JPS58187152U - Transistor heat dissipation structure - Google Patents
Transistor heat dissipation structureInfo
- Publication number
- JPS58187152U JPS58187152U JP8488982U JP8488982U JPS58187152U JP S58187152 U JPS58187152 U JP S58187152U JP 8488982 U JP8488982 U JP 8488982U JP 8488982 U JP8488982 U JP 8488982U JP S58187152 U JPS58187152 U JP S58187152U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- transistor
- attached
- dissipation structure
- primary heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図は従来の発熱性トランジス列こ対す
る放熱構造の説明図およびコーティングの説明図、第３
図は本考案の一実施例を示す説明図である。
図中、１はプリント基板、２はコーティングを要する回
路部品、４はコーティング範囲、５はケース、６は発熱
性トランジスタ、７は１次放熱体である。Figures 1 and 2 are explanatory diagrams of a heat dissipation structure and a coating of a conventional heat generating transistor array;
The figure is an explanatory diagram showing an embodiment of the present invention. In the figure, 1 is a printed circuit board, 2 is a circuit component that requires coating, 4 is a coating area, 5 is a case, 6 is a heat generating transistor, and 7 is a primary heat sink.
Claims (1)
でコーティングする電子機器の、パワートランジスタ、
電源トランジスタ等の発熱性トランジスタに対する放熱
構造において、背の高い１次放熱体を該プリント基板に
取付け、且つ該発熱性トランジスタは該１次放熱体の側
面に取付け、そして該１次放熱体の上面をケースの蓋に
接触させて放熱する構造としてなることを特徴とするト
ランジスタの放熱構造。Power transistors are used in electronic equipment where circuit components mounted on printed circuit boards are coated with a moisture-proof resin material.
In a heat dissipation structure for a heat dissipating transistor such as a power supply transistor, a tall primary heat dissipation body is attached to the printed circuit board, the heat dissipation transistor is attached to the side surface of the primary heat dissipation body, and the top surface of the primary heat dissipation body is attached to the side surface of the primary heat dissipation body. A heat dissipation structure for a transistor, characterized in that the transistor has a structure that dissipates heat by bringing it into contact with a case lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8488982U JPS58187152U (en) | 1982-06-08 | 1982-06-08 | Transistor heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8488982U JPS58187152U (en) | 1982-06-08 | 1982-06-08 | Transistor heat dissipation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58187152U true JPS58187152U (en) | 1983-12-12 |
| JPS6246271Y2 JPS6246271Y2 (en) | 1987-12-12 |
Family
ID=30093808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8488982U Granted JPS58187152U (en) | 1982-06-08 | 1982-06-08 | Transistor heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187152U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018190332A1 (en) * | 2017-04-14 | 2018-10-18 | 富士フイルム株式会社 | Ink jet recording apparatus and cooling method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5295357U (en) * | 1976-01-14 | 1977-07-16 |
-
1982
- 1982-06-08 JP JP8488982U patent/JPS58187152U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5295357U (en) * | 1976-01-14 | 1977-07-16 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018190332A1 (en) * | 2017-04-14 | 2018-10-18 | 富士フイルム株式会社 | Ink jet recording apparatus and cooling method |
| JPWO2018190332A1 (en) * | 2017-04-14 | 2019-12-26 | 富士フイルム株式会社 | Ink jet recording apparatus and cooling method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6246271Y2 (en) | 1987-12-12 |
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