JPS58158448U

JPS58158448U - semiconductor heat dissipation device

Info

Publication number: JPS58158448U
Application number: JP15509581U
Authority: JP
Inventors: 原田　昭男; 金子　義正
Original assignee: 日本電信電話株式会社
Priority date: 1981-10-19
Filing date: 1981-10-19
Publication date: 1983-10-22

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来の半導体放熱装置、ａ図は斜視図、ｂはａ
の直線Ａ−Ａ’における断面図、第２図は本考案の半導
体放熱装置の一部破断斜視図、第３図は第２図の直線Ｂ
−Ｂ’における断面図、第４図は接続金属端子の正面図
、を示す。１：Ｉｃ、２：半導体素子、３：■Ｃリード端子、４：
ＩＣケース、５．６＝放熱フィン体、６−１：放熱フィ
ン体基板、６〜２＝放熱フイン、６−３：平面部、６−
４：絶縁ブロック体の装着孔、７：接続用金属端子、７
−１：あご部、８：絶縁ブロック体、８−１：端子挿入
孔、８−２：係止段部、９：印刷配線板、１０ニスルー
ホール。Figure 1 is a conventional semiconductor heat dissipation device, figure a is a perspective view, figure b is a
FIG. 2 is a partially cutaway perspective view of the semiconductor heat dissipation device of the present invention, and FIG. 3 is a cross-sectional view taken along straight line A-A' in FIG.
-B' is a sectional view, and FIG. 4 is a front view of the connecting metal terminal. 1: Ic, 2: Semiconductor element, 3: ■C lead terminal, 4:
IC case, 5.6=radiation fin body, 6-1: radiation fin body board, 6-2=radiation fin, 6-3: flat part, 6-
4: Mounting hole of insulating block body, 7: Metal terminal for connection, 7
-1: Jaw portion, 8: Insulating block body, 8-1: Terminal insertion hole, 8-2: Locking step portion, 9: Printed wiring board, 10 Varnish through hole.

Claims

[Scope of utility model registration request]

The heat dissipation fin body has a flat part in the center of the board, heat dissipation fins on the left and right sides of the flat part, and mounting holes for two insulating blocks in the flat part, and an inside into which the ICIJ-wire terminal is inserted. An insulating block body is provided with a terminal insertion hole provided with a locking step, the insulating block body is installed and fixed in the mounting hole, and a connecting metal terminal having a jaw portion is inserted into the terminal insertion hole. The heat dissipating fin body is constructed by locking the jaws to the locking steps, and the connecting metal terminals of the heat dissipating fin body are inserted into the through holes of the printed wiring board to connect the heat dissipating fin body to the printed wiring board. and insert the ICIJ- into the terminal insertion hole.
A semiconductor heat dissipation device in which an ICIJ-F wire terminal is inserted and the ICIJ-F wire terminal and a connecting metal terminal are mechanically and electrically connected.