JPS59145092U - Heatsink for installing electrical circuit components - Google Patents

Heatsink for installing electrical circuit components

Info

Publication number
JPS59145092U
JPS59145092U JP3920683U JP3920683U JPS59145092U JP S59145092 U JPS59145092 U JP S59145092U JP 3920683 U JP3920683 U JP 3920683U JP 3920683 U JP3920683 U JP 3920683U JP S59145092 U JPS59145092 U JP S59145092U
Authority
JP
Japan
Prior art keywords
electrical circuit
circuit components
heatsink
installing electrical
installing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3920683U
Other languages
Japanese (ja)
Inventor
健 大森
横山 文明
Original Assignee
三菱化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱化学株式会社 filed Critical 三菱化学株式会社
Priority to JP3920683U priority Critical patent/JPS59145092U/en
Publication of JPS59145092U publication Critical patent/JPS59145092U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る放熱器の1例にフラットベース形
双方向サイリスタを半田付けしたものの説明図である。 第2図は本考案に係る放熱器の他の例を回路基板に半田
付けしたものの説明図である。 1・・・放熱器、2・・・フィン、3・・・メッキ層、
4・・・半田層、5・・・サイリスタ、6・・・トラン
ジスタ、7・・・足、8・・・回路基板、9・・・銅箔
FIG. 1 is an explanatory diagram of an example of a heat sink according to the present invention in which a flat base bidirectional thyristor is soldered. FIG. 2 is an explanatory diagram of another example of the heat sink according to the present invention soldered to a circuit board. 1... Heatsink, 2... Fin, 3... Plating layer,
4...Solder layer, 5...Thyristor, 6...Transistor, 7...Legs, 8...Circuit board, 9...Copper foil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に半田付は可能なメッキ層を有することを特徴とす
る電気回路部品取付用のアルミニウム製放熱器。
An aluminum heat sink for mounting electrical circuit components, characterized by having a plating layer on the surface that can be soldered.
JP3920683U 1983-03-18 1983-03-18 Heatsink for installing electrical circuit components Pending JPS59145092U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3920683U JPS59145092U (en) 1983-03-18 1983-03-18 Heatsink for installing electrical circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3920683U JPS59145092U (en) 1983-03-18 1983-03-18 Heatsink for installing electrical circuit components

Publications (1)

Publication Number Publication Date
JPS59145092U true JPS59145092U (en) 1984-09-28

Family

ID=30169859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3920683U Pending JPS59145092U (en) 1983-03-18 1983-03-18 Heatsink for installing electrical circuit components

Country Status (1)

Country Link
JP (1) JPS59145092U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03290985A (en) * 1990-04-06 1991-12-20 Ibiden Co Ltd Electronic part mounting substrate with fin

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS585395B2 (en) * 1973-05-15 1983-01-31 セイコーエプソン株式会社 Suishiyoudokei no Kankiyuhoushiki

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS585395B2 (en) * 1973-05-15 1983-01-31 セイコーエプソン株式会社 Suishiyoudokei no Kankiyuhoushiki

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03290985A (en) * 1990-04-06 1991-12-20 Ibiden Co Ltd Electronic part mounting substrate with fin

Similar Documents

Publication Publication Date Title
JPS59145092U (en) Heatsink for installing electrical circuit components
JPS6071195U (en) Heat dissipation device in printed circuit board
JPS58166049U (en) Heat dissipation structure of hybrid IC
JPS60109332U (en) Hybrid integrated circuit device
JPS59123387U (en) Mounting device for heat generating parts
JPS602841U (en) semiconductor mounting board
JPS6041056U (en) semiconductor heat sink
JPS59119039U (en) Heat dissipation structure for semiconductor devices
JPS59127270U (en) printed circuit board equipment
JPS58175643U (en) Heat dissipation structure for printed wiring board components
JPS58133941U (en) Mounting bracket for IC heatsink
JPS605144U (en) semiconductor equipment
JPS58116233U (en) Heat dissipation fin structure for printed wiring boards
JPS5889995U (en) Mounting structure of transistor heat generating parts
JPS6048287U (en) Cooling structure for circuit components
JPS5937742U (en) Heat dissipation structure
JPS58120647U (en) hybrid integrated circuit
JPS58147256U (en) power hybrid integrated circuit
JPS58189541U (en) Hybrid integrated circuit device
JPS6092828U (en) Electronic component mounting structure
JPS58166089U (en) printed wiring board equipment
JPS602861U (en) Metal core printed wiring board
JPS59135645U (en) Mounting structure of heat sink and power transistor
JPS59159954U (en) Heat dissipation device for printed circuit boards
JPS58189593U (en) circuit element assembly