JPH02116720U - - Google Patents
Info
- Publication number
- JPH02116720U JPH02116720U JP2573789U JP2573789U JPH02116720U JP H02116720 U JPH02116720 U JP H02116720U JP 2573789 U JP2573789 U JP 2573789U JP 2573789 U JP2573789 U JP 2573789U JP H02116720 U JPH02116720 U JP H02116720U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- nickel
- chip
- electronic component
- ceramic electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図は、本考案のチツプ状セラミツク電子部
品の実施例を示す一部切欠断面斜視図、第２図ａ
は、第１図の部分拡大図、第２図ｂは、本考案の
チツプ状セラミツク電子部品を基板に搭載した場
合、基板に撓みが生じた時の状態を示す部分拡大
図、第３図は、本考案によるチツプ状セラミツク
電子部品の性能を調べるガラスエポキシ撓み試験
用の基板を示す上面図、第４図は、前記を用いて
試験を実施している状態を示す平面図、第５図は
、チツプ状セラミツク電子部品の従来例を示す一
部切欠断面斜視図、第６図ａは、第５図の部分拡
大図、第６図ｂは、従来のチツプ状セラミツク電
子部品を基板に搭載した場合、基板に撓みが生じ
た時の状態を示す部分拡大図である。
１……第一層ニツケル電極、２……第二層銅層
、３……第三層ニツケル層、４……第四層半田層
、５，５′……内部電極、６，６′……外部電極
、７……導体、８……撓み試験用基板、９……支
点台、１１……セラミツク素体、ａ……チツプ状
セラミツク電子部品、ｂ……基板。
FIG. 1 is a partially cutaway sectional perspective view showing an embodiment of the chip-shaped ceramic electronic component of the present invention, and FIG.
is a partially enlarged view of Fig. 1, Fig. 2b is a partially enlarged view showing the state when the board is bent when the chip-shaped ceramic electronic component of the present invention is mounted on a board, and Fig. 3 is a partially enlarged view of the board. , a top view showing a substrate for a glass epoxy bending test to examine the performance of chip-shaped ceramic electronic components according to the present invention, FIG. , a partially cutaway perspective view showing a conventional example of a chip-shaped ceramic electronic component, FIG. 6 a is a partially enlarged view of FIG. 5, and FIG. 6 b shows a conventional chip-shaped ceramic electronic component mounted on a board. FIG. 3 is a partially enlarged view showing a state when the substrate is bent. DESCRIPTION OF SYMBOLS 1... First layer nickel electrode, 2... Second layer copper layer, 3... Third layer nickel layer, 4... Fourth layer solder layer, 5, 5'... Internal electrode, 6, 6'... . . . External electrode, 7 . . . Conductor, 8 . . . Deflection test substrate, 9 .
Claims (1)
なる接続用電極が形成されたチツプ状セラミツク
電子部品において、前記接続用電極が第一層にニ
ツケルもしくはニツケル合金、第二層に銅、第三
層にニツケルもしくはニツケル合金、第四層に錫
もしくは半田を順次積層したことを特徴とするチ
ツプ状セラミツク電子部品の電極。 In a chip-shaped ceramic electronic component in which a connection electrode consisting of multiple conductor layers is formed on the surface of a ceramic body, the connection electrode has a first layer of nickel or nickel alloy, a second layer of copper, and a third layer of nickel or nickel alloy. An electrode for a chip-shaped ceramic electronic component characterized by sequentially laminating nickel or nickel alloy as a layer and tin or solder as a fourth layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989025737U JPH0727622Y2 (en) | 1989-03-07 | 1989-03-07 | Chip-shaped ceramic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989025737U JPH0727622Y2 (en) | 1989-03-07 | 1989-03-07 | Chip-shaped ceramic electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02116720U true JPH02116720U (en) | 1990-09-19 |
| JPH0727622Y2 JPH0727622Y2 (en) | 1995-06-21 |
Family
ID=31246734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989025737U Expired - Lifetime JPH0727622Y2 (en) | 1989-03-07 | 1989-03-07 | Chip-shaped ceramic electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727622Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7808770B2 (en) | 2007-06-27 | 2010-10-05 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54157296A (en) * | 1978-06-02 | 1979-12-12 | Tdk Corp | Electrode structure and the manufacturing method |
| JPS5563817A (en) * | 1978-11-08 | 1980-05-14 | Tdk Electronics Co Ltd | Method of manufacturing laminated porcelain capacitor |
| JPS5885515A (en) * | 1981-11-17 | 1983-05-21 | 日本電気株式会社 | Chip-shaped condenser and method of producing same |
-
1989
- 1989-03-07 JP JP1989025737U patent/JPH0727622Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54157296A (en) * | 1978-06-02 | 1979-12-12 | Tdk Corp | Electrode structure and the manufacturing method |
| JPS5563817A (en) * | 1978-11-08 | 1980-05-14 | Tdk Electronics Co Ltd | Method of manufacturing laminated porcelain capacitor |
| JPS5885515A (en) * | 1981-11-17 | 1983-05-21 | 日本電気株式会社 | Chip-shaped condenser and method of producing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7808770B2 (en) | 2007-06-27 | 2010-10-05 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727622Y2 (en) | 1995-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |