JPS6020153U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6020153U JPS6020153U JP11300383U JP11300383U JPS6020153U JP S6020153 U JPS6020153 U JP S6020153U JP 11300383 U JP11300383 U JP 11300383U JP 11300383 U JP11300383 U JP 11300383U JP S6020153 U JPS6020153 U JP S6020153U
- Authority
- JP
- Japan
- Prior art keywords
- pins
- sealing resin
- resin body
- semiconductor equipment
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のチップキャリア型半導体装置の斜視図、
第２図ａ、 ｂはそれぞれ本考案の一実施例の側面図
と下面図である。
１・・・・・・封止樹脂体、２・・・・・・先端が取付
面と平行するピン、３・・・・・・取付面と直交するピ
ン。Figure 1 is a perspective view of a conventional chip carrier type semiconductor device.
Figures 2a and 2b are a side view and a bottom view, respectively, of an embodiment of the present invention. 1...Sealing resin body, 2...Pin whose tip is parallel to the mounting surface, 3...Pin perpendicular to the mounting surface.
Claims (1)
樹脂体の外部に引出された多数のピンとを備えた樹脂封
止半導体装置において、前記多数のピンのうちの少くと
も１本のピンは前記封止樹脂体の取付面と直交するよう
に形成され、残りのピンはその先端接着部が前記取付面
と平行する形に形成されていることを特徴とする半導体
装置。In a resin-sealed semiconductor device comprising a sealing resin body in which a semiconductor element is housed and a large number of pins drawn out to the outside of the sealing resin body, at least one of the large number of pins A semiconductor device characterized in that the pins are formed so as to be perpendicular to the mounting surface of the sealing resin body, and the remaining pins are formed such that their tip bonded portions are parallel to the mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300383U JPS6020153U (en) | 1983-07-20 | 1983-07-20 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300383U JPS6020153U (en) | 1983-07-20 | 1983-07-20 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6020153U true JPS6020153U (en) | 1985-02-12 |
Family
ID=30261754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11300383U Pending JPS6020153U (en) | 1983-07-20 | 1983-07-20 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020153U (en) |
-
1983
- 1983-07-20 JP JP11300383U patent/JPS6020153U/en active Pending
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