JPS58189541U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS58189541U JPS58189541U JP8727282U JP8727282U JPS58189541U JP S58189541 U JPS58189541 U JP S58189541U JP 8727282 U JP8727282 U JP 8727282U JP 8727282 U JP8727282 U JP 8727282U JP S58189541 U JPS58189541 U JP S58189541U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- metal
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す混成集積回路装置の断
面図、第２図は本考案の他の実施例を示す混成集積回路
装置の断面図である。
１：箱体、３：ニッケルメッキ、４：絶縁板、５゜７．
１２：半田層、６：半導体素子、８：回路基板、１１：
金属板。FIG. 1 is a sectional view of a hybrid integrated circuit device showing one embodiment of the present invention, and FIG. 2 is a sectional view of a hybrid integrated circuit device showing another embodiment of the invention. 1: Box body, 3: Nickel plating, 4: Insulating plate, 5°7.
12: solder layer, 6: semiconductor element, 8: circuit board, 11:
metal plate.
Claims (4)
属製箱体内に収容し樹脂封止してなる混成集積回路装置
において、少なくとも素子の搭載される部分が半田付は
可能な金属でメッキされた前記箱体に、その形状が前記
素子より大きく両面をメタライズ形成してなる熱伝導性
良好な絶縁板を介して、該素子を半田付けあるいは硬ろ
う付により固着したことを特徴とする混成集積回路装置
。(1) In a hybrid integrated circuit device in which a semiconductor element and a circuit board are housed in a metal box that cannot be soldered and sealed with resin, at least the part where the element is mounted is plated with a metal that can be soldered. The element is fixed to the box body by soldering or hard brazing via an insulating plate having good thermal conductivity and having a shape larger than that of the element and metallized on both sides. Integrated circuit device.
て、絶縁板と素子との間には、その形状が素子より大き
くかつ絶縁板より小さな金属板が、はんだ付けあるいは
硬ろう付けにより介在していることを特徴とする混成集
積回路装置。(2) Utility model registration In the item described in claim 1, a metal plate whose shape is larger than the element and smaller than the insulating plate is interposed between the insulating plate and the element by soldering or hard brazing. A hybrid integrated circuit device characterized by:
、絶縁板が極薄のセラミック板であることを特徴とする
混成集積回路装置。(3) Utility Model Registration The hybrid integrated circuit device according to Claim 1, characterized in that the insulating plate is an extremely thin ceramic plate.
いて半田付は不可能な金属がアルミニウムで ′あり、
半田付は可能な金属がニッケルであることを特徴とする
混成集積回路装置。(4) ``The metal that cannot be soldered in the item described in paragraph 1 of the claims for utility model registration is aluminum;
A hybrid integrated circuit device characterized in that the metal that can be soldered is nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8727282U JPS58189541U (en) | 1982-06-11 | 1982-06-11 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8727282U JPS58189541U (en) | 1982-06-11 | 1982-06-11 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58189541U true JPS58189541U (en) | 1983-12-16 |
Family
ID=30095998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8727282U Pending JPS58189541U (en) | 1982-06-11 | 1982-06-11 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189541U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524751B2 (en) * | 1972-07-12 | 1977-02-07 | ||
| JPS5568661A (en) * | 1978-11-17 | 1980-05-23 | Hitachi Ltd | Structure for mounting power transistor |
-
1982
- 1982-06-11 JP JP8727282U patent/JPS58189541U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524751B2 (en) * | 1972-07-12 | 1977-02-07 | ||
| JPS5568661A (en) * | 1978-11-17 | 1980-05-23 | Hitachi Ltd | Structure for mounting power transistor |
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