JPH07335995A - Electronic component and production process thereof - Google Patents

Abstract

PURPOSE:To provide an electronic element and production process thereof wherein the contact stability between an outer electrode and measuring terminal is improved and the outer electrode can be protected enough. CONSTITUTION:Strip lines 2 and 3 are formed on the surface of a dielectric board 1 having quarter- or semi-circular recesses la and 1b formed at the corners and side faces, outer electrodes 4 are formed on the inner faces of the recesses 1a and 1b, conductors 15 having flat side faces are charged in these recesses and cover the electrodes 4, and ground electrode 5 is formed on the back side of the board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency electronic component having an external electrode on its side surface and a method for manufacturing the same.

[0002]

2. Description of the Related Art As a conventional high-frequency electronic component, for example, a directional coupler is shown in FIG. In FIG. 3, reference numeral 1 denotes a dielectric substrate having a plurality of 1/4 circular concave portions 1a and semicircular concave portions 1b formed on its corners and side surfaces, and a strip line 2 is formed on the surface of the dielectric substrate 1. , 3 are formed so as to face each other, and both ends thereof are drawn out into the recesses 1 a and 1 b of the dielectric substrate 1. External electrodes 4 are formed on the inner surfaces of the recesses 1a and 1b, and four of them are connected to both ends of the strip lines 2 and 3.

On the other hand, the back surface of the dielectric substrate 1 is insulated from the external electrodes 4 connected to both ends of the strip lines 2 and 3 and is connected to the other external electrodes 4 to be connected to the ground electrode 5.
Are formed. Further, an insulating exterior resin (not shown) is attached to the front and back surfaces of the dielectric substrate 1 to protect the strip lines 2 and 3 and the ground electrode 5, thereby forming a directional coupler 6. This directional coupler 6
Is surface-mounted on a printed board (not shown), and the external electrodes 4 and electrode patterns (not shown) on the printed board are soldered.

Next, a method of manufacturing the directional coupler 6 is shown in FIG. Reference numeral 11 denotes a mother substrate having a surface area larger than that of the dielectric substrate 1, and a plurality of through holes 12 are formed on the cutting line 11a of the mother substrate 11. Then, the strip lines 2 and 3, the ground electrode 5, and the outer electrode 4 are formed on the inner wall of the through hole 12 on the front and back surfaces of the mother substrate 11 by plating using, for example, Cu or the like. afterwards,
The mother substrate 11 is cut along the cutting line 11a, the exterior resin is attached to the front and back surfaces of the dielectric substrate 1, and the directional coupler 6 with the external electrodes 4 exposed on the side surfaces is formed.

[0005]

However, when measuring the electrical characteristics of the conventional directional coupler 6 described above, as shown in FIG. 5, the external electrode 4 is made of a metal having a sharp tip on the side surface. The measurement is performed by pressing the measurement terminal 13. However, since the shape of the external electrode 4 is an arcuate depression along the concave portion 1b, the contact point between the external electrode 4 and the tip of the measuring terminal 13 differs from measurement to measurement and is not stable, and the characteristic impedance is different each time. Change. Therefore, accurate characteristics could not be obtained.

Further, in order to prevent defective conduction with the measuring terminal 13 at the time of characteristic measurement and defective soldering at the time of mounting on the printed circuit board due to oxidation of the external electrode 4, the surface of the external electrode 4 is oxidized by barrel plating or the like. In some cases, it is difficult to form a protective film made of metal, but it is difficult to form a sufficient protective film because the external electrode 4 is recessed.

The present invention has been made in order to solve such a problem, and improves the stability of contact between the external electrode and the measuring terminal and sufficiently protects the external electrode. And a method for manufacturing the same.

[0008]

To achieve the above object, in the present invention, an electronic component having a substrate having a recess on at least a side surface and an external electrode formed on the inner surface of the recess of the substrate is provided. A conductor covering the external electrode is filled in the recess, and a portion of the conductor located on a side surface of the substrate is formed in a flat shape.

Further, a step of forming a mother substrate, a step of forming a through hole in the mother substrate, a step of forming an electrode on a front surface or a back surface or inside of the mother substrate and an inner wall of the through hole, It is characterized by comprising a step of filling a conductor in the hole and a step of cutting the mother substrate through the conductor.

[0010]

According to the above construction, since the conductor is filled in the concave portion of the substrate so as to cover the external electrode and the portion of the conductor located on the measuring surface of the substrate is formed into a flat surface, the characteristic is measured. The contact between the conductor and the measurement terminal can always be made at a fixed position, and the contact stability is improved. Further, since the external electrode is covered with the conductor, the external electrode can be prevented from being oxidized.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component and a method of manufacturing the same according to the present invention will be described below with reference to the drawings. It should be noted that the same or corresponding parts as those of the conventional example are designated by the same reference numerals and the description thereof is omitted. The present invention is characterized in that the recessed portion of the substrate is filled with a conductor such as solder so as to cover the external electrode, and the portion of the conductor located on the measurement surface of the substrate is formed in a flat shape.

FIG. 1 shows a plan view of, for example, a directional coupler as an electronic component according to an embodiment of the present invention. As shown in FIG. 1, the conductors 15 such as solder are filled in the recesses 1 a and 1 b on the side surface of the dielectric substrate 1 so as to cover the external electrodes 4 and fill the conductors 15.
The directional coupler 16 is formed by forming the measurement surface of the above-mentioned surface flush with the side surface of the dielectric substrate 1. The characteristic is measured by bringing the measuring terminal 13 into contact with the side surface of the conductor 15.

The directional coupler 16 thus constructed is
Since the side surface of the conductor 15 which is electrically connected to the external electrode 4 is formed in a flat shape, the conductor 15 and the measuring terminal 13 can always be in contact with each other at a constant position during the characteristic measurement, and the contact stability is improved. . Further, since the outer electrode 4 is covered with the conductor 15, the outer electrode 4 can be prevented from being oxidized. Furthermore, conductor 1
When 5 is solder, the solderability to the printed board at the time of mounting is improved.

Next, FIG. 2 shows a method of manufacturing the directional coupler 16. As shown in FIG. 2, the cutting line 1 of the mother substrate 11
Through holes 12 are formed on 1a, and strip lines 2 and 3 and ground electrodes 5 are formed on the front and back surfaces of mother substrate 11, and external electrodes 4 are formed on the inner walls of through holes 12, for example, C
After forming by plating using u etc., through hole 1
2 is filled with a conductor 15 such as solder, and the cutting line 11a
The directional coupler 1 by cutting the mother substrate 11 with
6 can be formed.

In this method, the conductor 15 is filled in the through hole 12 in the state of the mother substrate 11, and the mother substrate 11 is cut through the conductor 15, so that the dielectric substrate 1 can be easily mass-produced. It is possible to fill the concave portions 1a and 1b with a conductor 15 such as solder, and form the side surface of the conductor 15 into a flat shape.

Although the present invention has been described by taking a directional coupler using a single-layer dielectric substrate as an example, a multi-layer dielectric substrate having electrodes formed therein may be used, and the applicable range is also increased. The invention is not limited to the directional coupler, but can be applied to various high-frequency electronic components such as filters and oscillators.

[0017]

As described above, according to the electronic component and the method of manufacturing the same of the present invention, the conductor covering the external electrode is filled in the concave portion of the dielectric substrate, and the conductor is provided on the side surface of the dielectric substrate. Since the portion located at is formed in a planar shape, the stability of contact between the conductor and the measurement terminal is improved during characteristic measurement, and the characteristic impedance does not change for each measurement, and accurate characteristic measurement is possible.

Further, by filling the conductor in the through-hole in the state of the mother substrate and cutting the mother substrate through the conductor, mass productivity is high and it is easy to protect the external electrode in the concave portion of the dielectric substrate. It is possible to fill a conductor also having the above-mentioned features and form a portion of the conductor located on the side surface of the dielectric substrate in a planar shape. Therefore, the surface of the external electrode can be sufficiently protected to prevent oxidation.

[Brief description of drawings]

FIG. 1A is a plan view and FIG. 1B is a bottom view of an electronic component according to an embodiment of the present invention.

FIG. 2 is a plan view of a mother substrate showing a method of manufacturing an electronic component according to an embodiment of the present invention.

FIG. 3A is a plan view of a conventional electronic component,
(B) is a bottom view.

FIG. 4 is a plan view of a mother substrate showing a conventional method of manufacturing an electronic component.

FIG. 5 is a partially enlarged plan view showing a conventional method for measuring the characteristic of an electronic component.

[Explanation of symbols]

 1 Dielectric Substrate 2, 3 Strip Line 4 External Electrode 5 Ground Electrode 5 12 Through Hole 15 Conductor 16 Directional Coupler

Claims (2)

[Claims] 1. A substrate having a concave portion on at least a side surface,
In an electronic component having an external electrode formed on an inner surface of the recess of the substrate, a conductor covering the external electrode is filled in the recess, and a portion of the conductor located on a side surface of the substrate is formed in a flat shape. Electronic parts characterized by the following. 2. A step of forming a mother substrate, a step of forming a through hole in the mother substrate, a step of forming an electrode on a front surface or a back surface or inside of the mother substrate and an inner wall of the through hole, and the through hole. A method of manufacturing an electronic component, comprising: a step of filling a hole with a conductor; and a step of cutting the mother substrate through the conductor.