JPS5874348U - Insulating board for semiconductors - Google Patents
Insulating board for semiconductorsInfo
- Publication number
- JPS5874348U JPS5874348U JP16988481U JP16988481U JPS5874348U JP S5874348 U JPS5874348 U JP S5874348U JP 16988481 U JP16988481 U JP 16988481U JP 16988481 U JP16988481 U JP 16988481U JP S5874348 U JPS5874348 U JP S5874348U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductors
- insulating board
- thermally conductive
- adhesive layer
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims 2
- 239000002184 metal Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図及び第３図は従来例の概略断面説明図、
第４図第５図Ａ、 Ｂ、 Ｃ及び第６図Ａ。
Ｂは本考案実施例の概略断面及び平面説明図を表わす。
符号、１−−−−−−Ｔｏ−２２０タイプトランジスタ
ー、２・・・・・・ネジ、３・・・・・・絶縁シート、
４・・・・・・取付板、５・・・・・・絶縁ワッシャー
、６・・・・・・ナツト、７・・・・・・端子電極、８
・・・・・・熱伝導性接着剤層、９・・・・・・熱伝導
性塗料層、１０・・・・・・放熱フィン、１１・・・・
・・絶縁物、１２・・・・・・トランジスターチップ、
１３・・・・・・トランジスターの蓋、１４・・・・・
・取付用穴、２１・・・・・・金属板、２２・・・・・
・取付用貫通孔、２３・・・・・・半田層、２４・・・
・・・トランジスター金属面、３０・・・・・・絶縁板
。
（Ａ）1, 2, and 3 are schematic cross-sectional explanatory diagrams of conventional examples;
Figure 4, Figure 5 A, B, C and Figure 6 A. B represents a schematic cross-sectional and plan view of an embodiment of the present invention. Code, 1---To-220 type transistor, 2... Screw, 3... Insulating sheet,
4... Mounting plate, 5... Insulating washer, 6... Nut, 7... Terminal electrode, 8
...Thermally conductive adhesive layer, 9...Thermally conductive paint layer, 10...Radiating fin, 11...
...Insulator, 12...Transistor chip,
13...Transistor lid, 14...
・Mounting hole, 21...Metal plate, 22...
- Mounting through hole, 23...Solder layer, 24...
...Transistor metal surface, 30...Insulating plate. (A)
Claims (1)
を順次積層したことを特徴とする半導体用絶縁板。An insulating board for semiconductors, characterized in that a thermally conductive adhesive layer and a solderable metal foil are sequentially laminated on a gold-Bi surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16988481U JPS5874348U (en) | 1981-11-14 | 1981-11-14 | Insulating board for semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16988481U JPS5874348U (en) | 1981-11-14 | 1981-11-14 | Insulating board for semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5874348U true JPS5874348U (en) | 1983-05-19 |
Family
ID=29961850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16988481U Pending JPS5874348U (en) | 1981-11-14 | 1981-11-14 | Insulating board for semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874348U (en) |
-
1981
- 1981-11-14 JP JP16988481U patent/JPS5874348U/en active Pending
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