JPH0726863Y2 - Hybrid integrated circuit - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a method of constructing a hybrid integrated circuit, and particularly relates to a GHz band (1
The present invention relates to a hybrid integrated circuit that can be used in a circuit that handles signals in the 0 ⁹ Hz band).

[Conventional technology]

Conventionally, in a hybrid integrated circuit, as shown in FIG. 2, the board 1 is connected to and mounted on a printed circuit board 7 or the like by using mounting leads 9 provided on the electric circuit mounting board 1.

[Problems to be solved by the device]

In the case of such a mounting method, the frequency band that the circuit on the board 1 can handle is up to several hundred MHz at most, and when used in the GHz band, for connection to the printed circuit board, for mounting at the connection part Due to the inductance component due to the lead 9, the electrical performance is greatly deteriorated, and the realization thereof is largely hindered. Also, in the characteristic measurement of the hybrid integrated circuit itself, the measurement was extremely difficult for the same reason.

[Means for Solving the Problems]

The present invention provides a hybrid integrated circuit which can be mounted on a printed circuit board without disturbing its characteristics even in the GHz band, and whose characteristics can be measured under the same conditions as when mounting.

According to the present invention, in a hybrid integrated circuit in which an electric circuit mounting board is adhered to a metal board, a circular hole is formed in the metal board, and the hole is filled with a dielectric material having a metal conductor penetrating the center thereof. A hybrid integrated circuit characterized in that one of the metal conductors is connected to an input or output terminal of an electric circuit mounting board, and one of the metal conductors is projected from the metal board to have a shape capable of being connected to a female electric connector. To be

〔Example〕

 Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 (a) is a cross-sectional view showing an embodiment of the present invention, and FIG. 1 (b) is a hybrid integrated circuit of an embodiment of the present invention to which a female connector designed with a characteristic impedance Zo is connected. In this state, it is possible to connect to a measuring instrument while maintaining the characteristic impedance Zo.

In the figure, an electric circuit mounting board 1 is attached to a metal board 2 for grounding and radiating heat of the board 1.
A circular hole is formed in the hole, a dielectric 3 having a metal conductor 4 penetrating the center thereof is filled in the hole, and one of the metal conductors 4 is connected to an input or output of an electric signal of the electric circuit mounting board 1. 5, and one of them is further projected from the metal substrate 2 so that it can be connected to the female electric connector 6. With this configuration, the metal conductor 4
The portion of the hole penetrating the metal substrate 2 by the dielectric 3 and the metal substrate 2 has the characteristic impedance Zo, and further, the electrical connector 6 having the characteristic impedance Zo.
By providing the metal conductor 4 with a tip shape that fits with, it becomes possible to easily connect to a measuring instrument or the like while maintaining the characteristic impedance Zo after fitting with the electrical connector. Of course, Zo is an amount determined by the dimensional relationship between the dielectric 3 and the metal conductor 4, and the connection lead 5 can be 1 mm or less, which can be neglected in terms of performance. Alternatively, the connection may be omitted and the direct connection lead may be omitted. By doing so, it is possible to provide a hybrid integrated circuit that can measure up to the GHz band without disturbing the characteristics and can be mounted.

FIG. 1 (c) shows a state of being mounted on a printed circuit board. In this case, the surplus portion of the metal conductor 4 is cut and then connected with solder 8.

[Effect of device]

As described above, according to the present invention, it is possible to connect to a printed circuit board without disturbing the characteristic even in the GHz band, and it is possible to measure the characteristic under the same conditions as when mounted on the printed circuit board.

[Brief description of drawings]

FIG. 1 (a) is a sectional view showing an embodiment of the present invention, and FIG. 1 (b).
2A is a cross-sectional view showing a state where a female connector is connected to the hybrid integrated circuit of FIG. 2A, FIG. 2C is a cross-sectional view showing a state of mounting the hybrid integrated circuit of FIG. It is a perspective view which shows an example. 1 ... Electrical circuit mounting board, 2 ... Metal board, 3 ... Dielectric material, 4 ... Metal conductor, 5 ... Connecting lead, 6 ... Electrical connector, 7 ... Printed board, 8 ... Solder, 9 ......
Mounting lead.

Claims (1)

[Scope of utility model registration request] 1. A hybrid integrated circuit in which an electric circuit mounting substrate is adhered to a metal substrate, wherein a circular hole is formed in the metal substrate, and the hole is filled with a dielectric material having a metal conductor passing through the center thereof. A hybrid integrated circuit characterized in that one of the metal conductors is connected to an input or output terminal of an electric circuit mounting board, and one of the metal conductors is projected from the metal board so as to have a shape capable of being connected to a female electric connector.