JPS62118421U - - Google Patents
Info
- Publication number
- JPS62118421U JPS62118421U JP612786U JP612786U JPS62118421U JP S62118421 U JPS62118421 U JP S62118421U JP 612786 U JP612786 U JP 612786U JP 612786 U JP612786 U JP 612786U JP S62118421 U JPS62118421 U JP S62118421U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic capacitor
- layer ceramic
- electronic circuit
- electronic component
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003985 ceramic capacitor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000005336 cracking Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図ａは本考案の電子部品の一実施例を示す
斜視図、第１図ｂはその断面図、第２図は電子回
路を形成する前の積層セラミツクコンデンサの斜
視図、第３図は従来の電子部品の斜視図、第４図
は第３図及び第１図に示す電子部品の構造の応用
例の断面図、第５図ａ，ｂは第３図、第４図に示
した電子部品のプリント基板への実施例を示す断
面図である。
１……マルチ積層セラミツクコンデンサ本体、
２……積層セラミツクコンデンサの内部電極、３
……積層セラミツクコンデンサの外部電極、４…
…導体、５……抵抗、６……保護コート、７……
メツキ、８……ＩＣ本体、９……ＩＣリード端子
、１０……半田、１１……プリント基板、１２…
…プリント基板の導体箔、１３……接着剤、１４
……半田フイレツト。
FIG. 1a is a perspective view showing an embodiment of the electronic component of the present invention, FIG. 1b is a sectional view thereof, FIG. 2 is a perspective view of a multilayer ceramic capacitor before forming an electronic circuit, and FIG. A perspective view of a conventional electronic component, FIG. 4 is a sectional view of an application example of the electronic component structure shown in FIGS. 3 and 1, and FIGS. FIG. 3 is a cross-sectional view showing an example of mounting a component on a printed circuit board. 1...Multi-layer ceramic capacitor body,
2...Internal electrode of multilayer ceramic capacitor, 3
...External electrode of multilayer ceramic capacitor, 4...
...Conductor, 5...Resistance, 6...Protective coat, 7...
Plating, 8...IC body, 9...IC lead terminal, 10...Solder, 11...Printed circuit board, 12...
...Conductor foil for printed circuit board, 13...Adhesive, 14
...Solder fillet.
Claims (1)
法等により電子回路が形成され、かつ上記マルチ
積層セラミツクコンデンサの周囲端面に設けられ
その内部電極および上記電子回路の導体が接続さ
れる外部電極に銀クワレ防止用のメツキを設けた
ことを特徴とする電子部品。 An electronic circuit is formed on the multi-layer ceramic capacitor by a thick film printing method, etc., and the internal electrode and the external electrode to which the conductor of the electronic circuit is connected are provided on the peripheral end face of the multi-layer ceramic capacitor to prevent silver cracking. An electronic component characterized by having a plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP612786U JPS62118421U (en) | 1986-01-20 | 1986-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP612786U JPS62118421U (en) | 1986-01-20 | 1986-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118421U true JPS62118421U (en) | 1987-07-28 |
Family
ID=30788350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP612786U Pending JPS62118421U (en) | 1986-01-20 | 1986-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118421U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0846120A (en) * | 1995-08-09 | 1996-02-16 | Hitachi Ltd | Resin sealed semiconductor device and production thereof |
-
1986
- 1986-01-20 JP JP612786U patent/JPS62118421U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0846120A (en) * | 1995-08-09 | 1996-02-16 | Hitachi Ltd | Resin sealed semiconductor device and production thereof |
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