JPS5998691U - Thick film hybrid integrated circuit - Google Patents
Thick film hybrid integrated circuitInfo
- Publication number
- JPS5998691U JPS5998691U JP19297082U JP19297082U JPS5998691U JP S5998691 U JPS5998691 U JP S5998691U JP 19297082 U JP19297082 U JP 19297082U JP 19297082 U JP19297082 U JP 19297082U JP S5998691 U JPS5998691 U JP S5998691U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- integrated circuit
- hybrid integrated
- film hybrid
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の厚膜混成集積回路の説明図、第２図〜第
４図は本考案装置の一実施例で、第２図 ゛は平面
図、第３図及び第４図は断面図である。
１：アルミナ基板、２：搭載部品、３：外装容器の１部
をなす銅板、４：はんだ、５：裏面導体、６：非晶質ガ
ラス。Fig. 1 is an explanatory diagram of a conventional thick film hybrid integrated circuit, Figs. 2 to 4 show an embodiment of the device of the present invention, Fig. 2 is a plan view, and Figs. 3 and 4 are cross-sectional views. It is. 1: Alumina substrate, 2: Mounting components, 3: Copper plate forming part of the outer container, 4: Solder, 5: Back conductor, 6: Amorphous glass.
Claims (1)
いて、上記絶縁基板裏面の全面または大部分に導体膜を
形成し、該裏面の導体膜の上にメツシュ状もしくはくし
状のガラスまたはレジンまたはその組合せによる絶縁層
を形成して、該裏面の導体膜と外装用金属板とをクリー
ム状はんだ付で接続した構成の厚膜混成集積回路。In a thick film hybrid integrated circuit in which a thick film circuit is formed on an insulating substrate, a conductive film is formed on the entire or most part of the back surface of the insulating substrate, and a mesh-like or comb-like glass or resin is formed on the conductive film on the back surface. Or a thick film hybrid integrated circuit having a structure in which an insulating layer is formed by a combination thereof, and the conductor film on the back side and an exterior metal plate are connected by cream soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19297082U JPS5998691U (en) | 1982-12-22 | 1982-12-22 | Thick film hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19297082U JPS5998691U (en) | 1982-12-22 | 1982-12-22 | Thick film hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5998691U true JPS5998691U (en) | 1984-07-04 |
Family
ID=30415146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19297082U Pending JPS5998691U (en) | 1982-12-22 | 1982-12-22 | Thick film hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5998691U (en) |
-
1982
- 1982-12-22 JP JP19297082U patent/JPS5998691U/en active Pending
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