JPS6127330U - Chip type electrolytic capacitor - Google Patents
Chip type electrolytic capacitorInfo
- Publication number
- JPS6127330U JPS6127330U JP11231484U JP11231484U JPS6127330U JP S6127330 U JPS6127330 U JP S6127330U JP 11231484 U JP11231484 U JP 11231484U JP 11231484 U JP11231484 U JP 11231484U JP S6127330 U JPS6127330 U JP S6127330U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- chip type
- type electrolytic
- capacitor element
- anode lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、本考案の一実施例の断面図、第２図は、本考
案による絶縁体の斜視図、第３図は、陽極り一ド板を具
備したコンデンサ素子の斜視図、第一図ａは、従来の樹
脂モールド外装形のチップ形コンデンサ例の斜視図、第
４図ｂは、第４因ａの断面図、第５図は、従来の非外装
形チップ形電解コンデンサ例の斜視図。
符号の説明、１・・・絶縁体、２・・・コンデンサ素子
、２．′・・・陽極リード板、３・・・接着剤、４・・
・導電性接着剤、５・・・コンデンサ素子、６・・・リ
ード端子、７・・・外装樹脂、８・・・溶接部。FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a perspective view of an insulator according to the present invention, and FIG. 3 is a perspective view of a capacitor element equipped with an anode plate. Figure a is a perspective view of an example of a conventional resin molded exterior chip type capacitor, Figure 4 b is a sectional view of the fourth factor a, and Figure 5 is a perspective view of a conventional non-exposed chip type electrolytic capacitor. figure. Explanation of symbols: 1... Insulator, 2... Capacitor element, 2. '... Anode lead plate, 3... Adhesive, 4...
- Conductive adhesive, 5... Capacitor element, 6... Lead terminal, 7... Exterior resin, 8... Welding part.
Claims (1)
板実装面を露出させ、さらに陽極リード板およびコンデ
ンサ素子の一部を凹形の絶縁板で覆ったことを特徴とす
るチップ形電解コンデンサ。A chip electrolytic capacitor characterized in that a substrate mounting surface of a chip electrolytic capacitor element equipped with an anode lead plate is exposed, and a part of the anode lead plate and the capacitor element is further covered with a concave insulating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11231484U JPS6127330U (en) | 1984-07-24 | 1984-07-24 | Chip type electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11231484U JPS6127330U (en) | 1984-07-24 | 1984-07-24 | Chip type electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127330U true JPS6127330U (en) | 1986-02-18 |
Family
ID=30671376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11231484U Pending JPS6127330U (en) | 1984-07-24 | 1984-07-24 | Chip type electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127330U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03121977U (en) * | 1990-03-28 | 1991-12-12 |
-
1984
- 1984-07-24 JP JP11231484U patent/JPS6127330U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03121977U (en) * | 1990-03-28 | 1991-12-12 |
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