JPH0451103U - - Google Patents
Info
- Publication number
- JPH0451103U JPH0451103U JP9321390U JP9321390U JPH0451103U JP H0451103 U JPH0451103 U JP H0451103U JP 9321390 U JP9321390 U JP 9321390U JP 9321390 U JP9321390 U JP 9321390U JP H0451103 U JPH0451103 U JP H0451103U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- mount type
- type electronic
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案実施例の構造断面図、第2図は
第1図の電子部品をプリント配線板へ実装した状
態を表す部分拡大断面図、第3図、第4図はそれ
ぞれ第1図、第2図に対応する従来のリードマウ
ント形電子部品の構造断面図、および実装状態の
部分拡大断面図である。図において、
1……素子、2,3……リード線、4……樹脂
外装、5……プリント配線板、6……スルーホー
ル、7……半田層、P,Q……リード線の曲げ加
工部、W1,W2……リード線の間隔寸法、θ…
…リード線引出し部の曲げ角度。
Fig. 1 is a structural sectional view of an embodiment of the present invention, Fig. 2 is a partially enlarged sectional view showing the state in which the electronic components shown in Fig. 1 are mounted on a printed wiring board, and Figs. 3 and 4 are respectively similar to Fig. 1. , a structural cross-sectional view of a conventional lead-mount type electronic component corresponding to FIG. 2, and a partially enlarged cross-sectional view of the mounted state. In the figure, 1...Element, 2, 3...Lead wire, 4...Resin exterior, 5...Printed wiring board, 6...Through hole, 7...Solder layer, P, Q...Bending of lead wire Processed part, W1, W2... Lead wire spacing, θ...
...The bending angle of the lead wire pull-out part.
Claims (1)
を挟んでその両面電極より一対のリード線を同じ
方向に揃えて引出し、かつ素子の表面に樹脂外装
を被着してなるリードマウント形電子部品におい
て、樹脂外装から導出した前記リード線の根元部
を左右に曲げて八の字状に広げ、さらにその先方
箇所でリード線を再び平行に曲げて該部にスルー
ホール付きプリント配線板に対するスタンドオフ
を形成したことを特徴とするリードマウント形電
子部品。 2 請求項1に記載の電子部品において、樹脂外
装から引出したリード線の根元部の線間寸法を3
±1mm、先端部の線間寸法を5±1mm、八の字状
の曲げ角度を50°以下としたことを特徴とする
リードマウント形電子部品。 3 請求項1に記載の電子部品において、素子が
セラミツクサージアブソーバであることを特徴と
するリードマウント形電子部品。 4 請求項1に記載の電子部品において、素子が
セラミツクコンデンサであることを特徴とするリ
ードマウント形電子部品。[Scope of Claim for Utility Model Registration] 1. A disc-shaped element made of a ceramic sintered body is sandwiched between the electrodes on both sides of the element, and a pair of lead wires are drawn out in the same direction, and a resin sheath is applied to the surface of the element. In a lead mount type electronic component, the base of the lead wire led out from the resin sheath is bent left and right to spread it out in a figure eight shape, and then the lead wire is bent parallel again at the point beyond that point to form a through hole in that part. A lead mount type electronic component characterized by forming a standoff for a printed wiring board. 2. In the electronic component according to claim 1, the distance between the lead wires drawn out from the resin sheathing is 3.
A lead mount type electronic component characterized by ±1mm, a line-to-line dimension at the tip of 5±1mm, and a figure-of-eight bending angle of 50° or less. 3. The lead mount type electronic component according to claim 1, wherein the element is a ceramic surge absorber. 4. The lead-mount type electronic component according to claim 1, wherein the element is a ceramic capacitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9321390U JPH0451103U (en) | 1990-09-05 | 1990-09-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9321390U JPH0451103U (en) | 1990-09-05 | 1990-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0451103U true JPH0451103U (en) | 1992-04-30 |
Family
ID=31830243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9321390U Pending JPH0451103U (en) | 1990-09-05 | 1990-09-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0451103U (en) |
-
1990
- 1990-09-05 JP JP9321390U patent/JPH0451103U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0451103U (en) | ||
JPH0246035Y2 (en) | ||
JPH03106776U (en) | ||
JPH0260218U (en) | ||
JPS6228792Y2 (en) | ||
JPH0410709Y2 (en) | ||
JPS6120737Y2 (en) | ||
JPH0632670Y2 (en) | Chip type electrolytic capacitor | |
JPS6316478U (en) | ||
JPH02116720U (en) | ||
JPS605108U (en) | External multilayer ceramic capacitor | |
JPH0263521U (en) | ||
JPS6370187U (en) | ||
JPH0231067U (en) | ||
JPH01153626U (en) | ||
JPS6437020U (en) | ||
JPH0360086U (en) | ||
JPH01154621U (en) | ||
JPH0446529U (en) | ||
JPS63174427U (en) | ||
JPS6397224U (en) | ||
JPS62145323U (en) | ||
JPS59140423U (en) | Insulator exterior electronic components | |
JPS63188960U (en) | ||
JPS6190273U (en) |