JPS59111062U - Printed board - Google Patents

Printed board

Info

Publication number
JPS59111062U
JPS59111062U JP452683U JP452683U JPS59111062U JP S59111062 U JPS59111062 U JP S59111062U JP 452683 U JP452683 U JP 452683U JP 452683 U JP452683 U JP 452683U JP S59111062 U JPS59111062 U JP S59111062U
Authority
JP
Japan
Prior art keywords
wiring pattern
printed board
component placement
placement surface
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP452683U
Other languages
Japanese (ja)
Inventor
英樹 内藤
Original Assignee
ジエコ−株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ジエコ−株式会社 filed Critical ジエコ−株式会社
Priority to JP452683U priority Critical patent/JPS59111062U/en
Publication of JPS59111062U publication Critical patent/JPS59111062U/en
Pending legal-status Critical Current

Links

Landscapes

  • Tests Of Electronic Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａ、　Ｂは夫々従来のプリント基板の一例の斜視
図、側面図、第２図は本考案になるプリント基板の一実
施例の平面図、第３図、第４図は第２図示のプリント基
板の一部の各側の断面図である。 １０・・・プリント基板、１１．１２・・・配線パター
ン、１３〜１６．１９．２０・・・貫通孔、１７゜１８
・・・分岐パターン、２１〜２４・・・導電材料。Figures 1A and 4 are respectively a perspective view and a side view of an example of a conventional printed circuit board, Figure 2 is a plan view of an embodiment of the printed circuit board of the present invention, and Figures 3 and 4 are illustrations of the second figure. FIG. 3 is a cross-sectional view of each side of a portion of the printed circuit board of FIG. 10...Printed circuit board, 11.12...Wiring pattern, 13-16.19.20...Through hole, 17°18
... Branch pattern, 21-24... Conductive material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半田ディツプ面及び部品配置面の夫々に配線パターンを
有するプリント基板において、該部品配置面の配線パタ
ーン内に貫通孔を設け、該部品配置面の配線パターンに
少なくとも該貫通孔より収出するよう導電材料を固着形
成してなるプリント基板。In a printed circuit board having a wiring pattern on each of a solder dip surface and a component placement surface, a through hole is provided in the wiring pattern on the component placement surface, and a conductive conductor is provided in the wiring pattern on the component placement surface so as to be drawn from at least the through hole. A printed circuit board made of fixedly formed materials.
JP452683U 1983-01-17 1983-01-17 Printed board Pending JPS59111062U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP452683U JPS59111062U (en) 1983-01-17 1983-01-17 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP452683U JPS59111062U (en) 1983-01-17 1983-01-17 Printed board

Publications (1)

Publication Number Publication Date
JPS59111062U true JPS59111062U (en) 1984-07-26

Family

ID=30136122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP452683U Pending JPS59111062U (en) 1983-01-17 1983-01-17 Printed board

Country Status (1)

Country Link
JP (1) JPS59111062U (en)

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