JPS58173238U - Connection structure of electronic components - Google Patents

Connection structure of electronic components

Info

Publication number
JPS58173238U
JPS58173238U JP7037582U JP7037582U JPS58173238U JP S58173238 U JPS58173238 U JP S58173238U JP 7037582 U JP7037582 U JP 7037582U JP 7037582 U JP7037582 U JP 7037582U JP S58173238 U JPS58173238 U JP S58173238U
Authority
JP
Japan
Prior art keywords
connection structure
electronic components
electronic component
board
conductor wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7037582U
Other languages
Japanese (ja)
Inventor
今野　義継
佳生 竹田
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP7037582U priority Critical patent/JPS58173238U/en
Publication of JPS58173238U publication Critical patent/JPS58173238U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の電子部品及び配線基板の断面図、第２図
は本考案にかかる電子部品及び配線基板の断面図、第３
図は本考案による電子部品と配線基板のボンディング態
様図である。 ８・・・・・・半導体チップ、９・・・・・・電極、１
０・・・・・・蒸着膜、１１・・・・・・銅メッキ、１
２・・・・・・基板、１３・・・・・・銅箔、１４・・
・・・・半田メッキ。Figure 1 is a sectional view of a conventional electronic component and wiring board, Figure 2 is a sectional view of an electronic component and wiring board according to the present invention, and Figure 3 is a sectional view of a conventional electronic component and wiring board.
The figure is a diagram of a bonding mode between an electronic component and a wiring board according to the present invention. 8... Semiconductor chip, 9... Electrode, 1
0... Vapor deposited film, 11... Copper plating, 1
2...Substrate, 13...Copper foil, 14...
...Solder plating.

Claims (1)

【実用新案登録請求の範囲】 電子部品の電極と基板の導体配線を結合してなる部品に
おいて、 電子部品の電極部に金属突起部を設けて、基板の導体配
線の表面に半田メッキを施した構造を有する電子部品の
接続部構造。[Scope of Utility Model Registration Claim] In a component formed by combining the electrode of an electronic component and the conductor wiring of a board, a metal protrusion is provided on the electrode part of the electronic component, and the surface of the conductor wiring of the board is plated with solder. Connection structure of electronic components with structure.
JP7037582U 1982-05-13 1982-05-13 Connection structure of electronic components Pending JPS58173238U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7037582U JPS58173238U (en) 1982-05-13 1982-05-13 Connection structure of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7037582U JPS58173238U (en) 1982-05-13 1982-05-13 Connection structure of electronic components

Publications (1)

Publication Number Publication Date
JPS58173238U true JPS58173238U (en) 1983-11-19

Family

ID=30080049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7037582U Pending JPS58173238U (en) 1982-05-13 1982-05-13 Connection structure of electronic components

Country Status (1)

Country Link
JP (1) JPS58173238U (en)

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