JPH01154621U - - Google Patents
Info
- Publication number
- JPH01154621U JPH01154621U JP5122188U JP5122188U JPH01154621U JP H01154621 U JPH01154621 U JP H01154621U JP 5122188 U JP5122188 U JP 5122188U JP 5122188 U JP5122188 U JP 5122188U JP H01154621 U JPH01154621 U JP H01154621U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wires
- external electrodes
- main body
- component main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図と第２図は、本考案の各実施例を示す斜
視図、第３図ａ〜ｄは、本考案による放電ギヤツ
プ付電子部品の製造例を示す図面、第４図ａ〜ｄ
は、リード線の各種形状を示す図面である。
１…電子部品本体、３…外部電極、４…リード
線、５…リード線の放電部、６…リード線のリー
ド部、７…空隙、８…半田、９，１０，１１，１
２…屈曲部。
1 and 2 are perspective views showing each embodiment of the present invention, FIGS. 3 a to d are drawings showing an example of manufacturing an electronic component with a discharge gap according to the present invention, and FIGS. 4 a to d
2A and 2B are drawings showing various shapes of lead wires. DESCRIPTION OF SYMBOLS 1...Electronic component body, 3...External electrode, 4...Lead wire, 5...Discharge part of lead wire, 6...Lead part of lead wire, 7...Gap, 8...Solder, 9, 10, 11, 1
2...Bending part.
Claims (1)
、この外部電極３，３にリード線４，４を接続し
た電子部品において、リード線４，４の中間部を
前記外部電極３，３に導電固着し、両リード線４
，４の一端側を放電部５，５として電子部品本体
の側面側に配置し、空隙７を置いて同放電部５，
５の先端を対向させ、両リード線４，４の他端側
を、リード部６，６として前記電子部品本体１の
外部電極３，３から引きだしてなることを特徴と
する放電ギヤツプ付電子部品。 In an electronic component in which external electrodes 3, 3 are provided at both ends of an electronic component main body 1, and lead wires 4, 4 are connected to the external electrodes 3, 3, the intermediate portions of the lead wires 4, 4 are connected to the external electrodes 3, 3. Conductive and fixed, both lead wires 4
, 4 are disposed on the side surface of the electronic component main body as discharge parts 5, 5, and the same discharge parts 5,
An electronic component with a discharge gap, characterized in that the tips of the lead wires 4, 4 are made to face each other, and the other ends of both lead wires 4, 4 are drawn out from the external electrodes 3, 3 of the electronic component main body 1 as lead parts 6, 6. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5122188U JPH01154621U (en) | 1988-04-16 | 1988-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5122188U JPH01154621U (en) | 1988-04-16 | 1988-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154621U true JPH01154621U (en) | 1989-10-24 |
Family
ID=31277252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5122188U Pending JPH01154621U (en) | 1988-04-16 | 1988-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154621U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017063166A (en) * | 2015-09-26 | 2017-03-30 | 京セラ株式会社 | Multilayer capacitor and mounting structure therefor |
-
1988
- 1988-04-16 JP JP5122188U patent/JPH01154621U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017063166A (en) * | 2015-09-26 | 2017-03-30 | 京セラ株式会社 | Multilayer capacitor and mounting structure therefor |
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