JPH0233426U - - Google Patents
Info
- Publication number
- JPH0233426U JPH0233426U JP11191888U JP11191888U JPH0233426U JP H0233426 U JPH0233426 U JP H0233426U JP 11191888 U JP11191888 U JP 11191888U JP 11191888 U JP11191888 U JP 11191888U JP H0233426 U JPH0233426 U JP H0233426U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal substrate
- oxide film
- insulating
- dielectric oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010408 film Substances 0.000 claims description 3
- 150000002391 heterocyclic compounds Chemical class 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図乃至第２図は本考案に係るチツプ型固体
電解コンデンサの構成を示す図で、第１図はその
断面図、第２図は固体電解コンデンサ素子Ｃと絶
縁基板の外観図、第３図は本考案に係るチツプ
型固体電解コンデンサをプリント基板に実装した
状態を示す側面図である。
図中、１……金属基板、２……絶縁帯層、３…
…誘電体酸化皮膜層、４……導電性の複素環式化
合物のポリマー薄膜層、５……導電体層、７，８
……金属板、９……絶縁板、１０……電極、１１
……電極、１２……プリント基板。
1 and 2 are diagrams showing the structure of a chip-type solid electrolytic capacitor according to the present invention, in which FIG. 1 is a sectional view thereof, FIG. 2 is an external view of a solid electrolytic capacitor element C and an insulating substrate, and FIG. The figure is a side view showing a chip type solid electrolytic capacitor according to the present invention mounted on a printed circuit board. In the figure, 1...metal substrate, 2...insulating band layer, 3...
... Dielectric oxide film layer, 4 ... Conductive heterocyclic compound polymer thin film layer, 5 ... Conductor layer, 7, 8
... Metal plate, 9 ... Insulating plate, 10 ... Electrode, 11
... Electrode, 12 ... Printed circuit board.
Claims (1)
所定位置に絶縁帯層を形成し、該金属基板の表面
を２つに区分し、該区分された一方の表面に誘電
体酸化皮膜層、導電性の複素環式化合物のポリマ
ー薄膜層、導電体層を順次形成し、前記金属基板
の前記絶縁帯層で区分された他方の両面に半田付
け可能な金属板を接合して固体コンデンサ素子を
構成し、該固体コンデンサ素子を絶縁基板上に接
合し一体化したことを特徴とするチツプ型固体電
解コンデンサ。 An insulating band layer is formed at a predetermined position of a metal substrate on which a dielectric oxide film can be formed, the surface of the metal substrate is divided into two, and a dielectric oxide film layer and a conductive layer are formed on one of the divided surfaces. A solid capacitor element is constructed by sequentially forming a polymer thin film layer of a heterocyclic compound and a conductive layer, and joining a solderable metal plate to the other surface of the metal substrate separated by the insulating band layer. A chip-type solid electrolytic capacitor, characterized in that the solid capacitor element is bonded and integrated onto an insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11191888U JPH0233426U (en) | 1988-08-25 | 1988-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11191888U JPH0233426U (en) | 1988-08-25 | 1988-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233426U true JPH0233426U (en) | 1990-03-02 |
Family
ID=31350391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11191888U Pending JPH0233426U (en) | 1988-08-25 | 1988-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233426U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02312219A (en) * | 1989-05-26 | 1990-12-27 | Nippon Chemicon Corp | Solid electrolytic capacitor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961116A (en) * | 1982-09-30 | 1984-04-07 | 富士通株式会社 | Method of producing chip type solid electrolytic condenser |
| JPS612315A (en) * | 1984-06-15 | 1986-01-08 | 日通工株式会社 | Solid electrolytic condenser |
-
1988
- 1988-08-25 JP JP11191888U patent/JPH0233426U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961116A (en) * | 1982-09-30 | 1984-04-07 | 富士通株式会社 | Method of producing chip type solid electrolytic condenser |
| JPS612315A (en) * | 1984-06-15 | 1986-01-08 | 日通工株式会社 | Solid electrolytic condenser |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02312219A (en) * | 1989-05-26 | 1990-12-27 | Nippon Chemicon Corp | Solid electrolytic capacitor |
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