JPS62104497U - - Google Patents

Info

Publication number
JPS62104497U
JPS62104497U JP19610085U JP19610085U JPS62104497U JP S62104497 U JPS62104497 U JP S62104497U JP 19610085 U JP19610085 U JP 19610085U JP 19610085 U JP19610085 U JP 19610085U JP S62104497 U JPS62104497 U JP S62104497U
Authority
JP
Japan
Prior art keywords
dissipation plate
heat dissipation
mounting portion
plate portion
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19610085U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19610085U priority Critical patent/JPS62104497U/ja
Publication of JPS62104497U publication Critical patent/JPS62104497U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す断面図、第2
図はヒートシンクの詳細を示す斜視図、第3図は
従来例を示す断面図である。 1……キヤビネツト上部、2……キヤビネツト
底部、4……プリント基板、7……電子部品、9
……ヒートシンク、9a……取付部、9b……放
熱板部、10……支柱。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a perspective view showing details of the heat sink, and FIG. 3 is a sectional view showing a conventional example. 1... Upper part of the cabinet, 2... Bottom part of the cabinet, 4... Printed circuit board, 7... Electronic components, 9
...Heat sink, 9a...Mounting section, 9b...Radiation plate section, 10...Strut.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子機器に内蔵され、電子部品から発生する熱
を放熱するヒートシンクにおいて、前記電子機器
の天蓋に熱伝導度の小さい支柱を介して固定され
る取付部と、前記取付部に対して傾斜して形成さ
れた放熱板部と、前記放熱板部に形成された開口
部とを備えたことを特徴とするヒートシンク。
A heat sink that is built into an electronic device and radiates heat generated from the electronic components includes a mounting portion that is fixed to the canopy of the electronic device via a support with low thermal conductivity, and a mounting portion that is formed at an angle with respect to the mounting portion. What is claimed is: 1. A heat sink comprising: a heat dissipation plate portion having a heat dissipation plate portion; and an opening portion formed in the heat dissipation plate portion.
JP19610085U 1985-12-20 1985-12-20 Pending JPS62104497U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19610085U JPS62104497U (en) 1985-12-20 1985-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19610085U JPS62104497U (en) 1985-12-20 1985-12-20

Publications (1)

Publication Number Publication Date
JPS62104497U true JPS62104497U (en) 1987-07-03

Family

ID=31154605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19610085U Pending JPS62104497U (en) 1985-12-20 1985-12-20

Country Status (1)

Country Link
JP (1) JPS62104497U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084661A (en) * 2011-10-06 2013-05-09 Furukawa Sky Kk Heat sink
JP2015165596A (en) * 2015-05-19 2015-09-17 株式会社バッファロー Electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084661A (en) * 2011-10-06 2013-05-09 Furukawa Sky Kk Heat sink
JP2015165596A (en) * 2015-05-19 2015-09-17 株式会社バッファロー Electronic apparatus

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