JPS6092828U - Electronic component mounting structure - Google Patents

Electronic component mounting structure

Info

Publication number
JPS6092828U
JPS6092828U JP18645183U JP18645183U JPS6092828U JP S6092828 U JPS6092828 U JP S6092828U JP 18645183 U JP18645183 U JP 18645183U JP 18645183 U JP18645183 U JP 18645183U JP S6092828 U JPS6092828 U JP S6092828U
Authority
JP
Japan
Prior art keywords
mounting structure
double
glass epoxy
circuit board
clad glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18645183U
Other languages
Japanese (ja)
Inventor
達彦 入江
茂成 高見
二郎 橋爪
敏行 山口
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP18645183U priority Critical patent/JPS6092828U/en
Publication of JPS6092828U publication Critical patent/JPS6092828U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図はこの考案の一実施例を示す図で、第
１図は斜視図、第２図は断面図である。FIGS. 1 and 2 are views showing an embodiment of this invention, with FIG. 1 being a perspective view and FIG. 2 being a sectional view.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パワートランジスタ、集積回路等の、特に大電力用の半
導体素子を実装する電子部品の実装構造において、両面
銅張ガラスエポキシ回路基板１の１部に該基板とほぼ等
厚の金属板３を埋め込み、該金属板３上に半導体素子４
をグイボンドし、両面銅張ガラスエポキン回路基板１上
に形成された銅箔からなる回路部５にワイヤボンドをし
、回路部５と該両面銅張ガラスエポキシ回路基板１の表
面の電極部８をスルホール９で接続して成る電子部品の
実装構造。In a mounting structure for electronic components such as power transistors and integrated circuits, in which semiconductor elements for high power use are mounted, a metal plate 3 having approximately the same thickness as that of the board is embedded in a part of a double-sided copper-clad glass epoxy circuit board 1, A semiconductor element 4 is placed on the metal plate 3.
wire bond to the circuit part 5 made of copper foil formed on the double-sided copper-clad glass epoxy circuit board 1, and connect the circuit part 5 and the electrode part 8 on the surface of the double-sided copper-clad glass epoxy circuit board 1 through holes. Mounting structure of electronic components connected by 9.
JP18645183U 1983-11-30 1983-11-30 Electronic component mounting structure Pending JPS6092828U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18645183U JPS6092828U (en) 1983-11-30 1983-11-30 Electronic component mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18645183U JPS6092828U (en) 1983-11-30 1983-11-30 Electronic component mounting structure

Publications (1)

Publication Number Publication Date
JPS6092828U true JPS6092828U (en) 1985-06-25

Family

ID=30402723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18645183U Pending JPS6092828U (en) 1983-11-30 1983-11-30 Electronic component mounting structure

Country Status (1)

Country Link
JP (1) JPS6092828U (en)

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