JP6726862B2 - Heat dissipation device for heat-generating electronic components and in-vehicle charger - Google Patents
Heat dissipation device for heat-generating electronic components and in-vehicle charger Download PDFInfo
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- JP6726862B2 JP6726862B2 JP2015241074A JP2015241074A JP6726862B2 JP 6726862 B2 JP6726862 B2 JP 6726862B2 JP 2015241074 A JP2015241074 A JP 2015241074A JP 2015241074 A JP2015241074 A JP 2015241074A JP 6726862 B2 JP6726862 B2 JP 6726862B2
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- 230000017525 heat dissipation Effects 0.000 title claims description 65
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000004382 potting Methods 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 40
- 229910052782 aluminium Inorganic materials 0.000 description 40
- 238000012986 modification Methods 0.000 description 15
- 230000004048 modification Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 230000010485 coping Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本発明は、発熱電子部品の放熱装置、および車載充電器に関する。 The present invention, heat-generating electronic component of the heat dissipation device, a contact and on-board charger.
従来、放熱部材で形成された略直方体の筐体内に基板や電子部品を格納し、電子部品から発生する熱を、筐体を介して放熱することが知られている。このような略直方体の筐体の構造の製造方法として、上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法と、下面（底面）と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法の２通りが知られている。 Conventionally, it is known that a substrate or an electronic component is stored in a substantially rectangular parallelepiped casing formed of a heat radiating member, and heat generated from the electronic component is radiated through the casing. As a method of manufacturing such a structure of a substantially rectangular parallelepiped housing, a method of integrally covering the upper surface and the side surface into a box shape and covering the housing with an opened lower surface from above, and a method of forming the lower surface (bottom surface) and the side surface into a box shape There are two known methods of covering a housing that is integrally molded with a casing having an opened upper surface with a lid member (upper surface).
上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法を用いる場合、下面に基板や電子部品を取り付ける際には側面が存在しないため、側方から電子部品をネジ留めすることが可能であるが、一方、筐体内に格納した電子部品を筐体外の電子部品と電気的に接続するための端子（コネクタ）の配置に制約が生じる。 When using a method in which the top and side surfaces are integrally molded into a box shape and the bottom surface is opened from the top, the side surface does not exist when mounting a substrate or electronic component on the bottom surface, so the electronic components However, on the other hand, there are restrictions on the arrangement of terminals (connectors) for electrically connecting the electronic components stored in the housing to the electronic components outside the housing.
一般的に、コネクタを側面に設ける場合には、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法を用いることが好ましい。 In general, when the connector is provided on the side surface, it is preferable to use a method of covering the housing having the lower surface and the side surface integrally formed in a box shape and having the upper surface opened with the lid member (upper surface).
しかしながら、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法においては、下面と側面が箱型に一体成型されているため、側方から電子部品をネジ留めすることが不可能であり、開口された上面からネジ留めを行う必要がある。 However, in the method in which the lid member (upper surface) is covered on the housing in which the lower surface and the side surface are integrally molded in the box shape and the upper surface is opened, the lower surface and the side surface are integrally molded in the box shape, so It is impossible to screw electronic components, and it is necessary to screw them from the opened top surface.
開口された上面から電子部品を固定するためのネジ留めを行う方法として、発熱電子部品のリード線を折り曲げることで発熱電子部品の放熱面を底面に直接接触させて配置し、例えば、特許文献１に開示されている弾性部材が放熱面の反対側の面を押さえつけるように弾性部材を上方からネジ留めすることが考えられる。 As a method of screwing to fix the electronic component from the opened upper surface, the lead wire of the heat-generating electronic component is bent to dispose the heat-dissipating surface of the heat-generating electronic component in direct contact with the bottom surface. It is conceivable to screw the elastic member from above so that the elastic member disclosed in 1) presses the surface opposite to the heat radiation surface.
しかしながら、上述した放熱機構の底面に発熱電子部品を配置する方法では、放熱効果を確保するために、放熱機構の底面において発熱電子部品の放熱面が接触する部分の面積および弾性部材が設置される部分の面積が必要となり、底面積の大型化、ひいては装置全体が大型化してしまうおそれがある。 However, in the above-described method of disposing the heat-generating electronic component on the bottom surface of the heat-dissipating mechanism, the area of the portion of the bottom surface of the heat-dissipating mechanism that is in contact with the heat-dissipating surface of the heat-dissipating electronic component and the elastic member are provided in order to secure the heat-dissipating effect. The area of the part is required, and there is a possibility that the bottom area becomes large and that the entire apparatus becomes large.
本発明の目的は、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる発熱電子部品の放熱装置、および車載充電器を提供することである。 An object of the present invention is to dissipate heat in a heat-generating electronic component that is capable of coping with heat dissipation in a heat-generating electronic component while suppressing an increase in size when using a heat-dissipating mechanism that is integrally molded in a box shape and has an opening provided on only one surface. apparatus, is to provide you and the vehicle-mounted charger.
本発明の一態様に係る発熱電子部品の放熱装置は、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品の放熱面が接触し、前記発熱電子部品が配置される伝熱体と、箱型に一体成型され、前記伝熱体が配置される第１の面と、前記第１の面に対向し、開口部が設けられた第２の面とを有し、前記伝熱体からの熱を放熱する放熱部品と、を有し、前記発熱電子部品は、前記第１の面と交差する前記伝熱体の面に固定され、前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されており、前記伝熱体は部品を収容する空間が設けられた収容部を有し、前記部品は前記収容部を介して前記放熱部品と熱的に接続される。 In a heat dissipation device for heat-generating electronic components according to an aspect of the present invention, a heat generating electronic component having a circuit board, a lead wire that self-heats when energized, and has a lead wire connected to the circuit board, and a heat radiating surface of the heat generating electronic component are in contact A heat transfer body on which the heat-generating electronic component is arranged, a first surface integrally formed in a box shape, on which the heat transfer body is arranged, and an opening provided opposite to the first surface. A heat dissipating component that dissipates heat from the heat transfer body, and the heat generating electronic component is fixed to a surface of the heat transfer body that intersects the first surface. is, the heat transfer body and the circuit board, along a first direction perpendicular to the first surface, the heat transfer from the first surface, are arranged in the order of the circuit board The heat transfer body has a housing portion in which a space for housing the component is provided, and the component is thermally connected to the heat dissipation component via the housing portion .
本発明の一態様に係る車載充電器は、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品の放熱面が接触し、前記発熱電子部品が配置される伝熱体と、箱型に成型され、前記伝熱体が配置される第１の面と、前記第１の面に対向し、開口部が設けられた第２の面とを有し、前記伝熱体からの熱を放熱する放熱部品と、を有し、前記発熱電子部品は、前記第１の面と交差する前記伝熱体の面に固定され、前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されており、前記伝熱体は部品を収容する空間が設けられた収容部を有し、前記部品は前記収容部を介して前記放熱部品と熱的に接続される。 An in- vehicle charger according to an aspect of the present invention, a circuit board, a heat-generating electronic component having a lead wire that is self-heated by energization and connected to the circuit board, and a heat-radiating surface of the heat-generating electronic component are in contact with each other, and A heat transfer body on which the heat-generating electronic component is arranged, a first surface formed in a box shape on which the heat transfer body is arranged, and a second surface facing the first surface and provided with an opening. A heat-dissipating component that dissipates heat from the heat conductor, and the heat-generating electronic component is fixed to a surface of the heat conductor that intersects the first surface, The heat body and the circuit board are arranged in this order from the first surface to the heat transfer body and the circuit board along a first direction perpendicular to the first surface. The body has an accommodating portion provided with a space for accommodating the component, and the component is thermally connected to the heat dissipation component via the accommodating portion .
本発明によれば、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる。 According to the present invention, when a heat dissipation mechanism integrally formed in a box shape and having an opening provided on only one surface is used, it is possible to cope with heat dissipation of heat-generating electronic components while suppressing an increase in size.
（実施の形態）
以下、本発明の実施の形態について、図面を参照して説明する。
(Embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
まず、図１〜４を用いて、本実施の形態に係る発熱電子部品の放熱構造１の構成例について説明する。図１は、発熱電子部品の放熱構造１の一例を示す斜視図である。図２は、発熱電子部品の放熱構造１の一例を示す正面図である。図３は、発熱電子部品の放熱構造１の一例を示す側面図である。図４は、発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図１、図２では、ヒートシンク２の前面部分の図示を省略しており、図３では、ヒートシンク２の側面部分の図示を省略している。また、図４では、図１〜図３に示す回路基板９の図示を省略している。 First, a configuration example of the heat dissipation structure 1 of the heat-generating electronic component according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing an example of a heat dissipation structure 1 of a heat-generating electronic component. FIG. 2 is a front view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 3 is a side view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 4 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. 1 and 2, the illustration of the front surface portion of the heat sink 2 is omitted, and in FIG. 3, the illustration of the side surface portion of the heat sink 2 is omitted. Further, in FIG. 4, the circuit board 9 shown in FIGS. 1 to 3 is omitted.
発熱電子部品の放熱構造１は、例えば、車両に搭載される充電器やインバータ等に用いられる。発熱電子部品の放熱構造１は、ヒートシンク２、アルミブロック３、電子部品５ａ、５ｂ、回路基板９を備える。 The heat dissipation structure 1 of the heat-generating electronic component is used, for example, in a charger, an inverter or the like mounted on a vehicle. The heat dissipation structure 1 of the heat-generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5a and 5b, and a circuit board 9.
ヒートシンク２（放熱機構の一例）は、箱型に一体成型され、一面のみに開口部が設けられている。Ｆ１は、開口面（第２の面の一例）であり、Ｆ２は、開口面Ｆ１に対向する底面（第１の面の一例）である。 The heat sink 2 (an example of a heat dissipation mechanism) is integrally molded in a box shape, and an opening is provided only on one surface. F1 is an opening surface (an example of a second surface), and F2 is a bottom surface (an example of a first surface) facing the opening surface F1.
ヒートシンク２の底面Ｆ２の四隅には、底面Ｆ２に対する垂直方向Ｄ（以下、単に「垂直方向」という）に沿って、支柱２ａ、２ｂ、２ｃ、２ｄが設けられている。支柱２ａ〜２ｄには、それぞれ、ネジ穴（図示略）が形成されており、後述する回路基板９がネジ留めされる。 Posts 2a, 2b, 2c, and 2d are provided at four corners of the bottom surface F2 of the heat sink 2 along a vertical direction D (hereinafter, simply referred to as “vertical direction”) with respect to the bottom surface F2. Screw holes (not shown) are formed in each of the columns 2a to 2d, and a circuit board 9 described later is screwed thereto.
アルミブロック３（伝熱体の一例）は、アルミで形成された略直方体の部材である。アルミブロック３は、その長手方向が垂直方向Ｄに沿うようにヒートシンク２の内部に配置されている。 The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is arranged inside the heat sink 2 such that its longitudinal direction is along the vertical direction D.
アルミブロック３は、その下部に略直方体の締結部３ａを有している。この締結部３ａは、ネジ４ａ、４ｂ（固定部材の一例）により底面Ｆ２にネジ留めされる。これにより、アルミブロック３は、底面Ｆ２に接触して固定される。 The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at the bottom thereof. The fastening portion 3a is screwed to the bottom surface F2 with screws 4a and 4b (an example of a fixing member). As a result, the aluminum block 3 is fixed in contact with the bottom surface F2.
電子部品５ａ、５ｂ（発熱電子部品の一例）は、通電によって自己発熱する電子部品であり、例えば、ディスクリート部品、ＦＥＴ（Field Effect Transistor）等である。電子部品５ａ、５ｂは、それぞれ、リード線６ａ、６ｂを有する。 The electronic components 5a and 5b (an example of heat-generating electronic components) are electronic components that self-heat when energized, such as discrete components and FETs (Field Effect Transistors). The electronic components 5a and 5b have lead wires 6a and 6b, respectively.
電子部品５ａ、５ｂは、それぞれの放熱面がアルミブロック３の側面に接触するように、アルミブロック３に取り付けられる。例えば、電子部品５ａ、５ｂは、それぞれ、バネ７ａ、７ｂ（保持部材の一例）により、放熱面に対向する面から押さえ付けられ、アルミブロック３の側面に固着して保持される。バネ７ａ、７ｂは、それぞれ、ネジ８ａ、８ｂによりアルミブロック３の側面にネジ留めされる。 The electronic components 5a and 5b are attached to the aluminum block 3 such that the heat radiation surfaces of the electronic components 5a and 5b come into contact with the side surfaces of the aluminum block 3. For example, the electronic components 5a and 5b are pressed by the springs 7a and 7b (an example of a holding member) from the surface facing the heat radiation surface, and are fixedly held on the side surface of the aluminum block 3. The springs 7a and 7b are screwed to the side surfaces of the aluminum block 3 by screws 8a and 8b, respectively.
アルミブロック３に固着した電子部品５ａ、５ｂは、垂直方向Ｄに沿って直立した状態となる。また、アルミブロック３に固着した電子部品５ａ、５ｂは、ヒートシンク２に接触しない。 The electronic components 5a and 5b fixed to the aluminum block 3 are upright along the vertical direction D. Further, the electronic components 5 a and 5 b fixed to the aluminum block 3 do not come into contact with the heat sink 2.
以上のようにアルミブロック３に固着した電子部品５ａ、５ｂから発生する熱は、アルミブロック３を介して、ヒートシンク２へ伝熱される。これにより、電子部品５ａ、５ｂの放熱が実現される。 The heat generated from the electronic components 5a and 5b fixed to the aluminum block 3 as described above is transferred to the heat sink 2 via the aluminum block 3. Thereby, heat dissipation of the electronic components 5a and 5b is realized.
なお、図１〜図４では、例として、アルミブロック３に固着する電子部品を２つとしたが、１つであってもよいし、３つ以上であってもよい。また、複数の電子部品は、アルミブロック３の一面のみならず複数の面に固着されてもよい。 1 to 4, two electronic components are fixed to the aluminum block 3 as an example, but the number may be one, or three or more. Further, the plurality of electronic components may be fixed to not only one surface of the aluminum block 3 but also a plurality of surfaces.
回路基板９は、パターンが形成されたり、所定の半導体素子（図示略）が実装されたりするプリント基板である。回路基板９は、上述した支柱２ａ〜２ｄに載置される。そして、回路基板９は、ネジ１０ａ、１０ｂ、１０ｃ、１０ｄにより柱２ａ〜２ｄにネジ留めされる。これにより、回路基板９は、支柱２ａ〜２ｄに固定される。 The circuit board 9 is a printed board on which a pattern is formed and a predetermined semiconductor element (not shown) is mounted. The circuit board 9 is placed on the columns 2a to 2d described above. Then, the circuit board 9 is screwed to the columns 2a to 2d with screws 10a, 10b, 10c, and 10d. As a result, the circuit board 9 is fixed to the columns 2a to 2d.
また、回路基板９は、例えば半田付けにより、電子部品５ａのリード線６ａおよび電子部品５ｂのリード線６ｂと接続する。 The circuit board 9 is connected to the lead wire 6a of the electronic component 5a and the lead wire 6b of the electronic component 5b by, for example, soldering.
アルミブロック３および回路基板９は、垂直方向Ｄに沿って、底面Ｆ２からアルミブロック３、回路基板９の順に配置される。 The aluminum block 3 and the circuit board 9 are arranged along the vertical direction D in this order from the bottom surface F2 to the aluminum block 3 and the circuit board 9.
また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される。これにより、回路基板９における固定点が多くなり、リード線６ａ、６ｂの折れを防止できる。特に支柱２ａ〜２ｄが高く、振動が多く生じる場合に効果を奏する。 Further, the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member). As a result, the number of fixing points on the circuit board 9 increases, and it is possible to prevent the lead wires 6a and 6b from being broken. This is particularly effective when the columns 2a to 2d are high and a large amount of vibration occurs.
また、ボンド１１ａ、１１ｂは、絶縁性または放熱性の少なくとも一方を有することが好ましい。ボンド１１ａ、１１ｂが絶縁性を有する場合、回路基板９においてボンド１１ａ、１１ｂに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。また、ボンド１１ａ、１１ｂが放熱性を有する場合、回路基板９で発生した熱を、ボンド１１ａ、１１ｂを介してアルミブロック３へ伝熱できる。 Further, the bonds 11a and 11b preferably have at least one of insulating property and heat dissipation property. When the bonds 11a and 11b have an insulating property, a pattern can be formed or a semiconductor element can be mounted on the circuit board 9 at a position corresponding to the bonds 11a and 11b. Further, when the bonds 11a and 11b have a heat dissipation property, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 through the bonds 11a and 11b.
なお、図１〜図４では、図示を省略しているが、回路基板９の上方に、開口面Ｆ１を閉塞するカバーが設けられてもよい。 Although not shown in FIGS. 1 to 4, a cover for closing the opening face F1 may be provided above the circuit board 9.
以上説明したように、本実施の形態の発熱電子部品の放熱構造１は、ヒートシンク２に接触して配置されたアルミブロック３に対して電子部品５ａ、５ｂの放熱面を接触させて配置するため、電子部品５ａ、５ｂの放熱面をヒートシンク２の底面Ｆ２に接触させて配置する場合に比べて、大型化を抑制しつつ、電子部品の放熱に対応することができる。 As described above, in the heat dissipation structure 1 for heat-generating electronic components according to the present embodiment, the heat dissipation surfaces of the electronic components 5a and 5b are arranged in contact with the aluminum block 3 arranged in contact with the heat sink 2. As compared with the case where the heat radiating surfaces of the electronic components 5a and 5b are placed in contact with the bottom surface F2 of the heat sink 2, it is possible to cope with heat radiating of the electronic components while suppressing an increase in size.
以上、発熱電子部品の放熱構造１の構成例について説明した。 The configuration example of the heat dissipation structure 1 of the heat-generating electronic component has been described above.
次に、発熱電子部品の放熱構造１の製造方法について、図１〜図４を用いて説明する。 Next, a method of manufacturing the heat dissipation structure 1 of the heat-generating electronic component will be described with reference to FIGS.
まず、バネ７ａ、７ｂおよびネジ８ａ、８ｂを用いて、電子部品５ａ、５ｂをアルミブロック３に固定して接着させる。このとき、電子部品５ａ、５ｂの放熱面をアルミブロック３に接触させる。なお、電子部品５ａ、５ｂが、絶縁が必要なタイプの場合であれば、電子部品５ａ、５ｂの放熱面とアルミブロック３の間に放熱絶縁シート（図示略）を設けることが好ましい。 First, the electronic components 5a and 5b are fixed and adhered to the aluminum block 3 using the springs 7a and 7b and the screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat radiation insulating sheet (not shown) between the heat radiation surface of the electronic components 5a and 5b and the aluminum block 3.
次に、電子部品５ａ、５ｂが固着したアルミブロック３を、ヒートシンク２の開口面Ｆ１からヒートシンク２の内部に収容し、アルミブロック３を底面Ｆ２に配置する。そして、ネジ４ａ、４ｂを用いて締結部３ａを底面Ｆ２にネジ留めする。 Next, the aluminum block 3 to which the electronic components 5a and 5b are fixed is housed inside the heat sink 2 from the opening face F1 of the heat sink 2, and the aluminum block 3 is arranged on the bottom face F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.
次に、回路基板９を、ヒートシンク２の開口面からヒートシンク２の内部に収容し、支柱２ａ〜２ｄに配置する。このとき、リード線６ａ、６ｂを回路基板９に対して半田付けする。そして、ネジ１０ａ〜１０ｄを用いて回路基板９を支柱２ａ〜２ｄにネジ留めする。 Next, the circuit board 9 is housed inside the heat sink 2 from the opening surface of the heat sink 2 and arranged on the columns 2a to 2d. At this time, the lead wires 6a and 6b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the columns 2a to 2d using the screws 10a to 10d.
以上の製造方法により、図１〜図４に示した発熱電子部品の放熱構造１が製造される。 By the above manufacturing method, the heat dissipation structure 1 of the heat-generating electronic component shown in FIGS. 1 to 4 is manufactured.
なお、回路基板９のネジ留めの後で、回路基板９の上方に、開口面Ｆ１を閉塞するカバー（図示略）を設けてもよい。 A cover (not shown) that closes the opening surface F1 may be provided above the circuit board 9 after the circuit board 9 is screwed.
以上、本発明の実施の形態について説明したが、本発明は上記実施の形態に限定されず、種々の変形が可能である。以下、変形例について説明する。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and various modifications can be made. Hereinafter, modified examples will be described.
（変形例１）
本変形例に係る発熱電子部品の放熱構造１について、図５を用いて説明する。図５は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図５において、図１〜図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図５では、図１〜図３に示した回路基板９の図示を省略している。
(Modification 1)
The heat dissipation structure 1 of the heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 5 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to the present modification. 5, the same components as those in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 5, the circuit board 9 shown in FIGS. 1 to 3 is omitted.
本変形例では、図５に示すように、ヒートシンク２において、アルミブロック３０および電子部品３２を備える点が図１〜図４と異なる。 As shown in FIG. 5, the present modification example is different from FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32.
アルミブロック３０は、その下部に略直方体の締結部３０ａを有している。なお、図５では、支柱２ａと支柱２ｂとの間にある締結部３０ａのみを図示しているが、これと同様に支柱２ｄと支柱２ｃの間にも締結部３０ａが存在する。 The aluminum block 30 has a substantially rectangular parallelepiped fastening portion 30a at the bottom thereof. In addition, in FIG. 5, only the fastening portion 30a between the columns 2a and 2b is shown, but similarly, the fastening portion 30a exists between the columns 2d and 2c.
締結部３０ａは、ネジ３１により底面Ｆ２にネジ留めされる。これにより、アルミブロック３０は、底面Ｆ２に接触して固定される。 The fastening portion 30a is screwed to the bottom surface F2 with the screw 31. As a result, the aluminum block 30 is fixed in contact with the bottom surface F2.
また、アルミブロック３０は、略直方体状の空間が設けられた収容部３０ｂを有する。この収容部３０ｂの空間には、電子部品３２（例えば、リアクトル部品。高背部品の一例）が収容される。電子部品３２の底面は、ヒートシンク２の底面Ｆ２に接触して固定される。なお、図示は省略しているが、電子部品３２と収容部３０ｂとの間には、ポッティング材が充填されている。 The aluminum block 30 also has a housing portion 30b in which a substantially rectangular parallelepiped space is provided. An electronic component 32 (for example, a reactor component, which is an example of a tall component) is accommodated in the space of the accommodation portion 30b. The bottom surface of the electronic component 32 contacts and is fixed to the bottom surface F2 of the heat sink 2. Although illustration is omitted, a potting material is filled between the electronic component 32 and the housing portion 30b.
電子部品３２は、底面Ｆ２と回路基板９（図１〜図３参照）の間において、電子部品３２の長手方向が垂直方向Ｄ（図１〜図３参照）に沿うように直立して配置される。また、電子部品３２の垂直方向Ｄの長さ（電子部品３２の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic component 32 is arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) such that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3). It The length of the electronic component 32 in the vertical direction D (the length of the electronic component 32 in the longitudinal direction) is the length of the electronic components 5a and 5b in the vertical direction D (the length of the electronic components 5a and 5b in the longitudinal direction). Longer than.
このように、電子部品３２を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 In this way, by disposing the electronic component 32 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat dissipation structure 1 of the heat-generating electronic component does not increase in size in the height direction (vertical direction D).
本変形例によれば、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３２の固定（振動対策）も行うことができる。また、ポッティング材が放熱性のポッティング材である場合には、電子部品３２の固定（振動対策）と放熱も行うことができる。 According to this modification, in addition to the effect described in the first embodiment, the electronic component 32 arranged on the bottom surface F2 of the heat sink 2 can be fixed (vibration countermeasure). When the potting material is a heat-dissipating potting material, the electronic component 32 can be fixed (vibration countermeasure) and heat can be dissipated.
（変形例２）
本変形例に係る発熱電子部品の放熱構造１について、図６を用いて説明する。図６は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図６において、図１〜図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図６では、図１〜図３に示した回路基板９の図示を省略している。
(Modification 2)
The heat dissipation structure 1 of the heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 6 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to the present modification. In FIG. 6, the same components as those in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 6, the circuit board 9 shown in FIGS. 1 to 3 is omitted.
本変形例では、図６に示すように、ヒートシンク２において、電子部品３３、３４を備える点が図１〜図４と異なる。 In this modified example, as shown in FIG. 6, the heat sink 2 is provided with electronic components 33 and 34, which is different from FIGS. 1 to 4.
電子部品３３、３４（例えば、リアクトル部品。高背部品の一例）は、それぞれ、ヒートシンク２の底面Ｆ２に接触して固定される。 The electronic components 33 and 34 (for example, a reactor component, an example of a high-profile component) are in contact with and fixed to the bottom surface F2 of the heat sink 2.
電子部品３３、３４は、底面Ｆ２と回路基板９（図１〜図３参照）の間において、電子部品３３、３４の長手方向が垂直方向Ｄ（図１〜図３参照）に沿うように直立して配置される。また、電子部品３３、３４の垂直方向Ｄの長さ（電子部品３３、３４の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic components 33 and 34 are erected so that the longitudinal direction of the electronic components 33 and 34 is along the vertical direction D (see FIGS. 1 to 3) between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3). Will be placed. The length of the electronic components 33 and 34 in the vertical direction D (the length of the electronic components 33 and 34 in the longitudinal direction) is the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal direction of the electronic components 5a and 5b). Longer than).
このように、電子部品３３、３４を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 By arranging the electronic components 33 and 34 on the bottom surface F2 in this manner, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat dissipation structure 1 of the heat-generating electronic component does not increase in size in the height direction (vertical direction D).
本変形例では、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３３、３４の放熱も行うことができる。 In this modification, in addition to the effect described in the first embodiment, heat dissipation of the electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2 can also be performed.
（変形例３）
実施の形態では、ヒートシンク２を用いて空冷を行う場合を例に挙げて説明したが、空冷の代わりに、水冷を適用してもよい。
(Modification 3)
In the embodiment, the case where air cooling is performed using the heat sink 2 has been described as an example, but water cooling may be applied instead of air cooling.
（変形例４）
実施の形態では、アルミブロック３の底面Ｆ２への締結、バネ７ａ、７ｂのアルミブロック３への締結、回路基板９の支柱２ａ〜２ｄへの締結にネジを用いる場合を例に挙げて説明したが、ネジの代わりに、ボンドを用いてもよい。また、実施の形態では、電子部品５ａ、５ｂのアルミブロック３への固着にバネを用いる場合を例に挙げて説明したが、バネの代わりに、ネジを用いてもよい。
(Modification 4)
In the embodiment, the case where screws are used for fastening to the bottom surface F2 of the aluminum block 3, fastening of the springs 7a and 7b to the aluminum block 3, and fastening to the columns 2a to 2d of the circuit board 9 has been described as an example. However, a bond may be used instead of the screw. Further, in the embodiment, the case where the spring is used to fix the electronic components 5a and 5b to the aluminum block 3 has been described as an example, but a screw may be used instead of the spring.
（変形例５）
また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される場合を例に挙げて説明したが、グリスやギャップフィラー（放熱部材の一例）等の接着性を有しない放熱性部材をアルミブロック３と回路基板９の間に設けてもよい。これにより、回路基板９で発生した熱を、グリスやギャップフィラー等を介してアルミブロック３へ伝熱できる。また、グリスやギャップフィラーが絶縁性を有する場合、回路基板９においてグリスやギャップフィラーに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。
(Modification 5)
Further, although the aluminum block 3 and the circuit board 9 are described as an example in which the aluminum blocks 3 and the circuit board 9 are bonded and fixed to each other by the bonds 11a and 11b (an example of an adhesive member), grease, a gap filler (an example of a heat dissipation member), or the like. A heat dissipation member having no adhesiveness may be provided between the aluminum block 3 and the circuit board 9. Thereby, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 via the grease, the gap filler, or the like. Further, when the grease or the gap filler has an insulating property, it is possible to form a pattern or mount a semiconductor element on a portion of the circuit board 9 corresponding to the grease or the gap filler.
本発明は、発熱電子部品の放熱装置、および車載充電器に有用である。 The present invention, heat-generating electronic component of the heat dissipation device, useful for your and board charger.
１ 発熱電子部品の放熱構造
２ ヒートシンク
２ａ、２ｂ、２ｃ、２ｄ 支柱
３、３０ アルミブロック
３ａ、３０ａ 締結部
４ａ、４ｂ、８ａ、８ｂ、１０ａ、１０ｂ、１０ｃ、１０ｄ、３１ ネジ
５ａ、５ｂ 電子部品
６ａ、６ｂ リード線
７ａ、７ｂ バネ
９ 回路基板
３０ｂ 収容部
３２、３３、３４ 電子部品
DESCRIPTION OF SYMBOLS 1 Heat dissipation structure of heat-generating electronic components 2 Heat sinks 2a, 2b, 2c, 2d Struts 3, 30 Aluminum blocks 3a, 30a Fastening parts 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 Screws 5a, 5b Electronic components 6a, 6b Lead wire 7a, 7b Spring 9 Circuit board 30b Storage part 32, 33, 34 Electronic component
Claims (12)
通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
前記発熱電子部品の放熱面が接触し、前記発熱電子部品が配置される伝熱体と、
箱型に一体成型され、前記伝熱体が配置される第１の面と、前記第１の面に対向し、開口部が設けられた第２の面とを有し、前記伝熱体からの熱を放熱する放熱部品と、を有し、
前記発熱電子部品は、前記第１の面と交差する前記伝熱体の面に固定され、
前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、前記第１の面から前記伝熱体、前記回路基板の順に配置されており、
前記伝熱体は部品を収容する空間が設けられた収容部を有し、
前記部品は前記収容部を介して前記放熱部品と熱的に接続される、
発熱電子部品の放熱装置。 Circuit board,
A heat-generating electronic component that has a lead wire that is self-heated by energization and that is connected to the circuit board;
A heat transfer body in which the heat dissipation surface of the heat generating electronic component is in contact with the heat generating electronic component,
From the heat transfer body, which is integrally molded in a box shape and has a first surface on which the heat transfer body is arranged and a second surface facing the first surface and provided with an opening. And a heat dissipation component that dissipates the heat of
The heat-generating electronic component is fixed to a surface of the heat transfer body that intersects with the first surface,
The heat transfer body and the circuit board, along a first direction perpendicular to the first surface, the heat transfer from the first surface, are arranged in the order of the circuit board,
The heat transfer body has a housing portion provided with a space for housing components,
The component is thermally connected to the heat dissipation component via the accommodation portion,
Heat dissipation device for heat-generating electronic components.
前記発熱電子部品の長手方向が前記第１の方向に平行となる状態、かつ、前記放熱部品に接触しない状態で、前記伝熱体に固定される、
請求項１に記載の発熱電子部品の放熱装置。 The heat-generating electronic component is
The heat generating electronic component is fixed to the heat transfer body in a state in which the longitudinal direction thereof is parallel to the first direction and in a state of not contacting the heat radiating component,
The heat dissipation device for the heat-generating electronic component according to claim 1.
接着部材により前記回路基板に接着して固定される、
請求項１または２に記載の発熱電子部品の放熱装置。 The heat transfer body is
The circuit board is adhered and fixed by an adhesive member,
The heat dissipation device for the heat-generating electronic component according to claim 1.
絶縁性または放熱性の少なくとも一方を有する、
請求項３に記載の発熱電子部品の放熱装置。 The adhesive member is
Having at least one of insulation and heat dissipation,
The heat dissipation device for the heat-generating electronic component according to claim 3.
請求項１または２に記載の発熱電子部品の放熱装置。 A heat dissipation member is disposed between the heat transfer body and the circuit board,
The heat dissipation device for the heat-generating electronic component according to claim 1.
前記回路基板において、前記絶縁性および放熱性を有する部材に対応する箇所に、パターンが形成される、
請求項１または２に記載の発熱電子部品の放熱装置。 A member having an insulating property and a heat dissipation property is disposed between the heat transfer member and the circuit board,
In the circuit board, a pattern is formed at a location corresponding to the member having the insulating property and the heat dissipation property,
The heat dissipation device for the heat-generating electronic component according to claim 1.
請求項６に記載の発熱電子部品の放熱装置。 The insulating and heat-dissipating member also has adhesiveness,
The heat dissipation device for the heat-generating electronic component according to claim 6 .
前記高背部品の前記第１の方向の長さは、前記発熱電子部品の前記第１の方向の長さよりも長い、
請求項１に記載の発熱電子部品の放熱装置。 The component is a high-profile component between the bottom surface of the heat dissipation component and the circuit board,
The length of the high-height component in the first direction is longer than the length of the heat-generating electronic component in the first direction,
The heat dissipation device for the heat-generating electronic component according to claim 1 .
請求項１または８に記載の発熱電子部品の放熱装置。 The bottom surface of the component is fixed in contact with the bottom surface of the heat dissipation component,
Heat radiator of the heat generating electronic component according to claim 1 or 8.
請求項１から９のいずれか１項に記載の発熱電子部品の放熱装置。 The accommodating portion is filled with a heat-dissipating potting material,
A heat dissipation device for a heat-generating electronic component according to any one of claims 1 to 9 .
前記放熱部品の前記第１の面に接触するように固定される、
請求項１から６のいずれか１項に記載の発熱電子部品の放熱装置。 The heat transfer body is
Fixed in contact with the first surface of the heat dissipation component,
The heat dissipation device for the heat-generating electronic component according to claim 1.
通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
前記発熱電子部品の放熱面が接触し、前記発熱電子部品が配置される伝熱体と、
箱型に成型され、前記伝熱体が配置される第１の面と、前記第１の面に対向し、開口部が設けられた第２の面とを有し、前記伝熱体からの熱を放熱する放熱部品と、を有し、
前記発熱電子部品は、前記第１の面と交差する前記伝熱体の面に固定され、
前記伝熱体および前記回路基板は、前記第１の面に対して垂直な第１の方向に沿って、
前記第１の面から前記伝熱体、前記回路基板の順に配置されており、
前記伝熱体は部品を収容する空間が設けられた収容部を有し、
前記部品は前記収容部を介して前記放熱部品と熱的に接続される、
車載充電器。 Circuit board,
A heat-generating electronic component that has a lead wire that is self-heated by energization and that is connected to the circuit board;
A heat transfer body in which the heat dissipation surface of the heat generating electronic component is in contact with the heat generating electronic component,
A box-shaped molded body having a first surface on which the heat transfer body is arranged and a second surface facing the first surface and provided with an opening, And a heat dissipation component that dissipates heat,
The heat-generating electronic component is fixed to a surface of the heat transfer body that intersects with the first surface,
The heat conductor and the circuit board are arranged along a first direction perpendicular to the first surface,
The heat transfer from the first surface, are arranged in the order of the circuit board,
The heat transfer body has a housing portion provided with a space for housing components,
The component is thermally connected to the heat dissipation component via the accommodation portion,
In-vehicle charger.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015241074A JP6726862B2 (en) | 2015-12-10 | 2015-12-10 | Heat dissipation device for heat-generating electronic components and in-vehicle charger |
| PCT/JP2016/005018 WO2017098703A1 (en) | 2015-12-10 | 2016-11-30 | Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger |
| CN201690001311.2U CN208690245U (en) | 2015-12-10 | 2016-11-30 | The radiator and onboard charger of heat-generating electronic part |
| JP2020100805A JP6982776B2 (en) | 2015-12-10 | 2020-06-10 | Heat dissipation devices for heat-generating electronic components, in-vehicle chargers, and vehicles |
| JP2021178787A JP7262012B2 (en) | 2015-12-10 | 2021-11-01 | Onboard charger and inverter |
| JP2023050349A JP7466850B2 (en) | 2015-12-10 | 2023-03-27 | On-board chargers and inverters |
| JP2024041229A JP2024075654A (en) | 2015-12-10 | 2024-03-15 | On-vehicle battery charger and inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015241074A JP6726862B2 (en) | 2015-12-10 | 2015-12-10 | Heat dissipation device for heat-generating electronic components and in-vehicle charger |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020100805A Division JP6982776B2 (en) | 2015-12-10 | 2020-06-10 | Heat dissipation devices for heat-generating electronic components, in-vehicle chargers, and vehicles |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017108007A JP2017108007A (en) | 2017-06-15 |
| JP2017108007A5 JP2017108007A5 (en) | 2019-01-24 |
| JP6726862B2 true JP6726862B2 (en) | 2020-07-22 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015241074A Active JP6726862B2 (en) | 2015-12-10 | 2015-12-10 | Heat dissipation device for heat-generating electronic components and in-vehicle charger |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6726862B2 (en) |
| CN (1) | CN208690245U (en) |
| WO (1) | WO2017098703A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7233026B2 (en) | 2018-04-25 | 2023-03-06 | パナソニックＩｐマネジメント株式会社 | power supply |
| JP7056375B2 (en) * | 2018-05-22 | 2022-04-19 | 株式会社オートネットワーク技術研究所 | Circuit equipment |
| JP7304540B2 (en) * | 2019-12-12 | 2023-07-07 | パナソニックＩｐマネジメント株式会社 | POWER CONVERSION DEVICE AND METHOD FOR MANUFACTURING POWER CONVERSION DEVICE |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6247199U (en) * | 1985-09-12 | 1987-03-23 | ||
| JP2524127Y2 (en) * | 1986-10-23 | 1997-01-29 | 富士電機株式会社 | Cooling body |
| JP2568003Y2 (en) * | 1991-10-18 | 1998-04-08 | 株式会社ケンウッド | Radiator |
| JPH06196885A (en) * | 1992-12-25 | 1994-07-15 | Sony Corp | Heat sink |
| JP4407067B2 (en) * | 2001-03-14 | 2010-02-03 | 株式会社デンソー | Electronic equipment |
| JP4796999B2 (en) * | 2007-07-17 | 2011-10-19 | 日立オートモティブシステムズ株式会社 | Electronic control unit |
| JP4408444B2 (en) * | 2007-09-28 | 2010-02-03 | 株式会社日立製作所 | Electronic control device using LC module structure |
| JP5846181B2 (en) * | 2013-04-22 | 2016-01-20 | 株式会社デンソー | Electronic control unit |
-
2015
- 2015-12-10 JP JP2015241074A patent/JP6726862B2/en active Active
-
2016
- 2016-11-30 WO PCT/JP2016/005018 patent/WO2017098703A1/en active Application Filing
- 2016-11-30 CN CN201690001311.2U patent/CN208690245U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017108007A (en) | 2017-06-15 |
| WO2017098703A1 (en) | 2017-06-15 |
| CN208690245U (en) | 2019-04-02 |
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