JPS6127302U - Tantalum thin film resistance wiring board - Google Patents
Tantalum thin film resistance wiring boardInfo
- Publication number
- JPS6127302U JPS6127302U JP11056984U JP11056984U JPS6127302U JP S6127302 U JPS6127302 U JP S6127302U JP 11056984 U JP11056984 U JP 11056984U JP 11056984 U JP11056984 U JP 11056984U JP S6127302 U JPS6127302 U JP S6127302U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- thin film
- tantalum thin
- film resistance
- resistance wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第８図は本考案の抵抗配線基板の製造工程の
一例を順（こ示す断面図、第９図は本考案の抵抗配線基
板の一例を示す平面図、第１０図及び第１１図は夫々本
考案の抵抗配線基板の他の実施例を示す平面図、第１２
図乃至第１４図は夫々本考案の抵抗配線基板を素子アレ
イ化した場合の構造例を夫々示す回路図、第１５図及び
第１６図は本考案の抵抗配線基板をリードフレームのラ
ンド部に固着した基板にＩＣ等の半導体ペレットと共に
搭裁した場合を示す平面図及び断面図、第１７図は本考
案の抵抗配線基板をＩＣ等の半導体ベレットとともにリ
ードフレームに直接搭裁した場合を示す断面図である。
１・・・シリコン基板（シリコンウエーハ）、２・・・
絶縁被膜、５・・・アルミ電極層、６・・・タンタル薄
膜による抵抗層。1 to 8 are a cross-sectional view showing an example of the manufacturing process of the resistance wiring board of the present invention, FIG. 9 is a plan view showing an example of the resistance wiring board of the invention, and FIGS. The figures are a plan view and a twelfth diagram showing other embodiments of the resistance wiring board of the present invention, respectively.
Figures 14 to 14 are circuit diagrams respectively showing structural examples when the resistor wiring board of the present invention is formed into an element array, and Figures 15 and 16 show the resistor wiring board of the present invention fixed to the land portion of the lead frame. FIG. 17 is a sectional view showing the case where the resistance wiring board of the present invention is directly mounted on a lead frame together with a semiconductor pellet such as IC or the like on a printed circuit board. It is. 1... Silicon substrate (silicon wafer), 2...
Insulating coating, 5... Aluminum electrode layer, 6... Resistance layer made of tantalum thin film.
Claims (1)
による抵抗層及びこの抵抗層の一部と重なるアルミ電極
層を形成したことを特徴とするタンタル薄膜抵抗配線基
板。A tantalum thin film resistance wiring board characterized in that a tantalum thin film resistance layer and an aluminum electrode layer partially overlapping the resistance layer are formed on an insulating film formed on a silicon substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11056984U JPS6127302U (en) | 1984-07-20 | 1984-07-20 | Tantalum thin film resistance wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11056984U JPS6127302U (en) | 1984-07-20 | 1984-07-20 | Tantalum thin film resistance wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127302U true JPS6127302U (en) | 1986-02-18 |
Family
ID=30669693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11056984U Pending JPS6127302U (en) | 1984-07-20 | 1984-07-20 | Tantalum thin film resistance wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127302U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56149217A (en) * | 1980-04-23 | 1981-11-19 | Kubota Ltd | Agricultural wheeled tractor |
-
1984
- 1984-07-20 JP JP11056984U patent/JPS6127302U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56149217A (en) * | 1980-04-23 | 1981-11-19 | Kubota Ltd | Agricultural wheeled tractor |
| JPS6318524B2 (en) * | 1980-04-23 | 1988-04-19 | Kubota Ltd |
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