JPS6057155U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS6057155U JPS6057155U JP14735783U JP14735783U JPS6057155U JP S6057155 U JPS6057155 U JP S6057155U JP 14735783 U JP14735783 U JP 14735783U JP 14735783 U JP14735783 U JP 14735783U JP S6057155 U JPS6057155 U JP S6057155U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- aluminum substrate
- connection body
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のアルミニウム基板混成集積回路の一例の
部分断面図、第２図は本考案の一実施例の部分断面図、
第３図はその接続体の断面図である。
１・・・アルミニウム基板、２・・・絶縁層、３・・・
配線導体、６・・・アルミニウム体、７・・・銅めっき
層、８・・・はんだ層。FIG. 1 is a partial sectional view of an example of a conventional aluminum substrate hybrid integrated circuit, and FIG. 2 is a partial sectional view of an embodiment of the present invention.
FIG. 3 is a sectional view of the connecting body. 1... Aluminum substrate, 2... Insulating layer, 3...
Wiring conductor, 6... Aluminum body, 7... Copper plating layer, 8... Solder layer.
Claims (1)
よび回路部品を備え、配線導体とアルミニウム基板とが
電気的に接続されるものにおいて、アルミニウム基板を
密着して貫通し、絶縁層側に突出する表面がはんだ可能
の金属層で被覆されたアルミニウム接続体を備え、接続
体の金属層と配線導体とが共通のはんだ層により覆われ
たことを特徴とする混成集積回路。A surface that closely penetrates the aluminum substrate and protrudes toward the insulating layer in a device that has wiring conductors and circuit components on an aluminum substrate with an insulating layer on the surface, and the wiring conductor and the aluminum substrate are electrically connected. A hybrid integrated circuit comprising an aluminum connection body covered with a solderable metal layer, the metal layer of the connection body and the wiring conductor being covered with a common solder layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14735783U JPS6057155U (en) | 1983-09-22 | 1983-09-22 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14735783U JPS6057155U (en) | 1983-09-22 | 1983-09-22 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6057155U true JPS6057155U (en) | 1985-04-20 |
Family
ID=30327716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14735783U Pending JPS6057155U (en) | 1983-09-22 | 1983-09-22 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057155U (en) |
-
1983
- 1983-09-22 JP JP14735783U patent/JPS6057155U/en active Pending
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