JPS60169850U - optical module - Google Patents

optical module

Info

Publication number
JPS60169850U
JPS60169850U JP1984056693U JP5669384U JPS60169850U JP S60169850 U JPS60169850 U JP S60169850U JP 1984056693 U JP1984056693 U JP 1984056693U JP 5669384 U JP5669384 U JP 5669384U JP S60169850 U JPS60169850 U JP S60169850U
Authority
JP
Japan
Prior art keywords
main surface
ceramic substrate
semiconductor element
optical semiconductor
upper lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984056693U
Other languages
Japanese (ja)
Inventor
成之 佐倉
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1984056693U priority Critical patent/JPS60169850U/en
Publication of JPS60169850U publication Critical patent/JPS60169850U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の光モジュールの一例を示す断面図、第２
図は本考案の一実施例を示す断面図、第３図から第５図
までは本考案の他の実施例を示す断面図である。 １０・・・セラミック基板、１１・・・光半導体素子、
１２・・・電気回路素子、１３・・・第１の上ぶた、１
６・・・第２の上ぶた、１９・・・電気配線部。Figure 1 is a cross-sectional view showing an example of a conventional optical module;
The figure is a cross-sectional view showing one embodiment of the present invention, and FIGS. 3 to 5 are cross-sectional views showing other embodiments of the present invention. 10... Ceramic substrate, 11... Optical semiconductor element,
12... Electric circuit element, 13... First upper lid, 1
6... Second upper lid, 19... Electrical wiring section.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）　　第１の主面とこの反対側にある第２の主面と
を有するセラミック基板と、前記第１の主面上に設けら
れた光半導体素子と、前記第２の主面上に設けられた電
気回路素子と、前記光半導体素子を覆うように前記セラ
ミック基板に設けられた透光部を有する第１の上ぶたと
、前記電気回路素子を覆うように前記セラミック基板に
設けられた第２の上ぶたと、前記セラミック基板を介し
て前記光半導体素子と前記電気回路素子とを接続する電
気配線部とを備えたことを特徴とする光モジュール。(1) A ceramic substrate having a first main surface and a second main surface opposite to the first main surface, an optical semiconductor element provided on the first main surface, and an optical semiconductor element provided on the second main surface. a first upper lid having a light-transmitting part provided on the ceramic substrate so as to cover the optical semiconductor element; and a first upper lid provided on the ceramic substrate so as to cover the electric circuit element; An optical module comprising: a second upper lid; and an electrical wiring section that connects the optical semiconductor element and the electric circuit element via the ceramic substrate. （２）　　前記光半導体素子が受光素子であり、前記セ
ラミックス基板は、第１及び第２のセラミック基板とこ
れらにはさまれている導電層とからなることを特徴とす
る実用新案登録請求の範囲第１項記載の光モジュール。(2) A utility model registration claim characterized in that the optical semiconductor element is a light receiving element, and the ceramic substrate is composed of first and second ceramic substrates and a conductive layer sandwiched therebetween. The optical module according to item 1.
JP1984056693U 1984-04-19 1984-04-19 optical module Pending JPS60169850U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984056693U JPS60169850U (en) 1984-04-19 1984-04-19 optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984056693U JPS60169850U (en) 1984-04-19 1984-04-19 optical module

Publications (1)

Publication Number Publication Date
JPS60169850U true JPS60169850U (en) 1985-11-11

Family

ID=30580534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984056693U Pending JPS60169850U (en) 1984-04-19 1984-04-19 optical module

Country Status (1)

Country Link
JP (1) JPS60169850U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281559A (en) * 1985-06-07 1986-12-11 Nippon Kogaku Kk <Nikon> Photodetector
WO2010098277A1 (en) * 2009-02-25 2010-09-02 住友電気工業株式会社 Optical semiconductor device
JP2019204890A (en) * 2018-05-24 2019-11-28 日本ルメンタム株式会社 Optical assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281559A (en) * 1985-06-07 1986-12-11 Nippon Kogaku Kk <Nikon> Photodetector
WO2010098277A1 (en) * 2009-02-25 2010-09-02 住友電気工業株式会社 Optical semiconductor device
JP2010199302A (en) * 2009-02-25 2010-09-09 Sumitomo Electric Ind Ltd Optical semiconductor device
JP2019204890A (en) * 2018-05-24 2019-11-28 日本ルメンタム株式会社 Optical assembly

Similar Documents

Publication Publication Date Title
JPS60169850U (en) optical module
JPS5858342U (en) hybrid integrated circuit
JPS6052639U (en) photovoltaic device
JPS58120662U (en) Chippukiyariya
JPS5853159U (en) Amorphous semiconductor device
JPS6037257U (en) photovoltaic element
JPS5929057U (en) Glass decorative body forming a solar cell
JPS60174244U (en) hybrid integrated circuit
JPS6012297U (en) thin film light emitting device
JPS6127302U (en) Tantalum thin film resistance wiring board
JPS6113957U (en) thin film solar cells
JPS6122365U (en) thin film capacitor
JPS59125834U (en) semiconductor equipment
JPS60169901U (en) Adhesive structure of microwave integrated circuit board
JPS58147278U (en) Hybrid integrated circuit device
JPS587337U (en) Hybrid integrated circuit device
JPS59101459U (en) Terminal structure of thick film wiring board
JPS60103853U (en) solar cell device
JPH01146548U (en)
JPS5952668U (en) hybrid integrated circuit
JPS611856U (en) optical reader
JPS58146372U (en) printed wiring board
JPS5967951U (en) GaAs single crystal electrode structure
JPS59146954U (en) Sealing structure of hybrid integrated circuit
JPS5987158U (en) semiconductor variable capacitance element