JPS611856U - optical reader - Google Patents
optical readerInfo
- Publication number
- JPS611856U JPS611856U JP8598684U JP8598684U JPS611856U JP S611856 U JPS611856 U JP S611856U JP 8598684 U JP8598684 U JP 8598684U JP 8598684 U JP8598684 U JP 8598684U JP S611856 U JPS611856 U JP S611856U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- reading device
- optical reading
- insulating substrate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は複数個−のイメージセンサチツプを有する光学
読み取り装置の見取り図、第２図は従来の構成の一部の
断面図、第３図は本考案による光学読み取り装置の構成
を示す断面図、第４図及び第５図は本考案による光学読
み取り装置の構成の一部を示す平面図である。
１・・・・・・基板、２・・・・・・イメージセンサチ
ップ、３・・・・・・接着剤、４，４ａ・・・・・・基
板上の配線、５，５′ａ ”””リード線、６．６ａ，
６ｂ，６ｃ，６ｄ・・・・・・基板表面の凹部、７，７
ａ・・・・・・アース線。FIG. 1 is a sketch of an optical reading device having a plurality of image sensor chips, FIG. 2 is a sectional view of a part of a conventional configuration, and FIG. 3 is a sectional view showing the configuration of an optical reading device according to the present invention. 4 and 5 are plan views showing a part of the structure of the optical reading device according to the present invention. 1...Substrate, 2...Image sensor chip, 3...Adhesive, 4, 4a...Wiring on board, 5, 5'a"""Lead wire, 6.6a,
6b, 6c, 6d... Concavities on the substrate surface, 7, 7
a... Earth wire.
Claims (2)
板上に接着するにあたり、それぞれの半導体チップの底
面の一部を絶縁基板に密着し、半導体チップの底面が接
する基板表面の一部に凹部を設け、この凹部に配置した
接着剤によつ− て、接着したことを特徴とする光学読
み取り装置。(1) When bonding multiple semiconductor chips onto an insulating substrate with a smooth surface, a part of the bottom surface of each semiconductor chip is tightly attached to the insulating substrate, and a recess is formed in the part of the substrate surface where the bottom surface of the semiconductor chip contacts. What is claimed is: 1. An optical reading device characterized in that an optical reading device is provided with a recess, and is bonded to the recess using an adhesive disposed in the recess.
基板上に配置したアース配線と接続していることを特徴
とする実用新案登録請求の範囲第１項記載の光学読み取
り装置。(2) The optical reading device according to claim 1, wherein the adhesive is electrically conductive, and the electrically conductive adhesive is connected to a ground wire disposed on an insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8598684U JPS611856U (en) | 1984-06-08 | 1984-06-08 | optical reader |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8598684U JPS611856U (en) | 1984-06-08 | 1984-06-08 | optical reader |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS611856U true JPS611856U (en) | 1986-01-08 |
Family
ID=30636873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8598684U Pending JPS611856U (en) | 1984-06-08 | 1984-06-08 | optical reader |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611856U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5384414A (en) * | 1976-12-29 | 1978-07-25 | Matsushita Electric Ind Co Ltd | Manufacture of solid state pickup device |
| JPS5544735A (en) * | 1978-09-25 | 1980-03-29 | Mitsubishi Electric Corp | Semiconductor laser device |
-
1984
- 1984-06-08 JP JP8598684U patent/JPS611856U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5384414A (en) * | 1976-12-29 | 1978-07-25 | Matsushita Electric Ind Co Ltd | Manufacture of solid state pickup device |
| JPS5544735A (en) * | 1978-09-25 | 1980-03-29 | Mitsubishi Electric Corp | Semiconductor laser device |
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