JPH0323962U - - Google Patents
Info
- Publication number
- JPH0323962U JPH0323962U JP8547189U JP8547189U JPH0323962U JP H0323962 U JPH0323962 U JP H0323962U JP 8547189 U JP8547189 U JP 8547189U JP 8547189 U JP8547189 U JP 8547189U JP H0323962 U JPH0323962 U JP H0323962U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- integrated circuit
- hybrid integrated
- mounting board
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図ａは本考案の実施例を示す断面図、同ｂ
はａの混成集積回路にメス形コネクタを接続した
状態を示す断面図、同ｃはａの混成集積回路をプ
リント基板に実装した状態を示す断面図、第２図
は従来例を示す斜視図である。
１……電気回路搭載基板、２……金属基板、３
……誘電体、４……金属導体、５……接続リード
、６……電気コネクター、７……プリント基板、
８……ハンダ、９……取り付け用リード。
Figure 1a is a sectional view showing an embodiment of the present invention, Figure 1b is a sectional view showing an embodiment of the present invention.
Fig. 2 is a sectional view showing a state in which a female connector is connected to the hybrid integrated circuit of a, Fig. 2c is a sectional view showing a state in which the hybrid integrated circuit of a is mounted on a printed circuit board, and Fig. 2 is a perspective view showing a conventional example. be. 1...Electric circuit mounting board, 2...Metal board, 3
...Dielectric material, 4 ... Metal conductor, 5 ... Connection lead, 6 ... Electrical connector, 7 ... Printed circuit board,
8...Solder, 9...Mounting lead.
Claims (1)
混成集積回路において、該金属基板に円形の穴を
穿ち、その穴に、金属導体が中心を貫通する誘電
体を充填し、該金属導体の一方を電気回路搭載基
板の入力又は出力端子と接続し、一方を金属基板
より突出させ、メス状の電気コネクターと接続で
きる形状を持たせることを特徴とする混成集積回
路。 In a hybrid integrated circuit in which an electric circuit mounting board is bonded to a metal substrate, a circular hole is bored in the metal substrate, the hole is filled with a dielectric material through which a metal conductor passes through the center, and one side of the metal conductor is 1. A hybrid integrated circuit, which is connected to an input or output terminal of an electric circuit mounting board, one of which protrudes from the metal substrate, and has a shape capable of being connected to a female electrical connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085471U JPH0726863Y2 (en) | 1989-07-19 | 1989-07-19 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085471U JPH0726863Y2 (en) | 1989-07-19 | 1989-07-19 | Hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0323962U true JPH0323962U (en) | 1991-03-12 |
| JPH0726863Y2 JPH0726863Y2 (en) | 1995-06-14 |
Family
ID=31634625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989085471U Expired - Lifetime JPH0726863Y2 (en) | 1989-07-19 | 1989-07-19 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726863Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6099572U (en) * | 1983-12-12 | 1985-07-06 | マスプロ電工株式会社 | electronic equipment |
| JPS62192684U (en) * | 1986-05-28 | 1987-12-08 |
-
1989
- 1989-07-19 JP JP1989085471U patent/JPH0726863Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6099572U (en) * | 1983-12-12 | 1985-07-06 | マスプロ電工株式会社 | electronic equipment |
| JPS62192684U (en) * | 1986-05-28 | 1987-12-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0726863Y2 (en) | 1995-06-14 |