JPS6322665Y2 - - Google Patents
Info
- Publication number
- JPS6322665Y2 JPS6322665Y2 JP14025782U JP14025782U JPS6322665Y2 JP S6322665 Y2 JPS6322665 Y2 JP S6322665Y2 JP 14025782 U JP14025782 U JP 14025782U JP 14025782 U JP14025782 U JP 14025782U JP S6322665 Y2 JPS6322665 Y2 JP S6322665Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- external terminal
- electronic component
- terminal electrode
- shaped electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
【考案の詳細な説明】
本考案は、チツプ状電子部品に関するものであ
る。[Detailed Description of the Invention] The present invention relates to a chip-shaped electronic component.
従来、各種電子装置の電子部品として使用され
るチップコンデンサ、チップ抵抗、チツプインダ
クタ、LC複合チツプ、RC複合チツプ等のチツプ
状電子部品があり、これらチツプ状電子部品は、
一般に、添付図面の第１図に概略的に示すよう
に、コンデンサやインダクタ等の目的とする電気
回路素子を内部又は表面に有するセラミツク等の
絶縁基体１の両端に、その電気回路素子の両端に
それぞれ電気的に接続するようにして銀層等の外
部端子電極２を付与した構造をとつている。この
ようなチツプ状電子部品は、電子装置の電子部品
として使用されるときには、第２図に示すよう
に、プリント回路板３上の回路導体４Ａ及び４Ｂ
間に外部端子電極２をハンダ付けすることによ
り、その回路導体４Ａ及び４Ｂ間に電気的に接続
されると共に、プリント回路板３上に固定され
る。外部端子電極２と回路導体４Ａ及び４Ｂとの
間に付与されるハンダは、一般に、第２図にて参
照番号５にて示すような状態となり、外部端子電
極２の垂直端面全体からその垂直端面とほゞ等し
い回路導体４Ａ，４Ｂの表面積に亘つて付着す
る。従つて、外部端子電極２の垂直端面の面積が
大きい程、外部端子電極２と回路導体４Ａ，４Ｂ
との間に付着するハンダ量は多くなる。従来のチ
ツプ状電子部品の如く両端面の全体に亘つて外部
端子電極を形成するような構造では、電子部品の
厚みが厚い場合には、プリント回路板への取付け
の際の前述したようなハンダ量が多くなり過ぎて
しまい、そのようにハンダ量が多過ぎると、プリ
ント回路板に曲げ力等の外部変形力が加えられた
ときに、そのハンダ付け部に割れ等が生じ易く、
しばしば接続不良等の問題を生じていた。 Conventionally, there are chip-shaped electronic components such as chip capacitors, chip resistors, chip inductors, LC composite chips, and RC composite chips that are used as electronic components in various electronic devices.
Generally, as schematically shown in FIG. 1 of the accompanying drawings, an insulating substrate 1 made of ceramic or the like having a target electric circuit element such as a capacitor or an inductor inside or on its surface is attached at both ends of the electric circuit element. The structure is such that an external terminal electrode 2 such as a silver layer is provided so as to be electrically connected to each other. When such a chip-shaped electronic component is used as an electronic component of an electronic device, as shown in FIG.
By soldering the external terminal electrode 2 therebetween, the circuit conductors 4A and 4B are electrically connected and fixed on the printed circuit board 3. The solder applied between the external terminal electrode 2 and the circuit conductors 4A and 4B is generally in a state as shown by reference numeral 5 in FIG. The surface areas of the circuit conductors 4A and 4B are approximately equal to each other. Therefore, the larger the area of the vertical end surface of the external terminal electrode 2, the larger the area of the external terminal electrode 2 and the circuit conductors 4A, 4B.
The amount of solder that adheres between the two increases. In a structure in which external terminal electrodes are formed over the entirety of both end surfaces, such as in conventional chip-shaped electronic components, if the electronic component is thick, it is difficult to use the solder as described above when attaching it to a printed circuit board. If the amount of solder is too large, cracks are likely to occur in the soldered parts when external deformation force such as bending force is applied to the printed circuit board.
Problems such as poor connections often occurred.
本考案の目的は、このような従来の問題点を解
消しプリント回路板等への取付けを常に強固なも
のとすることができるようなチツプ状電子部品を
提供することである。 It is an object of the present invention to provide a chip-shaped electronic component which can solve these conventional problems and which can be firmly attached to a printed circuit board or the like at all times.
本考案によれば、外部端子電極を端面に有する
チツプ状電子部品において、前記外部端子電極の
プリント回路板へ載置接触させる側の一部端面を
残して、前記外部端子電極の表面をハンダの付き
にくいガラスにて被覆する。 According to the present invention, in a chip-shaped electronic component having an external terminal electrode on the end surface, the surface of the external terminal electrode is soldered with solder, leaving a part of the end surface of the external terminal electrode on the side that is placed in contact with the printed circuit board. Cover with non-stick glass.
次に、添付図面の第３図、第４図及び第５図に
基づいて本考案の実施例について本考案をより詳
細に説明する。 Next, the present invention will be described in more detail with reference to FIGS. 3, 4, and 5 of the accompanying drawings.
第３図は、本考案の一実施例としてのチツプ状
電子部品を斜視図にて概略的に示しており、この
実施例のチツプ状電子部品は、コンデンサ等の目
的とする電気回路素子を内部に有したセラミツク
基体１の両端に、銀層等の外部端子電極２を付与
したところまでは、前述の従来例のものと同様の
構造である。この実施例のチツプ状電子部品では
本考案によつて、更に、外部端子電極２の垂直端
面のほゞ上半分を覆うようにして、ほゞ上半部に
対してハンダの付きにくいガラス層からなる被覆
６が焼付けによつて施されている。第４図は、第
３図のチツプ状電子部品の断面を部分的に示して
いる。この被覆６を形成するガラスの種類は、ハ
ンダが付きにくいものであれば任意のものでよい
が、例えば、Zn系では、ZnO−B2O3−SiO2、
PbO系では、PbO−B2O3−SiO2等が好ましい。 FIG. 3 schematically shows a chip-shaped electronic component as an embodiment of the present invention in a perspective view. The structure is similar to that of the prior art example described above up to the point where external terminal electrodes 2 such as silver layers are provided on both ends of the ceramic substrate 1 having the structure. In accordance with the present invention, the chip-shaped electronic component of this embodiment further includes a glass layer that covers approximately the upper half of the vertical end surface of the external terminal electrode 2, and is made of a glass layer that is difficult to solder to approximately the upper half. A coating 6 is applied by baking. FIG. 4 shows a partial cross section of the chip-shaped electronic component shown in FIG. The type of glass that forms this coating 6 may be any type as long as it is difficult to solder, but for example, Zn-based glass includes ZnO-B 2 O 3 -SiO 2 ,
In the PbO type, PbO-B 2 O 3 -SiO 2 and the like are preferred.
前述の実施例では、チツプ状電子部品のほゞ上
半部全体に、ガラス被覆６を施したのであるが、
本考案はこれに限らず、外部端子電極２の垂直端
面の上半部にのみガラス被覆を施すだけでも効果
のあるものである。 In the above embodiment, the glass coating 6 was applied to almost the entire upper half of the chip-shaped electronic component.
The present invention is not limited to this, but it is also effective if only the upper half of the vertical end face of the external terminal electrode 2 is coated with glass.
本考案のチツプ状電子部品は、前述したような
構造であるので、第５図に示すように、プリント
回路板３の回路導体４Ａ及び４Ｂに外部端子電極
２をハンダ付けする場合、上半部のガラス被覆６
にはハンダが付かないので、参照番号５Ａで示す
如く極めて少量のハンダにて回路導体４Ａ，４Ｂ
と外部端子電極２とがハンダ付けされることにな
る。このようなハンダ量の少ないハンダ部５Ａ
は、プリント回路板３に曲げ力等が加えられて
も、それに応じて十分伸びることができ、従つ
て、ハンダ部に割れ等の生ずるおそれは全くなく
なり、結局、回路導体と外部端子電極との接続は
より強固なものとされる。 Since the chip-shaped electronic component of the present invention has the above-described structure, when the external terminal electrodes 2 are soldered to the circuit conductors 4A and 4B of the printed circuit board 3, as shown in FIG. glass coating 6
Since no solder is attached to the circuit conductors 4A and 4B, a very small amount of solder is used to connect the circuit conductors 4A and 4B as shown by reference number 5A.
and the external terminal electrode 2 are soldered. Such a solder portion 5A with a small amount of solder
Even if a bending force or the like is applied to the printed circuit board 3, the circuit board 3 can be sufficiently stretched in response to the bending force, and therefore there is no risk of cracking or the like occurring in the solder part, and as a result, the connection between the circuit conductor and the external terminal electrode is completely eliminated. The connection is made stronger.
第１図は従来のチツプ状電子部品の一例を示す
概略斜視図、第２図は第１図のチツプ状電子部品
をプリント回路板上へ取り付けた状態を示す図、
第３図は本考案の一実施例としてのチツプ状電子
部品の概略斜視図、第４図は第３図のチツプ状電
子部品の部分断面図、第５図は第３図のチツプ状
電子部品をプリント回路板上へ取り付け固定した
状態を示す図である。
１……セラミツク基体、２……外部端子電極、
３……プリント回路板、４Ａ，４Ｂ……回路導
体、５Ａ……ハンダ部、６……ガラス被覆。
FIG. 1 is a schematic perspective view showing an example of a conventional chip-shaped electronic component, and FIG. 2 is a diagram showing the chip-shaped electronic component of FIG. 1 mounted on a printed circuit board.
3 is a schematic perspective view of a chip-shaped electronic component as an embodiment of the present invention, FIG. 4 is a partial sectional view of the chip-shaped electronic component of FIG. 3, and FIG. 5 is a schematic perspective view of the chip-shaped electronic component of FIG. 3. FIG. 3 is a diagram showing a state in which the device is attached and fixed onto a printed circuit board. 1...Ceramic base, 2...External terminal electrode,
3...Printed circuit board, 4A, 4B...circuit conductor, 5A...solder part, 6...glass coating.
Claims (1)
において、前記外部端子電極のプリント回路板へ
載置接触させる側の一部端面を残して、前記外部
端子電極の表面をハンダの付きにくいガラスにて
被覆したことを特徴とするチツプ状電子部品。 In a chip-shaped electronic component having an external terminal electrode on an end surface, the surface of the external terminal electrode is covered with glass that is difficult to solder, except for a part of the end surface on the side where the external terminal electrode is placed in contact with a printed circuit board. A chip-shaped electronic component characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14025782U JPS5944029U (en) | 1982-09-16 | 1982-09-16 | Chip-shaped electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14025782U JPS5944029U (en) | 1982-09-16 | 1982-09-16 | Chip-shaped electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5944029U JPS5944029U (en) | 1984-03-23 |
| JPS6322665Y2 true JPS6322665Y2 (en) | 1988-06-22 |
Family
ID=30314092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14025782U Granted JPS5944029U (en) | 1982-09-16 | 1982-09-16 | Chip-shaped electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944029U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (en) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | Chip-type coil component |
-
1982
- 1982-09-16 JP JP14025782U patent/JPS5944029U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (en) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | Chip-type coil component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5944029U (en) | 1984-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100296848B1 (en) | Chip thermistor and method of adjusting same | |
| JPH0534094Y2 (en) | ||
| JPS6322665Y2 (en) | ||
| JPH0410709Y2 (en) | ||
| JPH0312446B2 (en) | ||
| JPH0115164Y2 (en) | ||
| KR100206621B1 (en) | Chip type thick film capacitor and method of making the same | |
| JP2528326B2 (en) | How to attach a capacitor to a circuit board | |
| JPH0546258Y2 (en) | ||
| JPH0562003U (en) | Chip type electronic parts | |
| JPH05283280A (en) | Chip-shaped laminated ceramic capacitor | |
| JPH04372101A (en) | Square-shaped chip resistor and its manufacture | |
| JPS6120787Y2 (en) | ||
| JPH0224264Y2 (en) | ||
| JPS5926614Y2 (en) | printed wiring board | |
| JPS6225873Y2 (en) | ||
| JPH0224263Y2 (en) | ||
| JPS6020915Y2 (en) | Axial lead type multilayer capacitor | |
| JPH069448Y2 (en) | Chip-shaped varistor | |
| JPH0142333Y2 (en) | ||
| JP3005615U (en) | Capacitor array | |
| JPS6130260Y2 (en) | ||
| JPS6233305Y2 (en) | ||
| JPH0410641Y2 (en) | ||
| JPH0414919Y2 (en) |