipe is uniformly distributed in the upper surface of aluminum substrate;The inner surface of copper base is equipped with the first cooling fin;The inner surface of aluminum substrate is equipped with the second cooling fin.Partial heat on copper base is transmitted on aluminum substrate by the radiator of the utility model by heat pipe, it is dispersed into gaseous environment by the first cooling fin of copper base and the second cooling fin of aluminum substrate, to while ensureing radiating efficiency, reducing laser volume, the dosage for reducing copper material, alleviates the weight of laser and radiator.

Description

Laser and radiator
Technical field
The utility model is related to heat conduction techniques, more particularly to a kind of laser and radiator.
Background technology
More and more wider with the application field of laser, the laser demand of more high-power, smaller volume, smaller quality is got over Come wider, under equal-wattage, the laser of smaller volume smaller quality is more rare, advantageously.Laser is scattered at present Thermal is mainly air-cooled and two kinds of water cooling, but is limited by volume and quality, and the application of air-cooled radiating device is more extensive, at present Air-cooled radiating device used is mostly fine copper, fine aluminium radiator in the market, and copper radiator is of high cost, quality is big, is dissipated Hot property is excellent, and the relatively pure copper heat sink use of aluminium radiating device is wider, and cost is lower, but heat dissipation performance is poor, and volume Bigger.Under the requirement of heat radiating device for laser smaller volume, existing scheme generally increases the dosage of pure copper material, leads to laser The weight of device rises.
Utility model content
Based on this, the utility model provide it is a kind of reduction radiator volume while effectively control weight laser and Its radiator.
In order to realize that the purpose of this utility model, the utility model use following technical scheme:
A kind of radiator, including the first radiator and the second radiator for connecting the first radiator;First radiator packet If the aluminum substrate and dry heat pipe that include copper base, connect with the copper base;The lower surface of the copper base is equipped with several first and dissipates Backing;The lower surface of the aluminum substrate is equipped with several second cooling fins;The heat pipe includes evaporator section and condensation segment, the heat pipe Evaporator section be welded on the upper surface of the copper base, the condensation segment of the heat pipe is welded on the upper surface of the aluminum substrate, respectively The condensation segment of the heat pipe is uniformly distributed in the upper surface of the aluminum substrate.
Partial heat on copper base is transmitted on aluminum substrate by the radiator of the utility model by heat pipe, passes through copper The second cooling fin on the first cooling fin and aluminum substrate on substrate is dispersed into gaseous environment, to ensure radiating efficiency, While reducing laser volume, the dosage of copper material is reduced, the weight of laser and radiator is alleviated.
The extending direction of the extending direction of second cooling fin and first cooling fin in one of the embodiments, Unanimously.
One end between first cooling fin and second cooling fin is equipped in one of the embodiments, Angle;There are gaps between first cooling fin and second cooling fin.
The upper surface of the copper base is equipped with corresponding with the evaporator section of the heat pipe the in one of the embodiments, One holds tube seat, and the evaporator section of the heat pipe, which is accommodated in described first, to be held in tube seat;The upper surface of the evaporator section of the heat pipe with The upper surface of the copper base is in the same plane.
The extending direction at the rear portion of the condensation segment of the heat pipe and second cooling fin in one of the embodiments, Extending direction is vertical.
In one of the embodiments, the both sides of the aluminum substrate be equipped with support bar, the extending direction of the support bar with The extending direction of second cooling fin corresponds to;The support bar includes connecting the portion inside of the aluminum substrate, and from described interior The epitaxy part that one end of socket part extends to the copper base side, the copper base are connect with the epitaxy part.
The medial surface of second radiator fits to first cooling fin and described in one of the embodiments, On two cooling fins.
Further include two loading plates in one of the embodiments, the loading plate is equipped with ventilation opening, loading plate installation In the side of the first radiator and the second radiator, another loading plate is mounted on the another of the first radiator and the second radiator Side.
A kind of laser includes radiator as described in claim 1 to 8 any one and is mounted on the heat dissipation If the dry heat source on device;The upper surface of the copper base is equipped with several installing zones corresponding with the heat source;The heat source It is fixed in the installing zone, the evaporator section of several heat pipes is distributed in the installing zone of the copper base.
Connect in one of the embodiments, at least through the evaporator section of a heat pipe between the different installing zones It is logical.
Description of the drawings
Fig. 1 is the stereoscopic schematic diagram of the laser of a preferred embodiment of the utility model;
Fig. 2 is the stereoscopic schematic diagram of the first radiator in Fig. 1;
Fig. 3 is stereoscopic schematic diagram of the first radiator in Fig. 2 in another angle;
Fig. 4 is the vertical view of the first radiator in Fig. 2.
Specific implementation mode
The utility model will be described more fully below for the ease of understanding the utility model,.But this practicality It is novel to realize in many different forms, however it is not limited to embodiment described herein.On the contrary, providing these implementations The purpose of example is to make the understanding of the disclosure of the utility model more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be The purpose of description specific embodiment, it is not intended that in limitation the utility model.
It please refers to Fig.1 to Fig.4, is the laser of one better embodiment of the utility model, for sending out laser beam.It should If laser 100 includes radiator 10 and the dry heat source 20 on radiator 10;Radiator 10 includes first scattered Hot device 30 and the second radiator 40 for connecting the first radiator 30;First radiator 30 includes copper base 50, connects with copper base 50 If the aluminum substrate 60 and dry heat pipe 70 that connect;The lower surface of copper base 50 is equipped with several first cooling fins 51;The following table of aluminum substrate 60 Face is equipped with several second cooling fins 61;Heat source 20 is fixed on copper base 50;Heat pipe 70 includes evaporator section and condensation segment, heat pipe 70 Evaporator section be welded on the upper surface of copper base 50, the condensation segment of heat pipe 70 is welded on the upper surface of aluminum substrate 60, each heat pipe 70 Condensation segment be uniformly distributed in the upper surface of aluminum substrate 60, heat pipe 70 by copper base 50 partial heat and heat source 20 directly produce Raw heat is transmitted on aluminum substrate 60, passes through the first cooling fin 51 on copper base 50 and the second cooling fin on aluminum substrate 60 61 are dispersed into gaseous environment, to while ensureing radiating efficiency, reducing 100 volume of laser, reduce the dosage of copper material, Alleviate the weight of radiator 10 and laser 100.
In wherein a kind of embodiment, copper base 50 and the first cooling fin 51 are red copper material, and the first cooling fin 51 is logical The mode for crossing teeth processing is formed on copper base 50;In another embodiment, copper base 50 is red copper material, and first dissipates Backing 51 is aluminum or red copper, and the first cooling fin 51 is fixed on by way of tin cream welding on copper base 50, and the first heat dissipation It is connected with each other between piece 51 by buckling, so that the gap between each first cooling fin 51 is consistent.
In wherein a kind of embodiment, the second cooling fin 61 and aluminum substrate 60 are formed by machining;Another real It applies in mode, the second cooling fin 61 is fixed on by way of tin cream welding on aluminum substrate 60.
Opposite contact surface passes through soldering and welding between copper base 50 and aluminum substrate 60;For in copper base 50 and aluminum substrate 60 Surface on form several air ducts of perforation, the first cooling fin 51 is consistent with the extending direction of the second cooling fin 61;Further, To reinforce heat dissipation effect, windage is reduced, and be conducive to be machined, one end between the first cooling fin 51 and the second cooling fin 61 It is equipped with chamfering;Further, it welds for convenience and is conducive to buffer wind pressure, stayed between the first cooling fin 51 and the second cooling fin 61 There is gap;Specifically, it is fixed copper base 50 and aluminum substrate 60, and the first cooling fin 51 of protection and the second cooling fin 61, aluminium The both sides of substrate 60 are equipped with support bar 63, and the extending direction of support bar 63 is corresponding with the extending direction of the second cooling fin 61;Into one Step ground, to make copper base 50 be reliably fixed with aluminum substrate 60, support bar 63 includes the portion inside 64 of connection aluminum substrate 60, and in The epitaxy part 65 that one end of socket part 64 extends to 50 side of copper base, copper base 50 are connect with epitaxy part 65, specifically, copper base 50 are equipped with mounting hole 53, and epitaxy part 65 is equipped with screw hole, and copper base 50 is installed to by fixing piece on epitaxy part 65.
To enable the heat that same heat pipe 70 is transmitted on aluminum substrate 60 to be distributed by the second different cooling fin 61 of multi-disc Into gaseous environment, to accelerate radiating rate, the extending direction at the rear portion of the condensation segment of heat pipe 70 prolongs with the second cooling fin 61 It is vertical to stretch direction;Further, be the contact area for increasing heat pipe 70 and copper base 50, the upper surface of copper base 50 equipped with The evaporator section corresponding first of heat pipe 70 holds tube seat 52, and the evaporator section of heat pipe 70 is accommodated in the first appearance tube seat 52;To increase heat The contact area of pipe 70 and aluminum substrate 60, aluminum substrate 60 are equipped with corresponding with the condensation segment of heat pipe 70 second and hold tube seat 62, heat pipe 70 condensation segment is accommodated in the second appearance tube seat 62.Specifically, the evaporator section of heat pipe 70 is located at the by soldering and copper base 50 One holds the surface soldered of 52 bottom of tube seat, and gypsum or ring are filled between the gap between the evaporator section of heat pipe 70 and copper base 50 Oxygen resin;The condensation segment of heat pipe 70 is located at the second surface soldered for holding 62 bottom of tube seat, and heat pipe by soldering and aluminum substrate 60 Gypsum or epoxy resin are filled between gap between 70 condensation segment and aluminum substrate 60;Further, to make the steaming of heat pipe 70 The bottom surface of heat source 20 can be touched by sending out the surface of surface and the copper base 50 of section, the upper surface of the evaporator section of heat pipe 70 with it is copper-based The upper surface of plate 50 is in the same plane, specifically, right after completing the filling that first holds the appearance tube seat 62 of tube seat 52 and second The upper plane of copper base 50 and aluminum substrate 60 carries out the flat processing of milling together.
The medial surface of second radiator 40 fits on the first cooling fin 51 and the second cooling fin 61, can play protection first The effect of cooling fin 51 and the second cooling fin 61.
Specifically, for convenience of the fixation of radiator 10, radiator 10 further includes two loading plates 80, is set on loading plate 80 There are ventilation opening, a loading plate to be mounted on the side of the first radiator 30 and the second radiator 40, another loading plate is mounted on first The other side of radiator 30 and the second radiator 40.
Further, it is improving heat radiation efficiency, radiator 10 further includes radiator fan 90, in the present embodiment, is dissipated Hot-air fan 90 is arranged close on the loading plate 80 of the side of copper base;In another embodiment, radiator fan 90 is mounted on On the loading plate 80 of the side of aluminum substrate 60.
The upper surface of copper base 50 is equipped with several installing zones corresponding with heat source 20 54;Heat source 20 is fixed on copper base 50 Upper surface installing zone 54 in, if the evaporator section of dry heat pipe 70 is distributed in the installing zone 54 of copper base 50, copper base 50 The quantity of evaporator section in installing zone 54 can be adjusted according to the power of heat source 20;Further, larger for balance power difference Different heat sources 20 between heat, be connected to by the evaporator section of an at least heat pipe 70 between different installing zones 54, specifically, can According to power difference size, the quantity of the evaporator section of the heat pipe 70 bridged between different installing zones 54 is adjusted.
When laser 100 is run, heat source 20 works, and projects amplified laser beam, meanwhile, the heat conduction generated To copper base 50, the heat pipe 70 under heat source 20 conducts heat on aluminum substrate 60.Radiator fan 90 rotates, and makes outside Air-flow continues through the heat dissipation effect that radiator 10 is accelerated between each first cooling fin 51 and between each second cooling fin 61 Rate.
In the present embodiment, the partial heat on copper base is transmitted on aluminum substrate by heat pipe, using on copper base The second cooling fin on first cooling fin and aluminum substrate is dispersed into gaseous environment, to ensure radiating efficiency, reduce laser While body accumulates, the dosage of copper material is reduced, the weight of laser and radiator is alleviated.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (10)

1. a kind of radiator, which is characterized in that include the second radiator of the first radiator of the first radiator and connection;The If a radiator includes copper base, the aluminum substrate and dry heat pipe that are connect with the copper base;The lower surface of the copper base is equipped with Several first cooling fins;The lower surface of the aluminum substrate is equipped with several second cooling fins;The heat pipe includes evaporator section and condensation Section, the evaporator section of the heat pipe are welded on the upper surface of the copper base, and the condensation segment of the heat pipe is welded on the aluminum substrate Upper surface, the condensation segment of each heat pipe is uniformly distributed in the upper surface of the aluminum substrate.
2. radiator according to claim 1, which is characterized in that the extending direction of second cooling fin and described the The extending direction of one cooling fin is consistent.
3. radiator according to claim 2, which is characterized in that first cooling fin and second cooling fin it Between one end be equipped with chamfering;There are gaps between first cooling fin and second cooling fin.
4. radiator according to claim 2, which is characterized in that the upper surface of the copper base is equipped with and the heat The evaporator section corresponding first of pipe holds tube seat, and the evaporator section of the heat pipe, which is accommodated in described first, to be held in tube seat;The heat pipe The upper surface of evaporator section and the upper surface of the copper base are in the same plane.
5. radiator according to claim 2, which is characterized in that the extending direction at the rear portion of the condensation segment of the heat pipe It is vertical with the extending direction of the second cooling fin.
6. radiator according to claim 2, which is characterized in that the both sides of the aluminum substrate are equipped with support bar, described The extending direction of support bar is corresponding with the extending direction of the second cooling fin;The support bar includes the connection aluminum substrate Portion inside, and epitaxy part from one end of the portion inside to the copper base side that extend from, the copper base and the extension Portion connects.
7. radiator according to claim 2, which is characterized in that the medial surface of second radiator fits to described On first cooling fin and second cooling fin.
8. radiator according to claim 7, which is characterized in that further include two loading plates, the loading plate is equipped with Ventilation opening, a loading plate are mounted on the side of the first radiator and the second radiator, and another loading plate is mounted on the first radiator And second radiator the other side.
9. a kind of laser, which is characterized in that include radiator as described in claim 1 to 8 any one and be mounted on If the dry heat source on the radiator;The upper surface of the copper base is equipped with several installing zones corresponding with the heat source; The heat source is fixed in the installing zone, and the evaporator section of several heat pipes is distributed in the installing zone of the copper base.
10. laser according to claim 9, which is characterized in that at least through an institute between the different installing zones State the evaporator section connection of heat pipe.
CN201820154696.7U 2018-01-26 2018-01-26 Laser and radiator Active CN207967586U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820154696.7U CN207967586U (en) 2018-01-26 2018-01-26 Laser and radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820154696.7U CN207967586U (en) 2018-01-26 2018-01-26 Laser and radiator

Publications (1)

Publication Number Publication Date
CN207967586U true CN207967586U (en) 2018-10-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820154696.7U Active CN207967586U (en) 2018-01-26 2018-01-26 Laser and radiator

Country Status (1)

Country Link
CN (1) CN207967586U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112074147A (en) * 2020-08-06 2020-12-11 北京比特大陆科技有限公司 Radiator assembly, power calculating assembly and server

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112074147A (en) * 2020-08-06 2020-12-11 北京比特大陆科技有限公司 Radiator assembly, power calculating assembly and server

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