JP6982776B2

JP6982776B2 - Heat dissipation devices for heat-generating electronic components, in-vehicle chargers, and vehicles

Info

Publication number: JP6982776B2
Application number: JP2020100805A
Authority: JP
Inventors: 篤志山島
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2015-12-10
Filing date: 2020-06-10
Publication date: 2021-12-17
Anticipated expiration: 2035-12-10
Also published as: JP2020167425A

Description

本発明は、発熱電子部品の放熱装置、車載充電器、および車両に関する。 The present invention relates to a heat radiating device for heat-generating electronic components, an in-vehicle charger, and a vehicle.

従来、放熱部材で形成された略直方体の筐体内に基板や電子部品を格納し、電子部品から発生する熱を、筐体を介して放熱することが知られている。このような略直方体の筐体の構造の製造方法として、上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法と、下面（底面）と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法の２通りが知られている。 Conventionally, it is known that a substrate or an electronic component is housed in a substantially rectangular parallelepiped housing formed of a heat radiating member, and heat generated from the electronic component is radiated through the housing. As a method of manufacturing the structure of such a substantially rectangular parallelepiped housing, a method of integrally molding the upper surface and the side surface into a box shape and covering the housing with an open lower surface from above, and a method of covering the lower surface (bottom surface) and the side surface with a box shape. There are two known methods of covering a housing having an open upper surface with a lid member (upper surface).

上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法を用いる場合、下面に基板や電子部品を取り付ける際には側面が存在しないため、側方から電子部品をネジ留めすることが可能であるが、一方、筐体内に格納した電子部品を筐体外の電子部品と電気的に接続するための端子（コネクタ）の配置に制約が生じる。 When the method of integrally molding the upper surface and the side surface into a box shape and covering the housing with the open lower surface from above is used, since the side surface does not exist when the substrate or the electronic component is attached to the lower surface, the electronic component is provided from the side. However, on the other hand, there are restrictions on the arrangement of terminals (connectors) for electrically connecting the electronic components stored in the housing to the electronic components outside the housing.

一般的に、コネクタを側面に設ける場合には、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法を用いることが好ましい。 Generally, when the connector is provided on the side surface, it is preferable to use a method in which the lower surface and the side surface are integrally molded into a box shape and the housing having the upper surface open is covered with the lid member (upper surface).

しかしながら、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法においては、下面と側面が箱型に一体成型されているため、側方から電子部品をネジ留めすることが不可能であり、開口された上面からネジ留めを行う必要がある。 However, in the method in which the lower surface and the side surface are integrally molded into a box shape and the lid member (upper surface) is placed on the housing having an open upper surface, the lower surface and the side surface are integrally molded into a box shape, so that the lower surface and the side surface are integrally molded into a box shape. It is not possible to screw electronic components, and it is necessary to screw them from the open top surface.

開口された上面から電子部品を固定するためのネジ留めを行う方法として、発熱電子部品のリード線を折り曲げることで発熱電子部品の放熱面を底面に直接接触させて配置し、例えば、特許文献１に開示されている弾性部材が放熱面の反対側の面を押さえつけるように弾性部材を上方からネジ留めすることが考えられる。 As a method of screwing to fix the electronic component from the opened upper surface, the heat-dissipating surface of the heat-generating electronic component is placed in direct contact with the bottom surface by bending the lead wire of the heat-generating electronic component, for example, Patent Document 1. It is conceivable that the elastic member is screwed from above so that the elastic member disclosed in the above presses the surface opposite to the heat dissipation surface.

特開２００２−２１７３４３号公報Japanese Unexamined Patent Publication No. 2002-217343

しかしながら、上述した放熱機構の底面に発熱電子部品を配置する方法では、放熱効果を確保するために、放熱機構の底面において発熱電子部品の放熱面が接触する部分の面積および弾性部材が設置される部分の面積が必要となり、底面積の大型化、ひいては装置全体が大型化してしまうおそれがある。 However, in the method of arranging the heat-generating electronic component on the bottom surface of the heat-dissipating mechanism described above, in order to secure the heat-dissipating effect, the area of the portion of the bottom surface of the heat-dissipating mechanism where the heat-dissipating surface of the heat-generating electronic component contacts and the elastic member are installed. The area of the part is required, and there is a risk that the bottom area will be large and the entire device will be large.

本発明の目的は、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる発熱電子部品の放熱装置、車載充電器、および車両を提供することである。 An object of the present invention is to dissipate heat of a heat-generating electronic component that can cope with heat dissipation of a heat-generating electronic component while suppressing an increase in size when a heat-dissipating mechanism that is integrally molded into a box shape and has an opening on only one surface is used. It is to provide devices, in-vehicle chargers, and vehicles.

本発明の一態様に係る発熱電子部品の放熱装置は、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品の放熱面が熱的に接続され、前記発熱電子部品が配置される伝熱体と、第１の面を有し、前記第１の面を介して前記伝熱体と熱的に接続する放熱部品と、を有し、前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されており、前記伝熱体は、リアクトル部品を保持し、前記リアクトル部品は、前記放熱部品と熱的に接続され、前記リアクトル部品と前記伝熱体とは、放熱性を有するポッティング材により熱的に接続され、前記発熱電子部品は、前記発熱電子部品の長手方向が前記第１の方向に平行となる状態、かつ、前記放熱部品に接触しない状態で、前記伝熱体に固定され、前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される。 In the heat radiating device for heat-generating electronic components according to one aspect of the present invention, the heat-generating electronic component having a lead wire connected to the circuit board and self-heating by energization, and the heat-dissipating surface of the heat-generating electronic component are heated. A heat transfer component that is connected to the heat transfer component and has a first surface and is thermally connected to the heat transfer component via the first surface. The heat transfer component and the circuit board are arranged in this order from the first surface, the heat transfer component, and the circuit board along the first direction perpendicular to the first surface. The heat transfer body holds the reactor component, the reactor component is thermally connected to the heat radiation component, and the reactor component and the heat transfer element are thermally connected by a potting material having heat dissipation. The heat-generating electronic component is connected and fixed to the heat transfer body in a state where the longitudinal direction of the heat-generating electronic component is parallel to the first direction and does not come into contact with the heat-dissipating component, and the heat transfer is performed. The body has a second surface and a third surface facing the second surface, and the heat transfer body is thermally connected to the heat generating electronic component via the second surface. The heat transfer body is thermally connected to the reactor component by the potting material via the third surface .

本発明の一態様に係る車載充電器は、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品の放熱面が熱的に接続され、前記発熱電子部品が配置される伝熱体と、第１の面を有し、前記第１の面を介して前記伝熱体と熱的に接続する放熱部品と、を有し、前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されており、前記伝熱体は、リアクトル部品を保持し、前記リアクトル部品は、前記放熱部品と熱的に接続され、前記リアクトル部品と前記伝熱体とは、放熱性を有するポッティング材により熱的に接続され、前記発熱電子部品は、前記発熱電子部品の長手方向が前記第１の方向に平行となる状態、かつ、前記放熱部品に接触しない状態で、前記伝熱体に固定され、前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される。 In the vehicle-mounted charger according to one aspect of the present invention, the circuit board, the heat-generating electronic component having a lead wire that self-heats by energization and connected to the circuit board, and the heat-dissipating surface of the heat-generating electronic component are thermally connected. It has a heat transfer component on which the heat-generating electronic component is arranged, and a heat-dissipating component which has a first surface and is thermally connected to the heat transfer component via the first surface. The heat transfer component and the circuit board are arranged in this order from the first surface to the heat transfer body and the circuit board along a first direction perpendicular to the first surface. The hot body holds the reactor component, the reactor component is thermally connected to the heat radiation component, and the reactor component and the heat transfer element are thermally connected by a potting material having heat dissipation. The heat-generating electronic component is fixed to the heat transfer body in a state where the longitudinal direction of the heat-generating electronic component is parallel to the first direction and does not come into contact with the heat-dissipating component. It has a second surface and a third surface facing the second surface, and the heat transfer body is thermally connected to the heat generating electronic component via the second surface to transfer heat. The body is thermally connected to the reactor component by the potting material via the third surface .

本発明の一態様に係る車両は、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品の放熱面が熱的に接続され、前記発熱電子部品が配置される伝熱体と、第１の面を有し、前記第１の面を介して前記伝熱体と熱的に接続する放熱部品と、を有し、前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されており、前記伝熱体は、リアクトル部品を保持し、前記リアクトル部品は、前記放熱部品と熱的に接続され、前記リアクトル部品と前記伝熱体とは、放熱性を有するポッティング材により熱的に接続され、前記発熱電子部品は、前記発熱電子部品の長手方向が前記第１の方向に平行となる状態、かつ、前記放熱部品に接触しない状態で、前記伝熱体に固定され、前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される。 In the vehicle according to one aspect of the present invention, the circuit board, the heat-generating electronic component having a lead wire that self-heats by energization and connected to the circuit board, and the heat-dissipating surface of the heat-generating electronic component are thermally connected. It has a heat transfer component on which the heat-generating electronic component is arranged, and a heat-dissipating component that has a first surface and is thermally connected to the heat transfer component via the first surface, and has the heat transfer component. The body and the circuit board are arranged in this order from the first surface to the heat transfer body and the circuit board along a first direction perpendicular to the first surface, and the heat transfer body is arranged in this order. Holds the reactor component, the reactor component is thermally connected to the heat radiation component, and the reactor component and the heat transfer body are thermally connected by a potting material having heat dissipation, and the heat generation is generated. The electronic component is fixed to the heat transfer body in a state where the longitudinal direction of the heat generating electronic component is parallel to the first direction and does not come into contact with the heat radiating component, and the heat transfer body is a second. The heat transfer body is thermally connected to the heat generating electronic component via the second surface, and the heat transfer body has a third surface facing the second surface. , The potting material is thermally connected to the reactor component via the third surface .

本発明によれば、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる。 According to the present invention, when a heat dissipation mechanism that is integrally molded into a box shape and has an opening on only one surface is used, it is possible to cope with heat dissipation of heat-generating electronic components while suppressing an increase in size.

本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す斜視図A perspective view showing an example of a heat dissipation structure of a heat-generating electronic component according to an embodiment of the present invention. 本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す正面図Front view showing an example of the heat dissipation structure of the heat generating electronic component according to the embodiment of the present invention. 本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す側面図A side view showing an example of a heat dissipation structure of a heat-generating electronic component according to an embodiment of the present invention. 本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す上面斜視図Top perspective view showing an example of the heat dissipation structure of the heat generating electronic component according to the embodiment of the present invention. 本発明の変形例１に係る発熱電子部品の放熱構造の構成例を示す上面斜視図Top perspective view showing a configuration example of a heat dissipation structure of a heat-generating electronic component according to a modification 1 of the present invention. 本発明の変形例２に係る発熱電子部品の放熱構造の構成例を示す上面斜視図Top perspective view showing a configuration example of a heat dissipation structure of a heat-generating electronic component according to a modification 2 of the present invention.

（実施の形態）
以下、本発明の実施の形態について、図面を参照して説明する。 (Embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

まず、図１〜４を用いて、本実施の形態に係る発熱電子部品の放熱構造１の構成例について説明する。図１は、発熱電子部品の放熱構造１の一例を示す斜視図である。図２は、発熱電子部品の放熱構造１の一例を示す正面図である。図３は、発熱電子部品の放熱構造１の一例を示す側面図である。図４は、発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図１、図２では、ヒートシンク２の前面部分の図示を省略しており、図３では、ヒートシンク２の側面部分の図示を省略している。また、図４では、図１〜図３に示す回路基板９の図示を省略している。 First, a configuration example of the heat dissipation structure 1 of the heat-generating electronic component according to the present embodiment will be described with reference to FIGS. 1 to 4. FIG. 1 is a perspective view showing an example of a heat dissipation structure 1 of a heat-generating electronic component. FIG. 2 is a front view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 3 is a side view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 4 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. In addition, in FIGS. 1 and 2, the illustration of the front surface portion of the heat sink 2 is omitted, and in FIG. 3, the illustration of the side surface portion of the heat sink 2 is omitted. Further, in FIG. 4, the circuit board 9 shown in FIGS. 1 to 3 is not shown.

発熱電子部品の放熱構造１は、例えば、車両に搭載される充電器やインバータ等に用いられる。発熱電子部品の放熱構造１は、ヒートシンク２、アルミブロック３、電子部品５ａ、５ｂ、回路基板９を備える。 The heat dissipation structure 1 of the heat-generating electronic component is used, for example, in a charger, an inverter, or the like mounted on a vehicle. The heat dissipation structure 1 of the heat-generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5a and 5b, and a circuit board 9.

ヒートシンク２（放熱機構の一例）は、箱型に一体成型され、一面のみに開口部が設けられている。Ｆ１は、開口面（第２の面の一例）であり、Ｆ２は、開口面Ｆ１に対向する底面（第１の面の一例）である。 The heat sink 2 (an example of a heat dissipation mechanism) is integrally molded into a box shape and has an opening on only one surface. F1 is an opening surface (an example of a second surface), and F2 is a bottom surface facing the opening surface F1 (an example of a first surface).

ヒートシンク２の底面Ｆ２の四隅には、底面Ｆ２に対する垂直方向Ｄ（以下、単に「垂直方向」という）に沿って、支柱２ａ、２ｂ、２ｃ、２ｄが設けられている。支柱２ａ〜２ｄには、それぞれ、ネジ穴（図示略）が形成されており、後述する回路基板９がネジ留めされる。 At the four corners of the bottom surface F2 of the heat sink 2, columns 2a, 2b, 2c, and 2d are provided along the direction D (hereinafter, simply referred to as "vertical direction") with respect to the bottom surface F2. Screw holes (not shown) are formed in each of the columns 2a to 2d, and the circuit board 9 described later is screwed to the columns 2a to 2d.

アルミブロック３（伝熱体の一例）は、アルミで形成された略直方体の部材である。アルミブロック３は、その長手方向が垂直方向Ｄに沿うようにヒートシンク２の内部に配置されている。 The aluminum block 3 (an example of a heat transfer body) is a member of a substantially rectangular parallelepiped made of aluminum. The aluminum block 3 is arranged inside the heat sink 2 so that its longitudinal direction is along the vertical direction D.

アルミブロック３は、その下部に略直方体の締結部３ａを有している。この締結部３ａは、ネジ４ａ、４ｂ（固定部材の一例）により底面Ｆ２にネジ留めされる。これにより、アルミブロック３は、底面Ｆ２に接触して固定される。 The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at its lower portion. The fastening portion 3a is screwed to the bottom surface F2 by screws 4a and 4b (an example of a fixing member). As a result, the aluminum block 3 comes into contact with the bottom surface F2 and is fixed.

電子部品５ａ、５ｂ（発熱電子部品の一例）は、通電によって自己発熱する電子部品であり、例えば、ディスクリート部品、ＦＥＴ（Field Effect Transistor）等である。電子部品５ａ、５ｂは、それぞれ、リード線６ａ、６ｂを有する。 The electronic components 5a and 5b (an example of heat-generating electronic components) are electronic components that self-heat when energized, and are, for example, discrete components, FETs (Field Effect Transistors), and the like. The electronic components 5a and 5b have lead wires 6a and 6b, respectively.

電子部品５ａ、５ｂは、それぞれの放熱面がアルミブロック３の側面に接触するように、アルミブロック３に取り付けられる。例えば、電子部品５ａ、５ｂは、それぞれ、バネ７ａ、７ｂ（保持部材の一例）により、放熱面に対向する面から押さえ付けられ、アルミブロック３の側面に固着して保持される。バネ７ａ、７ｂは、それぞれ、ネジ８ａ、８ｂによりアルミブロック３の側面にネジ留めされる。 The electronic components 5a and 5b are attached to the aluminum block 3 so that the heat radiating surfaces of the electronic components 5a and 5b are in contact with the side surfaces of the aluminum block 3. For example, the electronic components 5a and 5b are pressed from the surface facing the heat radiation surface by the springs 7a and 7b (an example of the holding member), respectively, and are fixedly held to the side surface of the aluminum block 3. The springs 7a and 7b are screwed to the side surfaces of the aluminum block 3 by screws 8a and 8b, respectively.

アルミブロック３に固着した電子部品５ａ、５ｂは、垂直方向Ｄに沿って直立した状態となる。また、アルミブロック３に固着した電子部品５ａ、５ｂは、ヒートシンク２に接触しない。 The electronic components 5a and 5b fixed to the aluminum block 3 are in an upright state along the vertical direction D. Further, the electronic components 5a and 5b fixed to the aluminum block 3 do not come into contact with the heat sink 2.

以上のようにアルミブロック３に固着した電子部品５ａ、５ｂから発生する熱は、アルミブロック３を介して、ヒートシンク２へ伝熱される。これにより、電子部品５ａ、５ｂの放熱が実現される。 As described above, the heat generated from the electronic components 5a and 5b fixed to the aluminum block 3 is transferred to the heat sink 2 via the aluminum block 3. As a result, heat dissipation of the electronic components 5a and 5b is realized.

なお、図１〜図４では、例として、アルミブロック３に固着する電子部品を２つとしたが、１つであってもよいし、３つ以上であってもよい。また、複数の電子部品は、アルミブロック３の一面のみならず複数の面に固着されてもよい。 In FIGS. 1 to 4, as an example, the number of electronic components fixed to the aluminum block 3 is two, but the number may be one or three or more. Further, the plurality of electronic components may be fixed not only to one surface of the aluminum block 3 but also to a plurality of surfaces.

回路基板９は、パターンが形成されたり、所定の半導体素子（図示略）が実装されたりするプリント基板である。回路基板９は、上述した支柱２ａ〜２ｄに載置される。そして、回路基板９は、ネジ１０ａ、１０ｂ、１０ｃ、１０ｄにより柱２ａ〜２ｄにネジ留めされる。これにより、回路基板９は、支柱２ａ〜２ｄに固定される。 The circuit board 9 is a printed circuit board on which a pattern is formed and a predetermined semiconductor element (not shown) is mounted. The circuit board 9 is mounted on the columns 2a to 2d described above. Then, the circuit board 9 is screwed to the columns 2a to 2d by the screws 10a, 10b, 10c, and 10d. As a result, the circuit board 9 is fixed to the columns 2a to 2d.

また、回路基板９は、例えば半田付けにより、電子部品５ａのリード線６ａおよび電子部品５ｂのリード線６ｂと接続する。 Further, the circuit board 9 is connected to the lead wire 6a of the electronic component 5a and the lead wire 6b of the electronic component 5b by, for example, soldering.

アルミブロック３および回路基板９は、垂直方向Ｄに沿って、底面Ｆ２からアルミブロック３、回路基板９の順に配置される。 The aluminum block 3 and the circuit board 9 are arranged in the order of the bottom surface F2, the aluminum block 3, and the circuit board 9 along the vertical direction D.

また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される。これにより、回路基板９における固定点が多くなり、リード線６ａ、６ｂの折れを防止できる。特に支柱２ａ〜２ｄが高く、振動が多く生じる場合に効果を奏する。 Further, the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member). As a result, the number of fixed points on the circuit board 9 increases, and the lead wires 6a and 6b can be prevented from breaking. This is particularly effective when the columns 2a to 2d are high and a lot of vibration occurs.

また、ボンド１１ａ、１１ｂは、絶縁性または放熱性の少なくとも一方を有することが好ましい。ボンド１１ａ、１１ｂが絶縁性を有する場合、回路基板９においてボンド１１ａ、１１ｂに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。また、ボンド１１ａ、１１ｂが放熱性を有する場合、回路基板９で発生した熱を、ボンド１１ａ、１１ｂを介してアルミブロック３へ伝熱できる。 Further, the bonds 11a and 11b preferably have at least one of insulating property and heat dissipation property. When the bonds 11a and 11b have insulating properties, a pattern can be formed or a semiconductor element can be mounted at a portion corresponding to the bonds 11a and 11b on the circuit board 9. Further, when the bonds 11a and 11b have heat dissipation properties, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 via the bonds 11a and 11b.

なお、図１〜図４では、図示を省略しているが、回路基板９の上方に、開口面Ｆ１を閉塞するカバーが設けられてもよい。 Although not shown in FIGS. 1 to 4, a cover for closing the opening surface F1 may be provided above the circuit board 9.

以上説明したように、本実施の形態の発熱電子部品の放熱構造１は、ヒートシンク２に接触して配置されたアルミブロック３に対して電子部品５ａ、５ｂの放熱面を接触させて配置するため、電子部品５ａ、５ｂの放熱面をヒートシンク２の底面Ｆ２に接触させて配置する場合に比べて、大型化を抑制しつつ、電子部品の放熱に対応することができる。 As described above, the heat radiating structure 1 of the heat-generating electronic component of the present embodiment is arranged so that the heat radiating surfaces of the electronic components 5a and 5b are in contact with the aluminum block 3 arranged in contact with the heat sink 2. Compared with the case where the heat dissipation surface of the electronic components 5a and 5b is placed in contact with the bottom surface F2 of the heat sink 2, it is possible to cope with the heat dissipation of the electronic components while suppressing the increase in size.

以上、発熱電子部品の放熱構造１の構成例について説明した。 The configuration example of the heat dissipation structure 1 of the heat-generating electronic component has been described above.

次に、発熱電子部品の放熱構造１の製造方法について、図１〜図４を用いて説明する。 Next, a method of manufacturing the heat dissipation structure 1 of the heat-generating electronic component will be described with reference to FIGS. 1 to 4.

まず、バネ７ａ、７ｂおよびネジ８ａ、８ｂを用いて、電子部品５ａ、５ｂをアルミブロック３に固定して接着させる。このとき、電子部品５ａ、５ｂの放熱面をアルミブロック３に接触させる。なお、電子部品５ａ、５ｂが、絶縁が必要なタイプの場合であれば、電子部品５ａ、５ｂの放熱面とアルミブロック３の間に放熱絶縁シート（図示略）を設けることが好ましい。 First, the electronic components 5a and 5b are fixed to and adhered to the aluminum block 3 by using the springs 7a and 7b and the screws 8a and 8b. At this time, the heat radiating surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulating sheet (not shown) between the heat dissipation surface of the electronic components 5a and 5b and the aluminum block 3.

次に、電子部品５ａ、５ｂが固着したアルミブロック３を、ヒートシンク２の開口面Ｆ１からヒートシンク２の内部に収容し、アルミブロック３を底面Ｆ２に配置する。そして、ネジ４ａ、４ｂを用いて締結部３ａを底面Ｆ２にネジ留めする。 Next, the aluminum block 3 to which the electronic components 5a and 5b are fixed is housed inside the heat sink 2 from the opening surface F1 of the heat sink 2, and the aluminum block 3 is arranged on the bottom surface F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.

次に、回路基板９を、ヒートシンク２の開口面からヒートシンク２の内部に収容し、支柱２ａ〜２ｄに配置する。このとき、リード線６ａ、６ｂを回路基板９に対して半田付けする。そして、ネジ１０ａ〜１０ｄを用いて回路基板９を支柱２ａ〜２ｄにネジ留めする。 Next, the circuit board 9 is housed inside the heat sink 2 from the opening surface of the heat sink 2 and arranged on the columns 2a to 2d. At this time, the lead wires 6a and 6b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the columns 2a to 2d using the screws 10a to 10d.

以上の製造方法により、図１〜図４に示した発熱電子部品の放熱構造１が製造される。 By the above manufacturing method, the heat dissipation structure 1 of the heat-generating electronic component shown in FIGS. 1 to 4 is manufactured.

なお、回路基板９のネジ留めの後で、回路基板９の上方に、開口面Ｆ１を閉塞するカバー（図示略）を設けてもよい。 After screwing the circuit board 9, a cover (not shown) for closing the opening surface F1 may be provided above the circuit board 9.

以上、本発明の実施の形態について説明したが、本発明は上記実施の形態に限定されず、種々の変形が可能である。以下、変形例について説明する。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be modified in various ways. Hereinafter, a modified example will be described.

（変形例１）
本変形例に係る発熱電子部品の放熱構造１について、図５を用いて説明する。図５は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図５において、図１〜図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図５では、図１〜図３に示した回路基板９の図示を省略している。 (Modification 1)
The heat dissipation structure 1 of the heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 5 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to the present modification. In FIG. 5, the same components as those in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 5, the circuit board 9 shown in FIGS. 1 to 3 is not shown.

本変形例では、図５に示すように、ヒートシンク２において、アルミブロック３０および電子部品３２を備える点が図１〜図４と異なる。 In this modification, as shown in FIG. 5, the heat sink 2 is different from FIGS. 1 to 4 in that the aluminum block 30 and the electronic component 32 are provided.

アルミブロック３０は、その下部に略直方体の締結部３０ａを有している。なお、図５では、支柱２ａと支柱２ｂとの間にある締結部３０ａのみを図示しているが、これと同様に支柱２ｄと支柱２ｃの間にも締結部３０ａが存在する。 The aluminum block 30 has a substantially rectangular parallelepiped fastening portion 30a at its lower portion. Although only the fastening portion 30a between the support columns 2a and the support column 2b is shown in FIG. 5, the fastening portion 30a also exists between the support column 2d and the support column 2c.

締結部３０ａは、ネジ３１により底面Ｆ２にネジ留めされる。これにより、アルミブロック３０は、底面Ｆ２に接触して固定される。 The fastening portion 30a is screwed to the bottom surface F2 by the screw 31. As a result, the aluminum block 30 is in contact with and fixed to the bottom surface F2.

また、アルミブロック３０は、略直方体状の空間が設けられた収容部３０ｂを有する。この収容部３０ｂの空間には、電子部品３２（例えば、リアクトル部品。高背部品の一例）が収容される。電子部品３２の底面は、ヒートシンク２の底面Ｆ２に接触して固定される。なお、図示は省略しているが、電子部品３２と収容部３０ｂとの間には、ポッティング材が充填されている。 Further, the aluminum block 30 has an accommodating portion 30b provided with a substantially rectangular parallelepiped space. An electronic component 32 (for example, a reactor component, an example of a tall component) is accommodated in the space of the accommodating portion 30b. The bottom surface of the electronic component 32 is in contact with and fixed to the bottom surface F2 of the heat sink 2. Although not shown, a potting material is filled between the electronic component 32 and the accommodating portion 30b.

電子部品３２は、底面Ｆ２と回路基板９（図１〜図３参照）の間において、電子部品３２の長手方向が垂直方向Ｄ（図１〜図３参照）に沿うように直立して配置される。また、電子部品３２の垂直方向Ｄの長さ（電子部品３２の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic component 32 is arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) so that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3). To. The length of the electronic component 32 in the vertical direction D (the length of the electronic component 32 in the longitudinal direction) is the length of the electronic components 5a and 5b in the vertical direction D (the length of the electronic components 5a and 5b in the longitudinal direction). Longer than.

このように、電子部品３２を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 By arranging the electronic component 32 on the bottom surface F2 in this way, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat radiating structure 1 of the heat-generating electronic component does not increase in size in the height direction (vertical direction D).

本変形例によれば、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３２の固定（振動対策）も行うことができる。また、ポッティング材が放熱性のポッティング材である場合には、電子部品３２の固定（振動対策）と放熱も行うことができる。 According to this modification, in addition to the effect described in the first embodiment, the electronic component 32 arranged on the bottom surface F2 of the heat sink 2 can be fixed (vibration countermeasure). Further, when the potting material is a heat-dissipating potting material, the electronic component 32 can be fixed (vibration countermeasure) and heat-dissipated.

（変形例２）
本変形例に係る発熱電子部品の放熱構造１について、図６を用いて説明する。図６は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図６において、図１〜図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図６では、図１〜図３に示した回路基板９の図示を省略している。 (Modification 2)
The heat dissipation structure 1 of the heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 6 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to the present modification. In FIG. 6, the same components as those in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 6, the circuit board 9 shown in FIGS. 1 to 3 is not shown.

本変形例では、図６に示すように、ヒートシンク２において、電子部品３３、３４を備える点が図１〜図４と異なる。 In this modification, as shown in FIG. 6, the heat sink 2 is different from FIGS. 1 to 4 in that the electronic components 33 and 34 are provided.

電子部品３３、３４（例えば、リアクトル部品。高背部品の一例）は、それぞれ、ヒートシンク２の底面Ｆ２に接触して固定される。 The electronic components 33 and 34 (for example, a reactor component, which is an example of a tall component) are each in contact with and fixed to the bottom surface F2 of the heat sink 2.

電子部品３３、３４は、底面Ｆ２と回路基板９（図１〜図３参照）の間において、電子部品３３、３４の長手方向が垂直方向Ｄ（図１〜図３参照）に沿うように直立して配置される。また、電子部品３３、３４の垂直方向Ｄの長さ（電子部品３３、３４の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic components 33 and 34 stand upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) so that the longitudinal direction of the electronic components 33 and 34 is along the vertical direction D (see FIGS. 1 to 3). And are placed. Further, the length of the electronic components 33 and 34 in the vertical direction D (the length of the electronic components 33 and 34 in the longitudinal direction) is the length of the electronic components 5a and 5b in the vertical direction D (the length of the electronic components 5a and 5b in the longitudinal direction). Longer than).

このように、電子部品３３、３４を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 By arranging the electronic components 33 and 34 on the bottom surface F2 in this way, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat radiating structure 1 of the heat-generating electronic component does not increase in size in the height direction (vertical direction D).

本変形例では、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３３、３４の放熱も行うことができる。 In this modification, in addition to the effect described in the first embodiment, heat dissipation of the electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2 can also be performed.

（変形例３）
実施の形態では、ヒートシンク２を用いて空冷を行う場合を例に挙げて説明したが、空冷の代わりに、水冷を適用してもよい。 (Modification 3)
In the embodiment, the case where air cooling is performed using the heat sink 2 has been described as an example, but water cooling may be applied instead of air cooling.

（変形例４）
実施の形態では、アルミブロック３の底面Ｆ２への締結、バネ７ａ、７ｂのアルミブロック３への締結、回路基板９の支柱２ａ〜２ｄへの締結にネジを用いる場合を例に挙げて説明したが、ネジの代わりに、ボンドを用いてもよい。また、実施の形態では、電子部品５ａ、５ｂのアルミブロック３への固着にバネを用いる場合を例に挙げて説明したが、バネの代わりに、ネジを用いてもよい。 (Modification example 4)
In the embodiment, a case where a screw is used for fastening the aluminum block 3 to the bottom surface F2, fastening the springs 7a and 7b to the aluminum block 3, and fastening the circuit board 9 to the columns 2a to 2d has been described as an example. However, a bond may be used instead of the screw. Further, in the embodiment, the case where the spring is used for fixing the electronic parts 5a and 5b to the aluminum block 3 has been described as an example, but a screw may be used instead of the spring.

（変形例５）
また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される場合を例に挙げて説明したが、グリスやギャップフィラー（放熱部材の一例）等の接着性を有しない放熱性部材をアルミブロック３と回路基板９の間に設けてもよい。これにより、回路基板９で発生した熱を、グリスやギャップフィラー等を介してアルミブロック３へ伝熱できる。また、グリスやギャップフィラーが絶縁性を有する場合、回路基板９においてグリスやギャップフィラーに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。 (Modification 5)
Further, the case where the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member) has been described as an example, but grease, a gap filler (an example of a heat dissipation member) and the like have been described. A heat-dissipating member having no adhesiveness may be provided between the aluminum block 3 and the circuit board 9. As a result, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 via grease, a gap filler, or the like. Further, when the grease or the gap filler has an insulating property, a pattern can be formed or a semiconductor element can be mounted on the portion corresponding to the grease or the gap filler in the circuit board 9.

本発明は、発熱電子部品の放熱装置、車載充電器、および車両に有用である。 INDUSTRIAL APPLICABILITY The present invention is useful for heat radiating devices for heat-generating electronic components, in-vehicle chargers, and vehicles.

１発熱電子部品の放熱構造
２ヒートシンク
２ａ、２ｂ、２ｃ、２ｄ支柱
３、３０アルミブロック
３ａ、３０ａ締結部
４ａ、４ｂ、８ａ、８ｂ、１０ａ、１０ｂ、１０ｃ、１０ｄ、３１ネジ
５ａ、５ｂ電子部品
６ａ、６ｂリード線
７ａ、７ｂバネ
９回路基板
３０ｂ収容部
３２、３３、３４電子部品 1 Heat dissipation structure of heat-generating electronic components 2 Heat sinks 2a, 2b, 2c, 2d Support columns 3, 30 Aluminum blocks 3a, 30a Fastening parts 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 Screws 5a, 5b Electronic components 6a, 6b Lead wire 7a, 7b Spring 9 Circuit board 30b Accommodation 32, 33, 34 Electronic components

Claims

With the circuit board
A heat-generating electronic component having a lead wire that self-heats when energized and is connected to the circuit board.
A heat transfer body in which the heat dissipation surface of the heat generating electronic component is thermally connected and the heat generating electronic component is arranged,
It has a first surface and has a heat dissipation component that is thermally connected to the heat transfer body via the first surface.
The heat transfer body and the circuit board are arranged in the order of the heat transfer body and the circuit board from the first surface along a first direction perpendicular to the first surface.
The heat transfer body holds the reactor component and
The reactor component is thermally connected to the heat dissipation component .
The reactor component and the heat transfer body are thermally connected by a potting material having heat dissipation.
The heat-generating electronic component is
It is fixed to the heat transfer body in a state where the longitudinal direction of the heat generating electronic component is parallel to the first direction and is not in contact with the heat radiating component.
The heat transfer body has a second surface and a third surface facing the second surface.
The heat transfer body is thermally connected to the heat generating electronic component via the second surface.
The heat transfer body is thermally connected to the reactor component by the potting material via the third surface.
Heat dissipation device for heat-generating electronic components.

The heat transfer body is
Adhesive and fixed to the circuit board by an adhesive member,
The heat radiating device for heat-generating electronic components according to claim 1.

The adhesive member is
Has at least one of insulation and heat dissipation,
The heat radiating device for heat-generating electronic components according to claim 2.

A heat radiating member is arranged between the heat transfer body and the circuit board.
The heat radiating device for heat-generating electronic components according to any one of claims 1 to 3.

A member having insulation and heat dissipation is arranged between the heat transfer body and the circuit board.
In the circuit board, a pattern is formed at a position corresponding to the member having the insulating property and the heat dissipation property.
The heat radiating device for heat-generating electronic components according to any one of claims 1 to 4.

The insulating and heat-dissipating member also has adhesiveness.
The heat radiating device for heat-generating electronic components according to claim 5.

The reactor part is a tall part and is a tall part.
The length of the tall component in the first direction is longer than the length of the heat-generating electronic component in the first direction.
The heat radiating device for heat-generating electronic components according to claim 1.

The reactor component is thermally connected to the heat dissipation component by a potting material having heat dissipation.
The heat radiating device for heat-generating electronic components according to claim 1.

The heat transfer body holds the reactor component by an accommodating portion provided with a space for accommodating the reactor component.
The heat radiating device for heat-generating electronic components according to claim 1.

The reactor component is thermally connected to the heat dissipation component via the accommodating portion.
The heat radiating device for heat-generating electronic components according to claim 9.

With the circuit board
A heat-generating electronic component having a lead wire that self-heats when energized and is connected to the circuit board.
A heat transfer body in which the heat dissipation surface of the heat generating electronic component is thermally connected and the heat generating electronic component is arranged,
It has a first surface and has a heat dissipation component that is thermally connected to the heat transfer body via the first surface.
The heat transfer body and the circuit board are arranged in the order of the heat transfer body and the circuit board from the first surface along a first direction perpendicular to the first surface.
The heat transfer body holds the reactor component and
The reactor component is thermally connected to the heat dissipation component .
The reactor component and the heat transfer body are thermally connected by a potting material having heat dissipation.
The heat-generating electronic component is
It is fixed to the heat transfer body in a state where the longitudinal direction of the heat generating electronic component is parallel to the first direction and is not in contact with the heat radiating component.
The heat transfer body has a second surface and a third surface facing the second surface.
The heat transfer body is thermally connected to the heat generating electronic component via the second surface.
The heat transfer body is thermally connected to the reactor component by the potting material via the third surface.
In-vehicle charger.

The reactor component and the heat transfer body are thermally connected by a potting material having heat dissipation.
The vehicle-mounted charger according to claim 11.

With the circuit board
A heat-generating electronic component having a lead wire that self-heats when energized and is connected to the circuit board.
A heat transfer body in which the heat dissipation surface of the heat generating electronic component is thermally connected and the heat generating electronic component is arranged,
It has a first surface and has a heat dissipation component that is thermally connected to the heat transfer body via the first surface.
The heat transfer body and the circuit board are arranged in the order of the heat transfer body and the circuit board from the first surface along a first direction perpendicular to the first surface.
The heat transfer body holds the reactor component and
The reactor component is thermally connected to the heat dissipation component .
The reactor component and the heat transfer body are thermally connected by a potting material having heat dissipation.
The heat-generating electronic component is
It is fixed to the heat transfer body in a state where the longitudinal direction of the heat generating electronic component is parallel to the first direction and is not in contact with the heat radiating component.
The heat transfer body has a second surface and a third surface facing the second surface.
The heat transfer body is thermally connected to the heat generating electronic component via the second surface.
The heat transfer body is thermally connected to the reactor component by the potting material via the third surface.
vehicle.

The reactor component and the heat transfer body are thermally connected by a potting material having heat dissipation.
The vehicle according to claim 13.