JPS63188960U - - Google Patents
Info
- Publication number
- JPS63188960U JPS63188960U JP7882287U JP7882287U JPS63188960U JP S63188960 U JPS63188960 U JP S63188960U JP 7882287 U JP7882287 U JP 7882287U JP 7882287 U JP7882287 U JP 7882287U JP S63188960 U JPS63188960 U JP S63188960U
- Authority
- JP
- Japan
- Prior art keywords
- circuit device
- lead terminal
- terminal plate
- connection
- electric circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａはこの考案の一実施例の回路装置の斜
視図、同図ｂはマザーボードにａを取付けた説明
図、同図ｃはこの考案によるマザーボード接続パ
ターン例、第２図ａ及びｂは従来技術例を示す回
路装置の斜視図、第３図及び第４図は従来の回路
装置をマザーボードに取付けた説明図で、それぞ
れ断面図、斜視図である。
１：電気回路装置、２：基板、３：部品実装面
、４：リード端子板、５：マザーボード基板、６
：リードそう入穴、７：はんだ付ランド、８：は
んだ。
FIG. 1a is a perspective view of a circuit device according to an embodiment of this invention, FIG. FIGS. 3 and 4 are perspective views of a circuit device showing an example of the prior art, and are explanatory views of a conventional circuit device attached to a motherboard, and are a sectional view and a perspective view, respectively. 1: Electric circuit device, 2: Board, 3: Component mounting surface, 4: Lead terminal board, 5: Motherboard board, 6
: Lead hole, 7: Soldering land, 8: Solder.
Claims (1)
板を具備した混成集積回路装置等の電気回路装置
において、前記電子回路装置は部品実装面と前記
リード端子板の方向が互いに直角で、かつ前記マ
ザーボード基板の接続面と前記リード端子板の板
厚の薄い面が互いに直角、又はある傾斜角を持つ
た構造であることを特徴とする電気回路装置。 In an electric circuit device such as a hybrid integrated circuit device that is provided with a lead terminal plate for connection to a motherboard substrate, the electronic circuit device has a component mounting surface and a direction of the lead terminal plate that are perpendicular to each other, and the connection of the motherboard substrate. An electric circuit device characterized in that the surface and the thinner surface of the lead terminal plate are perpendicular to each other or have a certain inclination angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882287U JPS63188960U (en) | 1987-05-27 | 1987-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882287U JPS63188960U (en) | 1987-05-27 | 1987-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63188960U true JPS63188960U (en) | 1988-12-05 |
Family
ID=30928118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7882287U Pending JPS63188960U (en) | 1987-05-27 | 1987-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63188960U (en) |
-
1987
- 1987-05-27 JP JP7882287U patent/JPS63188960U/ja active Pending
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