JPH0263521U - - Google Patents
Info
- Publication number
- JPH0263521U JPH0263521U JP14354588U JP14354588U JPH0263521U JP H0263521 U JPH0263521 U JP H0263521U JP 14354588 U JP14354588 U JP 14354588U JP 14354588 U JP14354588 U JP 14354588U JP H0263521 U JPH0263521 U JP H0263521U
- Authority
- JP
- Japan
- Prior art keywords
- electrode lead
- electronic component
- insulating resin
- resin body
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案の第１の実施例の斜視図、第２
図ａ，ｂは第１図のチツプ状電子部品を配線板へ
実装した状態を示す側面図及び正面図、第３図は
本考案の第２の実施例の正面図、第４図は本考案
の第３の実施例の正面図、第５図は従来のチツプ
状電子部品の一例の断面図、第６図ａ，ｂは第５
図のチツプ状電子部品を配線板へ実装した状態を
示す側面図及び正面図、第７図は従来のチツプ状
電子部品の他の例の正面図である。
１…電子部品素子、２，３２…電極リード、２
ａ，３２ａ…予備はんだ、２ｂ，１２ｂ，２２ｂ
，３２ｂ，４２ｂ…電極リードの端子部、２ｃ…
電極リードの側面平行部、２ｄ，１２ｄ，２２ｄ
，４２ｄ…電極リードの空孔部、３…絶縁性樹脂
体、４，１４，２４，３４，４４…チツプ状電子
部品、５…配線板、６…回路パターン、７…実装
はんだ。
Fig. 1 is a perspective view of the first embodiment of the present invention;
Figures a and b are side and front views showing the state in which the chip-shaped electronic component of Figure 1 is mounted on a wiring board, Figure 3 is a front view of the second embodiment of the invention, and Figure 4 is the invention of the invention. FIG. 5 is a sectional view of an example of a conventional chip-shaped electronic component, and FIGS.
A side view and a front view showing the state in which the chip-shaped electronic component shown in the figure is mounted on a wiring board, and FIG. 7 is a front view of another example of the conventional chip-shaped electronic component. 1... Electronic component element, 2, 32... Electrode lead, 2
a, 32a...preliminary solder, 2b, 12b, 22b
, 32b, 42b...terminal part of electrode lead, 2c...
Side parallel parts of electrode leads, 2d, 12d, 22d
, 42d... Hole portion of electrode lead, 3... Insulating resin body, 4, 14, 24, 34, 44... Chip-shaped electronic component, 5... Wiring board, 6... Circuit pattern, 7... Mounting solder.
Claims (1)
して接続し、且つ、前記電子部品素子の周囲を絶
縁性樹脂体で包含し、前記絶縁性樹脂体より導出
してなる前記電極リードを折り曲げ、切断、成形
してなるチツプ状電子部品に於て、前記絶縁性樹
脂体より導出してなる前記電極リードに予備はん
だをほどこし、且つ、前記電極リードの前記絶縁
性樹脂体の側面と対向する電極リードの側面平行
部の一部に、空孔部を設け、更に、前記空孔部の
少なくとも一部が予備はんだで充填されているこ
とを特徴とするチツプ状電子部品。 Connecting a conductive plate metal as an electrode lead to an electronic component element, surrounding the electronic component element with an insulating resin body, and bending and cutting the electrode lead led out from the insulating resin body. , in a chip-shaped electronic component formed by molding, preliminary soldering is applied to the electrode lead led out from the insulating resin body, and the electrode lead faces a side surface of the insulating resin body of the electrode lead. A chip-shaped electronic component, characterized in that a hole is provided in a part of the parallel side surfaces of the chip, and further, at least a part of the hole is filled with preliminary solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14354588U JPH0263521U (en) | 1988-11-01 | 1988-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14354588U JPH0263521U (en) | 1988-11-01 | 1988-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263521U true JPH0263521U (en) | 1990-05-11 |
Family
ID=31410461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14354588U Pending JPH0263521U (en) | 1988-11-01 | 1988-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263521U (en) |
-
1988
- 1988-11-01 JP JP14354588U patent/JPH0263521U/ja active Pending