JPS6073278U - printed wiring board equipment - Google Patents

printed wiring board equipment

Info

Publication number
JPS6073278U
JPS6073278U JP16588683U JP16588683U JPS6073278U JP S6073278 U JPS6073278 U JP S6073278U JP 16588683 U JP16588683 U JP 16588683U JP 16588683 U JP16588683 U JP 16588683U JP S6073278 U JPS6073278 U JP S6073278U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
board equipment
elements
board device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16588683U
Other languages
Japanese (ja)
Inventor
明 土居
浜野　茂男
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP16588683U priority Critical patent/JPS6073278U/en
Publication of JPS6073278U publication Critical patent/JPS6073278U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案によるプリント配線基板装置の側面図
、第２図は半田付は工程の説明図である。 １０・・・絶縁基板、１１・・・チップ部品、１２・・
・リード線を有する素子、１２ａ・・・リード線。FIG. 1 is a side view of a printed wiring board device according to this invention, and FIG. 2 is an explanatory diagram of the soldering process. 10... Insulating substrate, 11... Chip parts, 12...
- Element having a lead wire, 12a... lead wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ素子、リード線付素子がクリーム半田により実装
固定されているプリント配線基板装置。A printed wiring board device in which chip elements and elements with lead wires are mounted and fixed with cream solder.
JP16588683U 1983-10-26 1983-10-26 printed wiring board equipment Pending JPS6073278U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16588683U JPS6073278U (en) 1983-10-26 1983-10-26 printed wiring board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16588683U JPS6073278U (en) 1983-10-26 1983-10-26 printed wiring board equipment

Publications (1)

Publication Number Publication Date
JPS6073278U true JPS6073278U (en) 1985-05-23

Family

ID=30363308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16588683U Pending JPS6073278U (en) 1983-10-26 1983-10-26 printed wiring board equipment

Country Status (1)

Country Link
JP (1) JPS6073278U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415174A (en) * 1977-07-06 1979-02-03 Hitachi Ltd Method of soldering hybrid integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415174A (en) * 1977-07-06 1979-02-03 Hitachi Ltd Method of soldering hybrid integrated circuit

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