JP6222125B2 - Electronics - Google Patents

Description

The present invention relates to an electronic device including an electronic component.

  As a heat dissipation structure of a conventional electronic device, for example, an electronic device is known in which a mounting board, a mounting component, and the like are provided inside a housing, and these are brought into contact with the housing and heat is radiated from fins protruding on the facing surface. .

  In addition, in order to dissipate heat from the back surface of mounting components having different mounting heights, a method of dissipating heat from the fins by interposing a heat conductive material having a different thickness between the mounting component and the housing is known. (See Patent Document 1 below)

Japanese Patent Laid-Open No. 7-32257

  However, in the structure described in the above-mentioned Patent Document 1, when a high-profile component and a low-profile component are mixed, a recess larger than the component area must be formed in the heat sink. Moreover, since the distance to a fin will become long if a recessed part is made according to a high-profile part, thermal resistance will go up.

  An object of the present invention is to provide an electronic device that can be miniaturized by improving heat dissipation and reducing useless space inside a housing even when high-profile parts and low-profile parts are mixed. To do.

In order to achieve the above object, an electronic apparatus according to the present invention includes a housing having a cover provided with a projecting portion having thermal conductivity, and a heat sink provided with a flat portion, an inclined portion, and a cover holding portion. The inclined portion is mounted with a substrate on which at least one heat generating component among the electronic components is mounted, and the flat portion is mounted with a high-profile component having a height higher than that of the heat generating component. The surface of the inclined portion facing the surface on which the heat generating component is mounted and the surface of the flat portion facing the surface on which the high-profile component is mounted include the flat portion, the inclined portion, and the surface of the casing. Fins extending along the direction connecting the remaining two structural parts excluding the cover holding part are provided, the projecting part is in contact with the heat generating component, and the cover is in contact with the cover holding part. contact fixed, the fins, the flat Write from fins provided in part of the fins provided in the inclined portion, the length of the fins are longer.

  As a result, the useless space in the housing can be reduced, so that the volume can be minimized, and an electronic device that does not deteriorate the heat dissipation capability can be provided.

  In the electronic device according to the present invention, it is preferable that the heat generating component is disposed above H / 2 when the height of the electronic device is H. Thereby, while being able to thermally radiate efficiently, arrangement | positioning of various components can be made suitable, and size reduction of an electronic device is attained.

  According to the electronic device of the present invention, the electronic device can be downsized without reducing the heat dissipation capability and reducing the useless space inside the housing even when the high-profile component and the low-profile component are mixed. Can be provided.

It is a disassembled perspective view which shows the electronic device which concerns on embodiment of this invention. It is an external view which shows the electronic device which concerns on embodiment of this invention. It is AA sectional drawing of FIG.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited to the following embodiment. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined. In the description of the drawings, the same components are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is an exploded perspective view showing an electronic apparatus according to an embodiment of the present invention. FIG. 2 is an external view showing an electronic apparatus according to an embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line AA of FIG.

  The electronic device 1 described in the present embodiment generates a desired DC output voltage by, for example, voltage-converting (stepping down) a DC voltage input from a high voltage battery connected to an input terminal, and generating a desired DC output voltage from the output terminal. Examples include a power supply device (switching power supply device) that outputs to a battery.

  As a general configuration of the power supply device, an input smoothing capacitor, a switching circuit, a transformer, a rectifier circuit, a smoothing circuit, a control unit, and the like are provided on the substrate 2 and accommodated in a housing.

  The housing includes a heat sink 3 and a cover 5. The heat sink 3 includes a flat part 3 a that forms the bottom surface of the housing, an inclined part 3 b that is formed at a predetermined angle from the flat part 3 a, and a cover holding part 4 that holds the cover 5. The flat portion 3a, the inclined portion 3b, and the like form an accommodation space 10 that accommodates the substrate 2 and various components. The inclined portion 3b is provided at least at two places, and extends obliquely from the both ends of the flat portion 3a in the left-right upward direction. The cover holding part 4 is provided at least in two places to hold both ends of the cover 5.

  In the accommodation space 10, at least the substrate 2, the heat generating component 8 mounted on the substrate 2, and the high-profile component 9 are accommodated. On the flat portion 3a, a high-profile component 9 having a high component height, such as a winding component such as a transformer or a choke coil, or a discrete component such as an electrolytic capacitor, is disposed. In the inclined portion 3b, a low-profile component including a heat-generating component 8 having a height lower than that of the high-profile component 9 is mounted and disposed on the substrate 2. This low-profile component includes, for example, a control circuit composed of a chip component, a switching element composed of a diode or FET (Field Effect Transistor) as the heat generating component 8, and the like.

  The high-profile component 9 disposed in the flat portion 3a and the low-profile component including the heat generating component 8 disposed in the inclined portion 3b are electrically connected, and the function of the electronic device 1 is realized by these components. . The electrical connection between the high-profile component 9 and the low-profile component is, for example, when the high-profile component 9 is a winding component, and if the winding is composed of a sheet metal 11, a conductive member such as a screw and a pattern on the substrate 2 is used. It may be connected via In the case where the winding is formed in a pattern or in the case of a discrete component such as an electrolytic capacitor, a substrate on which the high-profile component 9 is mounted is arranged on the flat portion 3a, and the substrate pattern and the inclined portion 3b are provided. The pattern of the obtained substrate 2 may be connected via a conductive member.

  The fin 7 is provided below the inclined portion 3 b of the heat sink 2. A plurality of fins 7 are arranged in parallel at substantially equal intervals. The heat generated from the heat generating component 8 secures a first heat radiation route for radiating heat from the fins 7 via the substrate 2 and the inclined portion 3b. In addition, since the fin 7 positioned below the heat generating component 8 can secure a wide heat radiation area, it is particularly suitable for a natural air-cooled power supply device. The heat sink 3 and the fin 7 may be formed by extrusion and die casting using a metal material such as aluminum or a non-metal material having thermal conductivity.

  The fins 7 are also provided on the flat portion 3a of the heat sink 2 and on the surface facing the surface on which the high-profile component 9 is mounted. Thereby, the heat emitted from the high-profile component 9 is dissipated from the fin 7 through the flat portion 3a.

  Moreover, the cover 5 is provided with the protrusion part 12 which has heat conductivity. The protruding portion 12 may be formed integrally with the cover 5, for example, or only the protruding portion 12 may be separately created and fixed to the cover 5. Further, a part of the cover 5 can be cut out to form the protruding portion 12. The protrusion 12 is provided on the cover 5 so as to contact the heat generating component 8. As a result, the cover 5 and the heat generating component 8 are thermally coupled via the protruding portion 12, so that the second heat dissipation route for radiating heat to the air above the cover 5 via the heat generating component 8, the protruding portion 12 and the cover 5. Can be secured. In addition, since the heat generated from the heat generating component 8 can secure a third heat dissipation route that dissipates heat to the fins 7 through the protrusion 12, the cover 5, and the cover holding portion 4 of the heat sink 3, the heat dissipation is excellent. The electronic device 1 can be provided.

  Next, assembly of the electronic device 1 will be described.

  The molded body of the heat sink 3 and the fin 7 formed by extrusion and die casting using a metal material or a non-metal material is placed with the flat portion 3a facing down. And the board | substrate 15 arrange | positioned at the flat part 3a provided with the high-profile components 9 and input / output terminals etc., such as a coil | winding component, and the board | substrate 2 arrange | positioned at the inclination part 3b carrying the electronic component containing the heat-emitting component 8 are attached. Pre-assemble. The substrate 15 disposed on the flat portion 3a and the member for fixing the substrate 2 are composed of, for example, a sheet metal 11 or the like. select. Thereafter, the assembly is placed in the accommodation space 10. At this time, in order to position the substrate 2, a positioning portion (not shown) may be provided on the inclined portion 3 b. Alternatively, the substrate 2 may be positioned on the inclined portion 3b by providing a heat conductive material such as a silicon sheet between the substrate 2 and the inclined portion 3b. As described above, when the substrate 2 on which the heat generating component 8 is mounted and the high-profile component 9 are arranged, the input / output connector is exposed to the outside of the housing, and the other components are accommodated in the accommodating space 10.

  Next, the cover 5 is placed so as to contact the cover holding portion 4 of the heat sink 3, and the screw 16 is screwed into the screw hole 17. At this time, the protrusion 12 contacts the heat generating component 8. Thereby, the heat-emitting component 8 and the protrusion part 12 are thermally connected. Therefore, the heat from the heat generating component 8 can secure the projecting portion 12, the cover 5, the second heat radiation route for radiating the outside of the cover 5, and the projecting portion 12, the cover 5, the cover holding portion 4, the fins. A third heat radiation route for radiating heat from 7 can be secured.

  In addition, the heat generating component 8 is preferably mounted above the substrate 2. In particular, when the height of the electronic device 1 is H, if the heat generating component 8 is mounted above H / 2, the cover 5 and the heat generating component 8 are closer to each other. The height H of the electronic device 1 is a distance between the cover 5 that is a heat dissipation portion in the vertical direction of the housing and the flat portion 3a. Since heat from various components including the high-profile component 9 is close to the flat portion 3a, it is conceivable that the heat concentrates on the first heat dissipation route that is a heat dissipation route close to the flat portion 3a. In the present embodiment, when the heat generating component 8 is mounted above H / 2, the cover 5 and the heat generating component 8 become closer to each other, so that the heat from the heat generating component 8 is efficiently transmitted from the second and third heat dissipation routes. It can dissipate heat well. Further, by disposing the heat generating component 8 at the upper side, the effective length of the fin 7 provided in the lower space of the inclined portion 3b located on the lower side of the heat generating component 8 is efficiently used to dissipate heat. Therefore, better heat dissipation characteristics can be obtained as compared with the case where the heat generating component 8 is positioned below. This contributes to downsizing of the electronic device 1.

  As described above, the electronic apparatus 1 according to the present invention includes a housing having the flat portion 3a and the inclined portion 3b. The substrate 2 on which the heat generating component 8 is mounted is placed on the inclined portion 3b, and the flat portion 3a. Is mounted with a tall component 9 having a height higher than that of the heat generating component 8, and a surface opposite to the surface on which the heat generating component 8 of the inclined portion 3b is mounted, or the flat component 3a. Fins 7 are provided on the surface facing the surface. Thereby, compared with the electronic device in which the casing is configured by a rectangular parallelepiped, the volume of the accommodation space 10 can be increased by suitably arranging the heat generating component 8 and the tall component 9 by providing the flat portion 3a and the inclined portion 3b. Since it can reduce, it contributes to size reduction of the electronic device 1. Further, by using the reduced volume portion, the fins 7 are provided on the inclined portion 3b of the surface facing the surface on which the substrate 2 is mounted, so that the first heat dissipation route can be secured and the heat dissipation is improved. can do.

  In the electronic device 1 of the present invention, at least a part of the heat generating component 8 is disposed above H / 2 when the height of the electronic device 1 is H. Accordingly, the second heat radiation route for transferring heat from the heat generating component 8 to the cover 5 through the protruding portion 12 and the heat from the heat generating component 8 to the cover holding portion of the protruding portion 12, the cover 5, and the heat sink 3. A third heat dissipation route for radiating heat to the fins 7 through 4 can be secured, and heat dissipation can be improved.

  Further, in the electronic device 1 of the present invention, the casing further includes a cover 5, and the cover 5 includes a protruding portion 12 having thermal conductivity, and the heat generating component 8 and the protruding portion 12 come into contact with each other. Thereby, the heat from the heat-generating component 8 can be radiated more reliably through the second and third radiating routes, and the heat radiation property can be improved.

  As mentioned above, although the electronic device of one embodiment of the present invention was explained, it is not limited to explanation of the above-mentioned embodiment but various modification implementation is possible.

  For example, in the present embodiment, the fins 7 used for air cooling have been described. However, the present invention is not limited thereto, and a water channel used for water cooling may be provided.

  Moreover, the electronic device according to the present invention can be applied to various electronic devices in addition to the power supply device. For example, in the case of an audio device, the heat generating component 8 can be replaced with a main amplifier or the like, and the high-profile component 9 can be replaced with an electrolytic capacitor or the like.

DESCRIPTION OF SYMBOLS 1 Electronic device 2 Board | substrate 3 Heat sink 3a Flat part 3b Inclination part 4 Cover holding | maintenance part 5 Cover 7 Fin 8 Heat generating part 9 High-profile part 10 Housing space 11 Sheet metal 12 Protruding part 15 Board | substrate 16 Screw 17 Screw hole

Claims (2)

An electronic device comprising a substrate on which electronic components are mounted,
The electronic device includes a casing having a cover provided with a projecting portion having thermal conductivity, and a heat sink provided with a flat portion, an inclined portion, and a cover holding portion,
On the inclined portion, a substrate on which at least one heat generating component among the electronic components is mounted is placed,
The flat portion is mounted with a high-profile component that is taller than the heat-generating component,
The surface of the inclined portion facing the surface on which the heat generating component is mounted and the surface of the flat portion facing the surface on which the high-profile component is mounted include the flat portion, the inclined portion, and the surface of the casing. Fins extending in the direction connecting the remaining two structural parts excluding the cover holding part are provided,
The protruding portion abuts on the heat generating component,
The cover abuts against the cover holding portion and is fixed ;
The electronic device according to claim 1, wherein the fins provided on the inclined part have a longer fin length than the fins provided on the flat part . The electronic device according to claim 1, wherein at least a part of the heat generating component is disposed above H / 2, where H is the height of the electronic device.

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