JPS5873548U - Temperature fuse mounting device - Google Patents
Temperature fuse mounting deviceInfo
- Publication number
- JPS5873548U JPS5873548U JP16918581U JP16918581U JPS5873548U JP S5873548 U JPS5873548 U JP S5873548U JP 16918581 U JP16918581 U JP 16918581U JP 16918581 U JP16918581 U JP 16918581U JP S5873548 U JPS5873548 U JP S5873548U
- Authority
- JP
- Japan
- Prior art keywords
- temperature fuse
- mounting device
- fuse mounting
- semiconductor
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermally Actuated Switches (AREA)
- Protection Of Static Devices (AREA)
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来装置を示し、第１図はプリント
基板の側面図、第２図は半導体と温度ヒユーズの離間状
態を示す上から見た説明図である。
第３図及び第４図は本考案による装置の異なる実施例で
あり、いずれも半導体及び温度ヒユーズを取付けたプリ
ント基板の斜視図である。
−１・・・半導体、２・・・放熱板、３・・・放熱フィ
ン体取付用透孔、４・・・温度ヒユーズ、５．５・・・
リード線、６・・・端子ピン、７・・・プリント基板。1 and 2 show a conventional device, with FIG. 1 being a side view of a printed circuit board, and FIG. 2 being an explanatory diagram viewed from above showing a separation state between a semiconductor and a thermal fuse. FIGS. 3 and 4 show different embodiments of the device according to the present invention, and each is a perspective view of a printed circuit board with a semiconductor and a thermal fuse attached thereto. -1... Semiconductor, 2... Heat dissipation plate, 3... Through hole for attaching heat dissipation fin body, 4... Temperature fuse, 5.5...
Lead wire, 6... terminal pin, 7... printed circuit board.
Claims (1)
、温度ヒユーズを挿入位置すると共に該ヒユーズのリー
ド線を、前記半導体の端子ピンを取付けるプリント基板
に、取付けてなる温度ヒユーズの取付装置。A temperature fuse mounting device comprising: inserting a temperature fuse into a through hole for mounting a heat radiation fin body provided in a heat radiation plate of a semiconductor; and attaching a lead wire of the fuse to a printed circuit board on which a terminal pin of the semiconductor is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16918581U JPS5873548U (en) | 1981-11-12 | 1981-11-12 | Temperature fuse mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16918581U JPS5873548U (en) | 1981-11-12 | 1981-11-12 | Temperature fuse mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5873548U true JPS5873548U (en) | 1983-05-18 |
Family
ID=29961183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16918581U Pending JPS5873548U (en) | 1981-11-12 | 1981-11-12 | Temperature fuse mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5873548U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6270326U (en) * | 1985-10-23 | 1987-05-02 |
-
1981
- 1981-11-12 JP JP16918581U patent/JPS5873548U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6270326U (en) * | 1985-10-23 | 1987-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5873548U (en) | Temperature fuse mounting device | |
| JPS5993170U (en) | Mounting structure of flat package IC | |
| JPS5972739U (en) | heat dissipation fin | |
| JPS619851U (en) | Power transistor fixing device | |
| JPS58166049U (en) | Heat dissipation structure of hybrid IC | |
| JPS58158448U (en) | semiconductor heat dissipation device | |
| JPS6064272U (en) | semiconductor test jig | |
| JPS58166048U (en) | IC package | |
| JPS59127270U (en) | printed circuit board equipment | |
| JPS58193441U (en) | Temperature fuse mounting structure | |
| JPS5944051U (en) | semiconductor equipment | |
| JPS59189248U (en) | Heatsink for electrical elements | |
| JPS5999496U (en) | printed circuit device | |
| JPS5939991U (en) | Mounting device for heat sink to board | |
| JPS58170847U (en) | Structure of hybrid integrated circuit with heat dissipation fins | |
| JPS59195746U (en) | Semiconductor device circuit assembly | |
| JPS5952641U (en) | Heat dissipation device for semiconductor package | |
| JPS5958947U (en) | Semiconductor element mounting equipment | |
| JPS5839537U (en) | thermistor temperature sensor | |
| JPS5819479U (en) | socket | |
| JPS58434U (en) | semiconductor equipment | |
| JPS58114047U (en) | Semiconductor device mounting structure | |
| JPS6013751U (en) | Heat dissipation structure of heating element | |
| JPS59121891U (en) | heat dissipation device | |
| JPS5964249U (en) | thermal head |