JPS6127249U - integrated circuit package - Google Patents

integrated circuit package

Info

Publication number
JPS6127249U
JPS6127249U JP10804384U JP10804384U JPS6127249U JP S6127249 U JPS6127249 U JP S6127249U JP 10804384 U JP10804384 U JP 10804384U JP 10804384 U JP10804384 U JP 10804384U JP S6127249 U JPS6127249 U JP S6127249U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
package
exposed
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10804384U
Other languages
Japanese (ja)
Inventor
弘明 加藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10804384U priority Critical patent/JPS6127249U/en
Publication of JPS6127249U publication Critical patent/JPS6127249U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す斜視図である。 第2図は従来より用いられている集積回路パッケージの
斜視図である。 第3図は従来より用いられている他の集積回路パッケー
ジの斜視図である。 1・・・容器本体、2・・・外部引出しリード、3−・
・・外部引出しリード、11・・・容器本体、14・・
・外部引出しリード。
FIG. 1 is a perspective view showing an embodiment of the present invention. FIG. 2 is a perspective view of a conventional integrated circuit package. FIG. 3 is a perspective view of another conventionally used integrated circuit package. 1... Container body, 2... External drawer lead, 3-...
...External drawer lead, 11...Container body, 14...
・External drawer lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プラスチック封入された集積回路パッケージにおいて、
集積回路パッケージから外部へ導出すべき引出しリード
を、該パッケージの側面、上面および下面の3面に露出
して設けたことを特徴とする集積回路パッケージ。
In plastic encapsulated integrated circuit packages,
An integrated circuit package characterized in that lead leads to be led out from the integrated circuit package are exposed on three sides, a top surface, and a bottom surface of the package.
JP10804384U 1984-07-17 1984-07-17 integrated circuit package Pending JPS6127249U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10804384U JPS6127249U (en) 1984-07-17 1984-07-17 integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10804384U JPS6127249U (en) 1984-07-17 1984-07-17 integrated circuit package

Publications (1)

Publication Number Publication Date
JPS6127249U true JPS6127249U (en) 1986-02-18

Family

ID=30667260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10804384U Pending JPS6127249U (en) 1984-07-17 1984-07-17 integrated circuit package

Country Status (1)

Country Link
JP (1) JPS6127249U (en)

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