JPS60163751U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS60163751U
JPS60163751U JP4949584U JP4949584U JPS60163751U JP S60163751 U JPS60163751 U JP S60163751U JP 4949584 U JP4949584 U JP 4949584U JP 4949584 U JP4949584 U JP 4949584U JP S60163751 U JPS60163751 U JP S60163751U
Authority
JP
Japan
Prior art keywords
conductive layer
semiconductor device
package
semiconductor equipment
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4949584U
Other languages
Japanese (ja)
Inventor
和久 野島
豊 久保田
中矢　富夫
Original Assignee
スタンレー電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スタンレー電気株式会社 filed Critical スタンレー電気株式会社
Priority to JP4949584U priority Critical patent/JPS60163751U/en
Publication of JPS60163751U publication Critical patent/JPS60163751U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す斜視図、第２図及び第
３図はそれぞれ本考案の他の実施例を示　□す斜視図で
ある。 １・・・リード線、１ｅ・・・ＧＮＤピン、２・・・パ
ック　　　４、−ジ本体、３・・・導電層、３・・・Ｉ
Ｃの型式名などの゛抜き文字。FIG. 1 is a perspective view showing one embodiment of the present invention, and FIGS. 2 and 3 are perspective views showing other embodiments of the present invention, respectively. 1... Lead wire, 1e... GND pin, 2... Pack 4, -ji body, 3... Conductive layer, 3... I
Excluded characters in C model names, etc.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）　　ＤＩＰ型ＩＣのチップを囲むようにパッケー
ジに導電層を形成したごとを特徴とする半導体装置。(1) A semiconductor device characterized in that a conductive layer is formed in a package so as to surround a DIP type IC chip. （２）導電層をＧＮＤピンに接続した実用新案登録請求
の範囲第１項記載の半導体装置。(2) The semiconductor device according to claim 1, wherein the conductive layer is connected to the GND pin. （３）導電層をパッケージに接着した実用新案登録請求
の範囲第１項または第２項記載の半導体装置。(3) A semiconductor device according to claim 1 or 2 of the utility model registration claim, in which a conductive layer is bonded to a package. （４）導電層をパッケージの外面に接着し、これに型式
名などを抜き文字によって表記した実用新案登録請求の
範囲第１項または第２項記載の半導体装置。(4) The semiconductor device according to claim 1 or 2, wherein a conductive layer is adhered to the outer surface of the package, and a model name and the like are written on the conductive layer in cut-out letters.
JP4949584U 1984-04-04 1984-04-04 semiconductor equipment Pending JPS60163751U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4949584U JPS60163751U (en) 1984-04-04 1984-04-04 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4949584U JPS60163751U (en) 1984-04-04 1984-04-04 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS60163751U true JPS60163751U (en) 1985-10-30

Family

ID=30566754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4949584U Pending JPS60163751U (en) 1984-04-04 1984-04-04 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS60163751U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327096U (en) * 1986-08-06 1988-02-22
JPS6426899U (en) * 1987-08-07 1989-02-15
JP2019054216A (en) * 2017-09-19 2019-04-04 東芝メモリ株式会社 Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030478A (en) * 1973-07-17 1975-03-26
JPS58122759A (en) * 1982-01-14 1983-07-21 Fujitsu Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030478A (en) * 1973-07-17 1975-03-26
JPS58122759A (en) * 1982-01-14 1983-07-21 Fujitsu Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327096U (en) * 1986-08-06 1988-02-22
JPS6426899U (en) * 1987-08-07 1989-02-15
JP2019054216A (en) * 2017-09-19 2019-04-04 東芝メモリ株式会社 Semiconductor device

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