JPS6247199U - - Google Patents
Info
- Publication number
- JPS6247199U JPS6247199U JP13973385U JP13973385U JPS6247199U JP S6247199 U JPS6247199 U JP S6247199U JP 13973385 U JP13973385 U JP 13973385U JP 13973385 U JP13973385 U JP 13973385U JP S6247199 U JPS6247199 U JP S6247199U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- electronic device
- partition
- electronic components
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例である電子装置の
一部破砕斜視図、第２図は同上電子装置の側面断
面図、第３図は従来構造の電子装置の筐体内蔵物
の斜視図、第４図は同上筐体内蔵物の側面図であ
る。
１１：プリント回路基板、１２：発熱性の電子
部品、１７：筐体、１７ａ：筐体の一部（隔壁）
。
Fig. 1 is a partially exploded perspective view of an electronic device that is an embodiment of this invention, Fig. 2 is a side sectional view of the same electronic device, and Fig. 3 is a perspective view of the components built into the casing of an electronic device with a conventional structure. , FIG. 4 is a side view of the built-in components of the housing. 11: Printed circuit board, 12: Heat generating electronic component, 17: Housing, 17a: Part of housing (partition wall)
.
Claims (1)
収納した電子装置において；筐体を熱伝導率の高
い材料で形成し、その筐体に隔壁を形成し、この
隔壁に発熱性の電子部品を取付けるように構成し
たことを特徴とする電子装置の放熱構造。 In an electronic device in which a printed circuit board with electronic components mounted is housed in a housing; the housing is made of a material with high thermal conductivity, a partition is formed in the housing, and heat-generating electronic components are attached to the partition. A heat dissipation structure for an electronic device, characterized in that it is configured as follows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13973385U JPS6247199U (en) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13973385U JPS6247199U (en) | 1985-09-12 | 1985-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247199U true JPS6247199U (en) | 1987-03-23 |
Family
ID=31045912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13973385U Pending JPS6247199U (en) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247199U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017108007A (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat radiation structure for heat evolution electronic component and manufacturing method for the same |
-
1985
- 1985-09-12 JP JP13973385U patent/JPS6247199U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017108007A (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat radiation structure for heat evolution electronic component and manufacturing method for the same |
| WO2017098703A1 (en) * | 2015-12-10 | 2017-06-15 | パナソニックＩｐマネジメント株式会社 | Heat radiating device for heat generating electronic component, manufacturing method thereof, and vehicle-mounted charger |
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