JPS5999474U - Mounting structure of printed wiring board - Google Patents
Mounting structure of printed wiring boardInfo
- Publication number
- JPS5999474U JPS5999474U JP19506382U JP19506382U JPS5999474U JP S5999474 U JPS5999474 U JP S5999474U JP 19506382 U JP19506382 U JP 19506382U JP 19506382 U JP19506382 U JP 19506382U JP S5999474 U JPS5999474 U JP S5999474U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- mounting structure
- conductor layer
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の印刷配線板の実装構造の側断面図、第２
図は、はんだぬれ不良発生個所の印刷配 、 −−μ
板の側断面図、第３−図は本考案の−★施例の印 −４
・・・導体層、５・・・電極、６・・・はんだ、８・・
・間隙、９・・・導電粉−樹脂系導体層。Figure 1 is a side sectional view of the mounting structure of a conventional printed wiring board;
The figure shows the printed layout of the location where solder wetting defects occur, −−μ
The side sectional view of the plate, Figure 3 is the mark of the -★ example of the present invention -4
...Conductor layer, 5...Electrode, 6...Solder, 8...
- Gap, 9... Conductive powder-resin conductor layer.
Claims (1)
装する構造において、前記印刷配線板上に設けた導体層
上に！！粉粉桝樹脂系導体層珍成し、該導電粉−樹脂系
導体層上に前記チップ町の電極を接着するように装着し
、前記導体層と前記チップ部品電極の間隙をなくしたこ
とを特徴Ｖ′する印刷配線板の実装構造。In a structure in which chip components are temporarily fixed and mounted on a printed wiring board with an adhesive, on a conductor layer provided on the printed wiring board! ! It is characterized by forming a powder-based resin-based conductor layer, and attaching the chip electrode on the conductive powder-resin-based conductor layer to eliminate the gap between the conductor layer and the chip component electrode. Mounting structure of printed wiring board with V'.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19506382U JPS5999474U (en) | 1982-12-24 | 1982-12-24 | Mounting structure of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19506382U JPS5999474U (en) | 1982-12-24 | 1982-12-24 | Mounting structure of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5999474U true JPS5999474U (en) | 1984-07-05 |
Family
ID=30419073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19506382U Pending JPS5999474U (en) | 1982-12-24 | 1982-12-24 | Mounting structure of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999474U (en) |
-
1982
- 1982-12-24 JP JP19506382U patent/JPS5999474U/en active Pending
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