JPS6077499A - Wiring structure of high frequency device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a wiring structure for a high frequency device, and more particularly to a wiring structure for a high frequency device used in a wireless device that is required to be smaller and lighter.

(bl Conventional technology and problems) Conventionally, wireless devices that require electromagnetic shielding generally have an independent shield case for each functional block, mount an individual wiring board in that case, and place components on the board. were installed to form functional circuits, and connections between each functional circuit and power supply wiring were made, but high-frequency signals were connected using transmission lines such as coaxial connectors and cables.

Therefore, the mounting of components and wiring configuration in each functional circuit are naturally restricted depending on where the signal input/output positions are provided.

In addition, signal connections and power supply must be made via connectors, communication terminals, or low-pass filter type terminals attached to the wall of the shield case to avoid electromagnetic interference between each circuit. Furthermore, depending on the connection position or connection method, component mounting and wiring patterns are subject to restrictions, and it may not be possible to create a configuration that maximizes the functionality of this circuit.

In addition, space is required for cable routing positions other than the original function, such as securing space for connecting and disconnecting connectors, and these are factors that hinder the miniaturization and weight reduction of wireless equipment and the automation of work. There was a problem that it had become.

(C1 Purpose of the Invention The present invention has been made in view of the above-mentioned problems of the prior art, and aims to provide a wiring structure for a high-frequency device that can reduce the size and weight of a wireless device and automate manufacturing operations. .

td) Structure of the Invention It is an object of the above invention to integrate the wiring pattern of each functional block and a conductive pattern surrounding the wiring pattern of a specific functional block on the surface of the shield lid. The bottom surface of the case consisting of a collection of shield plates for electromagnetic shielding of each of the functional blocks is connected to the conductive pattern, and a part of the conductive pattern is provided with a width that does not affect the effectiveness of the electromagnetic shield. A groove is provided, and a coaxial line is provided within the groove for supplying signals and power between each functional block and to each functional block.

This can be achieved by providing a wiring structure for a high-frequency device characterized in that lead-in wiring such as signal lines, power supply lines, etc. is constructed in a multilayer structure.

(el　Embodiments of the invention FIG. 1 is a diagram showing essential parts of an embodiment of the present invention.

In the figure, 1, 2.3 and 4 are functional circuit blocks, 5 is a shield lid, 6 is a case, 7 is a case lid,
8 indicates a conductive pattern.

In FIG. 1, on the upper surface of the shield lid 5 made of a metal conductor, a dielectric material made of a thick film material, such as a polymer type material highly filled with ceramic filler that hardens at a relatively low temperature, is placed. It is covered except for the portion where the conductive pattern 8 and the like are to be formed, and various wiring patterns are formed thereon. Chip components and the like are then mounted on these wiring patterns to provide necessary functions. As a result, the respective functional circuit blocks 1, 2, 3, and 4 are completed.

The case 6 is used to separately electromagnetically shield the functional circuit blocks 1, 2, 3, and 4, and is provided with a removable case lid 7.

Then, the fully bent part of the shield lid 5 and the shield case 6
In order to electrically connect the lower surface 61 of the shield ri5
For example, the functional blocks 1, 2, 3, . The above electromagnetic shielding is achieved by forming a conductive pattern 8 so as to include the wiring patterns 4 and 4, and connecting it to the lower surface 61 of the case having the same shape as the conductive pattern 8 by soldering. Is going.

FIG. 2 is a sectional view taken along the line AA in FIG. 1, ie, shows the wiring structure of the signal connection section 2I for connecting signals between the functional circuit blocks 1 and 2.

In the figure, 11 indicates a connection line conductor, and 12 indicates a dielectric.

In the figure, since the portion where the connecting line conductor 11 crosses the conductive pattern 8 is known in advance, that portion is not coated with the conductive paste, so that a groove is formed. Therefore, a dielectric 12 is coated in this groove to an appropriate thickness, and a connection line conductor 11 of lJ narrower than Ill of the groove is formed on the dielectric 12 with a copper base]. body 1
A triple play 1-transmission line is formed so as to wrap the connection line conductor 11 with the connection line conductor 11.

Furthermore, when connecting the power supply, by making the space I11''A between the connecting line conductor 11 and the shield lid 5 narrower than in the case of the signal connecting part 21, the connecting line conductor 11 and the seal 1' lid 5 can be connected. By combining the capacitance generated between the lines and the inductance exhibited by the connecting line conductor 11 itself, a low-pass filter (plow line) can be formed.

FIG. 3 shows a plane view taken along B-131lji of the figure.

In this figure, a coaxial line is formed in a dielectric 10 formed on a shield lid 5, and an external f115 lead-out line section 31 for connection with the outside is configured.

Similar to the formation of the conductive pattern 8, this portion is formed by covering both sides of the groove provided in the dielectric portion 10 with a conductive paste having a predetermined interior. Then, in the same way as the signal connection line 21 was formed between the conductive patterns on both sides, after coating the dielectric, the conductive pattern, and the dielectric, a conductive pattern was coated on the surface to form a coaxial line. It is connected to those on both sides to form a coaxial line.

FIG. 4 is a cross-sectional view taken along the line CC in FIG. 1, showing how the connection line conductor 11 is connected to the input/output line 41 inside the functional circuit block.

As shown in the figure, the connecting line conductor 11 has a length of 2M. That is, two connection line conductors 11 are formed on the dielectric 12 covered on the second side of the shield lid 5 via the dielectric 12, and the connection line conductors 11 on the upper surface are connected to the case 6 and the solder joint 9. Therefore, the connecting line conductor 11 on the lower surface
is shielded.

This shielded connection line conductor 11 is introduced into the functional block without being influenced by the outside.

ffl Reno Effects of the Invention According to the present invention as described above, the wiring board of each functional block is provided on a dielectric material coated on a conductive metal plate by a thick film printing method, and the wiring board of each functional block is formed on the lower surface of the shield case of each functional block. Each functional block is electromagnetically shielded as necessary by providing a conductive part that connects with the conductive metal plate in the contact area, and the connection between each functional block is made by wiring that partially passes through the conductive part. Produced using multilayer printing method.

This allows the shielding of each functional block and the free wiring between each functional block, making it possible to make the wireless device smaller and lighter, as well as automating work and reducing the number of manufacturing steps.

[Brief explanation of drawings]

FIG. 1 shows a main part of an embodiment of the present invention, FIG. 2 is a Wi-plane view of section A-A in FIG. 1, and FIG. 3 is a cross-sectional view of section B-B in FIG. 1. FIG. 4 shows a sectional view taken along the line CC in FIG. 1, respectively. In the figure, 1, 2.3, and 4 are functional circuit blocks, 5 is a shield lid, 6 is a case, 7 is a case lid, and 8 is a case lid.
9 represents a conductive pattern, 9 represents a soldered portion, 21 represents a signal connection portion, and 31 represents an external lead line portion. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] The wiring pattern of each functional block and the conductive pattern surrounding the wiring pattern of a specific functional block among the wiring patterns are integrated on the surface of the shield lid, and each specific functional block is electromagnetically shielded. The lower surface of the case, which is made up of an assembly of shield plates, is connected to the conductive pattern, and a lIJ groove that does not affect the electromagnetic shielding effect is provided in a part of the conductive pattern, and each function is inserted into the groove. A wiring structure for a high-frequency device characterized by a multilayer structure of lead-in wiring such as a coaxial line, a signal line, and a power line for supplying signals and power between blocks and to each functional block.