JPS6398699U - - Google Patents

Info

Publication number
JPS6398699U
JPS6398699U JP19353386U JP19353386U JPS6398699U JP S6398699 U JPS6398699 U JP S6398699U JP 19353386 U JP19353386 U JP 19353386U JP 19353386 U JP19353386 U JP 19353386U JP S6398699 U JPS6398699 U JP S6398699U
Authority
JP
Japan
Prior art keywords
heat
case
generating component
partition wall
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19353386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19353386U priority Critical patent/JPS6398699U/ja
Publication of JPS6398699U publication Critical patent/JPS6398699U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案よりなる電子機器放熱構造の実
施例を示した断面説明図、第２図はその分解斜視
図、第３図はその他の実施例を示した断面説明図
、第４図は本考案の第２実施例を示した断面説明
図、第５図はその分解斜視図、第６図は従来例の
説明図である。 １１……電子ユニツト、１２……側壁、１３…
…上壁、１４……上壁ケース、１５……コネクタ
、１６……放熱板、１７……制御基板、１８……
プリント配線板、１９……下側ケース、２０……
空気層形成空間、２１……断熱性隔壁、２２……
パワートランジスタ、２３……ＩＣ部品、２４…
…蓋板、２５……ねじ孔、２６……取付ねじ、２
７……半田付け部、２８……上壁板、２９……空
気層形成枠、３０……プリント配線基板、３１…
…ロアケース、３２……アツパケース。 Fig. 1 is an explanatory cross-sectional view showing an embodiment of the electronic equipment heat dissipation structure according to the present invention, Fig. 2 is an exploded perspective view thereof, Fig. 3 is an explanatory cross-sectional view showing another embodiment, and Fig. 4 is an explanatory cross-sectional view showing an embodiment of the electronic device heat dissipation structure according to the present invention. FIG. 5 is an exploded perspective view of the second embodiment of the present invention, and FIG. 6 is an explanatory view of a conventional example. 11...electronic unit, 12...side wall, 13...
...Top wall, 14...Top wall case, 15...Connector, 16...Radiation plate, 17...Control board, 18...
Printed wiring board, 19... lower case, 20...
Air layer forming space, 21... Insulating partition wall, 22...
Power transistor, 23...IC component, 24...
...Lid plate, 25...Screw hole, 26...Mounting screw, 2
7...Soldering portion, 28...Top wall plate, 29...Air layer forming frame, 30...Printed wiring board, 31...
...Lower case, 32...Atsupa case.

Claims (1)

【実用新案登録請求の範囲】 発熱量の多い発熱部品２２と熱に弱い電子部品
２３とを、熱伝導性の悪い材料で成形されたケー
ス（１４又は２９）内に収納してなる電子機器の
おいて、 前記ケース（１４又は２９）内に、内部に空気
層形成空間２０が形成された断熱性隔壁２１を設
けると共に、前記発熱部品２２と前記電子部品２
３とを該隔壁２１を境として配設し、さらに前記
発熱部品２２に取付けられた放熱板１６の一部が
露出されていることを特徴とする電子機器の放熱
構造。[Scope of Claim for Utility Model Registration] An electronic device in which a heat-generating component 22 that generates a large amount of heat and an electronic component 23 that is sensitive to heat are housed in a case (14 or 29) made of a material with poor thermal conductivity. In the case (14 or 29), a heat insulating partition wall 21 having an air layer forming space 20 formed therein is provided, and the heat generating component 22 and the electronic component 2
3 are arranged with the partition wall 21 as a boundary, and a part of the heat sink 16 attached to the heat generating component 22 is exposed.
JP19353386U 1986-12-16 1986-12-16 Pending JPS6398699U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19353386U JPS6398699U (en) 1986-12-16 1986-12-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19353386U JPS6398699U (en) 1986-12-16 1986-12-16

Publications (1)

Publication Number Publication Date
JPS6398699U true JPS6398699U (en) 1988-06-25

Family

ID=31149642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19353386U Pending JPS6398699U (en) 1986-12-16 1986-12-16

Country Status (1)

Country Link
JP (1) JPS6398699U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290098A (en) * 1989-02-10 1990-11-29 Fuji Electric Co Ltd Cooling device for inverter apparatus
JPH0672293U (en) * 1992-04-10 1994-10-07 アルパイン株式会社 Heat shield structure for electronic devices
JP2007021611A (en) * 2005-07-13 2007-02-01 Kawada Kogyo Kk Radiating structure for mobile robot
JP2008047798A (en) * 2006-08-21 2008-02-28 Matsushita Electric Ind Co Ltd Electronic apparatus
JP2011071344A (en) * 2009-09-25 2011-04-07 Autonetworks Technologies Ltd Circuit unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624178B2 (en) * 1977-07-13 1981-06-04
JPS5950465B2 (en) * 1975-11-07 1984-12-08 テイコクピストンリング カブシキガイシヤ Cylinder liner Oyobi Sonohoning Hohou

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950465B2 (en) * 1975-11-07 1984-12-08 テイコクピストンリング カブシキガイシヤ Cylinder liner Oyobi Sonohoning Hohou
JPS5624178B2 (en) * 1977-07-13 1981-06-04

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290098A (en) * 1989-02-10 1990-11-29 Fuji Electric Co Ltd Cooling device for inverter apparatus
JPH0672293U (en) * 1992-04-10 1994-10-07 アルパイン株式会社 Heat shield structure for electronic devices
JP2007021611A (en) * 2005-07-13 2007-02-01 Kawada Kogyo Kk Radiating structure for mobile robot
JP4546345B2 (en) * 2005-07-13 2010-09-15 川田工業株式会社 Heat dissipation structure for mobile robot
JP2008047798A (en) * 2006-08-21 2008-02-28 Matsushita Electric Ind Co Ltd Electronic apparatus
JP2011071344A (en) * 2009-09-25 2011-04-07 Autonetworks Technologies Ltd Circuit unit

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