JPS5999496U - printed circuit device - Google Patents
printed circuit deviceInfo
- Publication number
- JPS5999496U JPS5999496U JP19913982U JP19913982U JPS5999496U JP S5999496 U JPS5999496 U JP S5999496U JP 19913982 U JP19913982 U JP 19913982U JP 19913982 U JP19913982 U JP 19913982U JP S5999496 U JPS5999496 U JP S5999496U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit device
- metal plate
- circuit board
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案に係るプリント回路装置に用いられる
半導体装置の構造を略示した説明図、第２図は第１図に
示した半導体装置をプリント基板に挿入した状態におけ
るプリント回路基板を裏面側よりみた斜視図及び半田付
後の断面図、第３図〜第５図はこの考案に用いられる半
導体装置の変 。
形例である。
１・・・金属板、２・・・半導体素子、３・・・リード
端子、４・・・樹脂モールド部、５・・・プリント基板
、５５・・・放熱用銅箔。FIG. 1 is an explanatory diagram schematically showing the structure of a semiconductor device used in a printed circuit device according to this invention, and FIG. 2 is a back view of the printed circuit board with the semiconductor device shown in FIG. 1 inserted into the printed circuit board. A perspective view seen from the side, a sectional view after soldering, and FIGS. 3 to 5 show variations of the semiconductor device used in this invention. This is an example. DESCRIPTION OF SYMBOLS 1... Metal plate, 2... Semiconductor element, 3... Lead terminal, 4... Resin mold part, 5... Printed circuit board, 55... Copper foil for heat dissipation.
Claims (1)
リード端子と同一方向に導出しこの金属板をプリント基
板に形成される放熱体に熱的に接続したことを特徴とす
るプリント回路装置。 ２ 放熱体がプリント基板に形成される銅箔である実用
新案登録請求の範囲第１項記載のプリン° ト回
路装置。 ３ 金属板と放勢体との熱的接続は半田付によりなされ
ている実用新案登録請求の範囲第１項記載のプリント回
路装置。[Claims for Utility Model Registration] 1. Leading out a metal plate to which a semiconductor element is fixed in the same direction as the lead terminal from the end of the sealing part, and thermally connecting this metal plate to a heat sink formed on a printed circuit board. A printed circuit device characterized by: 2. The printed circuit device according to claim 1, wherein the heat sink is a copper foil formed on a printed circuit board. 3. The printed circuit device according to claim 1, wherein the thermal connection between the metal plate and the radiating body is achieved by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19913982U JPS5999496U (en) | 1982-12-23 | 1982-12-23 | printed circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19913982U JPS5999496U (en) | 1982-12-23 | 1982-12-23 | printed circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5999496U true JPS5999496U (en) | 1984-07-05 |
Family
ID=30424690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19913982U Pending JPS5999496U (en) | 1982-12-23 | 1982-12-23 | printed circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999496U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5537293B2 (en) * | 1976-02-18 | 1980-09-26 |
-
1982
- 1982-12-23 JP JP19913982U patent/JPS5999496U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5537293B2 (en) * | 1976-02-18 | 1980-09-26 |
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