JPS58175641U - Semiconductor component mounting equipment - Google Patents

Semiconductor component mounting equipment

Info

Publication number
JPS58175641U
JPS58175641U JP1982073148U JP7314882U JPS58175641U JP S58175641 U JPS58175641 U JP S58175641U JP 1982073148 U JP1982073148 U JP 1982073148U JP 7314882 U JP7314882 U JP 7314882U JP S58175641 U JPS58175641 U JP S58175641U
Authority
JP
Japan
Prior art keywords
elastic piece
semiconductor component
power transistor
heatsink
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982073148U
Other languages
Japanese (ja)
Other versions
JPS6228768Y2 (en
Inventor
充彦 徳田
浩一 三浦
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP1982073148U priority Critical patent/JPS58175641U/en
Publication of JPS58175641U publication Critical patent/JPS58175641U/en
Application granted granted Critical
Publication of JPS6228768Y2 publication Critical patent/JPS6228768Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例の分解斜視図、第２図は本考案の一実施
例の分解斜視図、第３図ａ、　　ｂ、　　ｃは上記実施
例に用いる取付具の上面図、正面図、下面図である。 １・・・・・・プリント基板、２・・・・・・パワート
ランジスタ、３・・・・・・放熱器、４・・・・・・放
熱フィン、５・・・・・・温度補償トランジスタ、８・
・・・・・取付具、８ａ・・・・・・規制片、８ｂ・・
・・・・弾性片、８Ｃ・・・・・・接触部、９・・・・
・・ビス。Figure 1 is an exploded perspective view of a conventional example, Figure 2 is an exploded perspective view of an embodiment of the present invention, and Figures 3a, b, and c are top, front, and bottom views of the fixture used in the above embodiment. It is a diagram. 1... Printed circuit board, 2... Power transistor, 3... Heatsink, 4... Heat radiation fin, 5... Temperature compensation transistor , 8・
...Mounting tool, 8a...Regulation piece, 8b...
...Elastic piece, 8C...Contact part, 9...
··Screw.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱器と、この放熱器の近くに配置されたプリント基板
本上記プリント基板に取付けられ、上記放熱器の表面に
沿って配置された温度補償トランジスタおよびパワート
ランジスタと、接触部と弾性片を有する熱伝導性のよい
材料からなる取付具とを備え、上記取付具を上記放熱器
に取付け、その接触部を上記温度補償トランジスタに接
触させるとともにその弾性片を上記パワートランジスタ
に押しつけ、この弾性片の弾性により上記パワートラン
ジスタを上記放熱器の表面に圧接するようにした半導体
部品の取付装置。a heatsink, a printed circuit board disposed near the heatsink; a temperature compensation transistor and a power transistor mounted on the printed circuit board and disposed along the surface of the heatsink; a heat sink having a contact portion and an elastic piece; a fitting made of a material with good conductivity, the fitting is attached to the heat sink, the contact portion thereof is brought into contact with the temperature compensation transistor, and the elastic piece is pressed against the power transistor, and the elastic piece of the elastic piece is pressed against the power transistor. A mounting device for a semiconductor component, wherein the power transistor is pressed into contact with the surface of the heat sink.
JP1982073148U 1982-05-18 1982-05-18 Semiconductor component mounting equipment Granted JPS58175641U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982073148U JPS58175641U (en) 1982-05-18 1982-05-18 Semiconductor component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982073148U JPS58175641U (en) 1982-05-18 1982-05-18 Semiconductor component mounting equipment

Publications (2)

Publication Number Publication Date
JPS58175641U true JPS58175641U (en) 1983-11-24
JPS6228768Y2 JPS6228768Y2 (en) 1987-07-23

Family

ID=30082673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982073148U Granted JPS58175641U (en) 1982-05-18 1982-05-18 Semiconductor component mounting equipment

Country Status (1)

Country Link
JP (1) JPS58175641U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730223A (en) * 1993-07-07 1995-01-31 Nippon Antenna Co Ltd Structure and fixture for mounting ic with heat sink
JP2009158632A (en) * 2007-12-26 2009-07-16 Keihin Corp Power drive unit
JP2013021083A (en) * 2011-07-08 2013-01-31 Tdk Corp Spring tool for fixing electronic component, and heat dissipation structure
JP2014016026A (en) * 2012-06-13 2014-01-30 Toyota Industries Corp Plate spring and heat dissipation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730223A (en) * 1993-07-07 1995-01-31 Nippon Antenna Co Ltd Structure and fixture for mounting ic with heat sink
JP2009158632A (en) * 2007-12-26 2009-07-16 Keihin Corp Power drive unit
JP2013021083A (en) * 2011-07-08 2013-01-31 Tdk Corp Spring tool for fixing electronic component, and heat dissipation structure
JP2014016026A (en) * 2012-06-13 2014-01-30 Toyota Industries Corp Plate spring and heat dissipation device

Also Published As

Publication number Publication date
JPS6228768Y2 (en) 1987-07-23

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